SA-WNT3 - Sony Audio Service Manual (repair manual)

2015H81-1

© 

2015.08

•  SA-WNT3 is the active subwoofer in HT-NT3.
•  All of the units included in the HT-NT3 (SA-WNT3/SA-

NT3) are required to confi rming operation of SA-WNT3. 
Check in advance that you have all of the units.

•  For the TEST MODE for this unit, refer to the service manual of HT-NT3.

POWER OUTPUT (reference)
 

134 W (per channel at 4 ohms, 80 Hz)

Speaker system
 Subwoofer 

system

 Bass 

refl ex

Speaker
 

160 mm (6 3/8 in) cone type

Power requirements
 

LA9 model only:

 

110 V – 240 V AC, 50/60 Hz

 

US, CND, TW models only:

 

120 V AC, 60 Hz

 

EA model only:

 

127 V – 240 V AC, 50/60 Hz

 

Except LA9, US, CND, TW, EA models:

 

220 V – 240 V AC, 50/60 Hz

Power consumption
 On: 

20 

W

 

Standby: 0.5 W or less

Dimensions (w/h/d) (approx.)
 

190 mm × 382 mm × 385 mm

 

(7 1/2 in × 15 1/8 in × 15 1/4 in)

Mass (approx.)
 

8 kg (17 lb 11oz)

Communication system
 

Wireless Sound Specifi cation version 3.0

Frequency band
 

US, CND, AEP, UK, AUS, EA*, E3*, AR models only: 5.2 GHz, 5.8 GHz

 

SP, TW, LA9 models only: 5.8 GHz

 

RU model only: 5.2 GHz

 

* 5.2 GHz or 5.8 GHz may not be available in some countries/regions.

Modulation method
 DSSS

Design and specifi cations are subject to change without notice.

  The compatible iPod/iPhone models are as follows. Update your iPod/iPhone with 
  the latest software before using with the system.
  BLUETOOTH technology works with:
 – iPhone
    iPhone 6 Plus/iPhone 6/iPhone 5s/iPhone 5c/iPhone 5/iPhone 4s/iPhone 4/
   iPhone 

3GS

 – iPod 

touch

    iPod touch (5th generation)/iPod touch (4th generation)

• 

All other trademarks are trademarks of their respective owners.

• 

Other system and product names are generally trademarks or registered trademarks 

  of the manufacturers. ™ and ® marks are not indicated in this document.

This product contains software that is subject to the GNU General Public License 
(“GPL”) or GNU Lesser General Public License (“LGPL”). These establish that 
customers have the right to acquire, modify, and redistribute the source code of said 
software in accordance with the terms of the GPL or the LGPL.

For details of the GPL, LGPL and other software licenses, please refer to [Software 
License Information] in [System Settings] of the [Setup] menu on the product.

The source code for the software used in this product is subject to the GPL and LGPL, 
and is available on the Web. To download, please access the following:
URL:
http://oss.sony.net/Products/Linux

Please note that Sony cannot answer or respond to any inquiries regarding the content 
of this source code.

• Abbreviation
 AR   

: 

Argentina 

model

 AUS  

: 

Australian 

model

  CND   : Canadian model
  E3 

 : 240V AC area in E model

  EA 

 : Saudi Arabia model

  LA9 

 : Latin-American model

  RU 

 : Russian model

  SP 

 : Singapore model

 TW   

: 

Taiwan 

model

• 

This system incorporates Dolby* Digital and the DTS** Digital Surround System.

  *  Manufactured under license from Dolby Laboratories. Dolby and the double-D 
    symbol are trademarks of Dolby Laboratories.
  ** For DTS patents, see
   http://patents.dts.com.
    Manufactured under license from DTS Licensing Limited. DTS, DTS-HD, the 
    Symbol, & DTS and the Symbol together are registered trademarks of DTS, 
    Inc. © DTS, Inc. All Rights Reserved.

• 

This system incorporates High-Defi nition Multimedia Interface (HDMI™) 

 technology.
  The terms HDMI and HDMI High-Defi nition Multimedia Interface, and the HDMI 
  Logo are trademarks or registered trademarks of HDMI Licensing LLC in the 
  United States and other countries.

• 

“BRAVIA” is a trademark of Sony Corporation.

• 

“PlayStation” is a registered trademark of Sony Computer Entertainment Inc.

• 

Wi-Fi

®

, Wi-Fi Protected Access

®

, Wi-Fi Alliance

®

 and Wi-Fi CERTIFIED

 Miracast

®

 are registered trademarks of Wi-Fi Alliance

®

.

• 

Wi-Fi CERTIFIED™, WPA™, WPA2™, Wi-Fi Protected Setup™ and Miracast™ 

  are trademarks of Wi-Fi Alliance

®

.

• 

The N Mark is a trademark or registered trademark of NFC Forum, Inc. in the 

  United States and in other countries.

• 

Android™ is a trademark of Google Inc.

• 

Google Play™ is a trademark of Google Inc.

• 

Google Cast™ is a trademark of Google Inc.

• 

Google Cast™ Ready and the Google Cast Ready badge are trademarks of Google 

 Inc.

• 

“Xperia” is a trademark of Sony Mobile Communications AB.

• 

The BLUETOOTH

®

 word mark and logos are registered trademarks owned by 

  Bluetooth SIG, Inc. and any use of such marks by Sony Corporation is under 
  license. Other trademarks and trade names are those of their respective owners.

• 

LDAC™ and LDAC logo are trademarks of Sony Corporation.

• 

“DSEE HX” is a trademark of Sony Corporation.

• 

MPEG Layer-3 audio coding technology and patents licensed from Fraunhofer IIS 

 and 

Thomson.

• 

Windows Media is either a registered trademark or trademark of Microsoft 

  Corporation in the United States and/or other countries.
  This product is protected by certain intellectual property rights of Microsoft 
  Corporation. Use or distribution of such technology outside of this product is 
  prohibited without a license from Microsoft or an authorized Microsoft subsidiary.

• 

Opera

®

 Devices SDK from Opera Software ASA. Copyright 1995-2013 Opera 

  Software ASA. All rights reserved.

• 

“ClearAudio+” is a trademark of Sony Corporation.

• 

“x.v.Colour” and “x.v.Colour” logo are trademarks of Sony Corporation.

• 

Apple, the Apple logo, iPhone, iPod, iPod touch, and Retina are trademarks of 

  Apple Inc., registered in the U.S. and other countries. App Store is a service mark of 
 Apple 

Inc.

  “Made for iPod,” and “Made for iPhone” mean that an electronic accessory has been 
  designed to connect specifi cally to iPod or iPhone, respectively, and has been 
 certifi ed by the developer to meet Apple performance standards. Apple is not 
  responsible for the operation of this device or its compliance with safety and 
  regulatory standards. Please note that the use of this accessory with iPod or iPhone 
  may affect wireless performance.

NOTES  ON  CHIP  COMPONENT  REPLACEMENT
• 

Never reuse a disconnected chip component.

• 

Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.

SAFETY  CHECK-OUT
After correcting the original service problem, perform the follow-
ing safety check before releasing the set to the customer:
Check the antenna terminals, metal trim, “metallized” knobs, 
screws, and all other exposed metal parts for AC leakage.
Check leakage as described below.

LEAKAGE  TEST
The AC leakage from any exposed metal part to earth ground and 
from all exposed metal parts to any exposed metal part having a 
return to chassis, must not exceed 0.5 mA (500 microamperes.). 
Leakage current can be measured by any one of three methods.
1.  A commercial leakage tester, such as the Simpson 229 or RCA 

WT-540A. Follow the manufacturers’ instructions to use these 
instruments.

2.  A battery-operated AC milliammeter. The Data Precision 245 

digital multimeter is suitable for this job.

3.  Measuring the voltage drop across a resistor by means of a 

VOM or battery-operated AC voltmeter. The “limit” indication 
is 0.75 V, so analog meters must have an accurate low-voltage 
scale. The Simpson 250 and Sanwa SH-63Trd are examples 
of a passive VOM that is suitable. Nearly all battery operated 
digital multimeters that have a 2 V AC range are suitable. (See 
Fig. A)

 .............................................  

4

2-1. Disassembly 

Flow 

...........................................................   6

2-2.  Rear Panel Section ..........................................................   6
2-3.  SUB KEY Board, RF Modulator (WS001), SUB MAIN 

Section ............................................................................   7

2-4.  SUB MAIN Board, Power Cord, Switching Regulator 

(3L405W) ........................................................................  

8

2-5.  Front Panel Section .........................................................   9
2-6.  Loudspeaker (16 cm)-081-11 ..........................................   10

 ..........................................   11

4-1. Block 

Diagram 

................................................................  12

4-2. Printed 

Wiring 

Board 

- SUB MAIN Board (Component Side) - .......................   14

4-3. Printed 

Wiring 

Board 

- SUB MAIN Board (Conductor Side) - .........................   15

4-4.  Schematic Diagram - SUB MAIN Board (1/3) - ............   16
4-5.  Schematic Diagram - SUB MAIN Board (2/3) - ............   17
4-6.  Schematic Diagram - SUB MAIN Board (3/3) - ............   18
4-7.  Printed Wiring Board - SUB KEY Board - .....................   19
4-8.  Schematic Diagram - SUB KEY Board -........................   19
4-9.  Printed Wiring Boards - SUB LED Boards - ..................   20
4-10.  Schematic Diagram - SUB LED Boards - ......................   20

5-1. Overall 

Section 

...............................................................  25

5-2.  SUB MAIN Section ........................................................   26
5-3.  Subwoofer Cabinet Section ............................................   27

 ..............................   28

0  OR  DOTTED  LINE  

0  ON  THE  SCHEMATIC  DIAGRAMS  AND  IN  

0  SUR  

UNLEADED  SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution:  Some printed circuit boards may not come printed with 

the lead free mark due to their particular size)

Unleaded solder has the following characteristics.
•  Unleaded solder melts at a temperature about 40 °C higher 

than ordinary solder.

 

Ordinary soldering irons can be used but the iron tip has to be 
applied to the solder joint for a slightly longer time.

 

Soldering irons using a temperature regulator should be set to 
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if 

the heated tip is applied for too long, so be careful!

• Strong 

viscosity

 

Unleaded solder is more viscous (sticky, less prone to fl ow) 
than ordinary solder so use caution not to let solder bridges 
occur such as on IC pins, etc.

• 

Usable with ordinary solder

 

It is best to use only unleaded solder but unleaded solder may 
also be added to ordinary solder.

ADVANCE  PREPARATION  WHEN  CONFIRMING  OP-
ERATION
All of the units included in the HT-NT3 (SA-WNT3/SA-NT3) are 
required to confi rming operation of SA-WNT3. Check in advance 
that you have all of the units.

NOTE  OF  PERFORMING  THE  OPERATION  CHECK  IN  
THE  STATE  THAT  HEAT  SINK  WAS  REMOVED
When performing the operation check in the state that this unit was 
disassembled, it is possible to perform the operation check in the 
state that heat sink was removed. But don’t perform the operation 
check in the long time, and perform the operation check in the 
volume state as low as possible.

NOTE  OF  REPLACING  THE  IC7400  ON  THE  SUB  
MAIN  BOARD
IC7400 on the SUB MAIN board cannot replace with single. When 
this part is damaged, replace the complete mounted board.

q Press the ÒÄÆ (on/standby) button to turn off the system. After the 

indicator disappears, disconnect the AC power cord (mains lead) 
then check that nothing is blocking the ventilation holes of the 
system.

BOARD
When IC7203 on the SUB MAIN board and the complete SUB 
MAIN board are replaced, it is necessary to spread the compound 
between the SUB MAIN board and the heat sink.
Spread the compound (THERMAL COMPOUND (G747)) refer-
ring to the fi gure below.

CAPACITOR  ELECTRICAL  DISCHARGE  PROCESSING 
When checking the board, for the electric shock prevention, con-
nect the resistors to both ends of respective capacitor (C201 or 
C207) to discharge the capacitor (C201 or C207).

:/2 W

:/2 W

BOND  FIXATION  OF  ELECTRIC  PARTS
When SWITCHING REGULATOR (3L405W) board or SUB 
MAIN board is replaced or the following object parts are replaced, 
it is necessary to fi x parts to the boards by using a specifi ed bond 
without fail.

• Object boards
SWITCHING REGULATOR (3L405W) board
Complete SUB MAIN board

SWITCHING 
REGULATOR 
(3L405W)

C101, C102, C103, C201, C207, C211, 
C402, C408, C461, C465, L101, L102, 
L401, NR101, R208, T201

SUB MAIN

C7230, C7233, C7234, L7202

Part No. 

 

Description

7-600-020-70 

ADHESIVE (SC608Z2) 180ML