SA-ID5000, SA-WID5, SS-CNID5, SS-FID5, SS-SRID5 - Sony Audio Service Manual (repair manual). Page 3

UNLEADED  SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution:  Some printed circuit boards may not come printed with 

the lead free mark due to their particular size)

Unleaded solder has the following characteristics.
•  Unleaded solder melts at a temperature about 40 °C higher 

than ordinary solder.

 

Ordinary soldering irons can be used but the iron tip has to be 
applied to the solder joint for a slightly longer time.

 

Soldering irons using a temperature regulator should be set to 
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if 

the heated tip is applied for too long, so be careful!

• Strong 

viscosity

 

Unleaded solder is more viscous (sticky, less prone to fl ow) 
than ordinary solder so use caution not to let solder bridges 
occur such as on IC pins, etc.

•  Usable with ordinary solder
 

It is best to use only unleaded solder but unleaded solder may 
also be added to ordinary solder.

ADVANCE  PREPARATION  WHEN  CONFIRMING  OP-
ERATION
When the operation of the subwoofer, front speaker, centre speaker 
or rear speaker are confi rmed, it is necessary to connect both these 
set.
Confi rm the subwoofer, front speaker, centre speaker and rear 
speaker are prepared beforehand when you repair.

• JIG
  When disassembling the set, use the following jig (for speaker 

removal).

  Part No. J-2501-238-A  JIG FOR SPEAKER REMOVAL

NOTE  THE  PARTS  ON  THE  AMP  BOARD  REPAIRING 
(SA-WID5)
When the IC4, IC5, IC6 and IC7 on the AMP board is damaged, 
exchange these parts.
When the mount parts other than IC4, IC5, IC6 and IC7 on the 
AMP board are damaged, exchange the AMP MOUNT.
Printed wiring board and schematic diagram have been described 
to this service manual is for the reference.
Refer to EXPLODED VIEW (page 11) for part No. of the IC4, 
IC5, IC6 and IC7.