Read Sony PHA-1A / PHA-1AEU Service Manual online
PHA-1A/1AEU
3
SECTION 1
SERVICING NOTES
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher
• Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong
viscosity
Unleaded solder is more viscous (sticky, less prone to fl ow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
•
Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
also be added to ordinary solder.
The SERVICING NOTES contains important information for servicing. Be sure to read this section before repairing the unit.
DESTINATION ABBREVIATIONS
The following abbreviations for model destinations are used in this
service manual.
The following abbreviations for model destinations are used in this
service manual.
• Abbreviations
AUS :
AUS :
Australian
model
CH
: Chinese model
CND : Canadian model
LA
LA
: Latin American model
RU
: Russian model
NOTE FOR PARTS REPAIR OF HP JACK AND VOLUME
BOARDS
When HP JACK and VOLUME boards installed in this unit are
defective, replace the complete mounted board or the whole parts
including the complete mounted board. The mounted parts on the
HP HACK and VOLUME boards cannot replace with single.
BOARDS
When HP JACK and VOLUME boards installed in this unit are
defective, replace the complete mounted board or the whole parts
including the complete mounted board. The mounted parts on the
HP HACK and VOLUME boards cannot replace with single.
NOTE FOR REPLACING THE MAIN BOARD OR CASE
When replacing the MAIN board or case, be sure to replace both
parts simultaneously. Among the repair parts, the MAIN board and
case are supplied as one unit.
When replacing the MAIN board or case, be sure to replace both
parts simultaneously. Among the repair parts, the MAIN board and
case are supplied as one unit.
NOTE FOR REPLACING THE ELECTRICAL PARTS
ON THE MAIN BOARD
The following parts on the MAIN board cannot replace with sin-
gle. When these parts are damaged, replace the complete mounted
board. (Q003, Q004: PHA-1AEU only)
ON THE MAIN BOARD
The following parts on the MAIN board cannot replace with sin-
gle. When these parts are damaged, replace the complete mounted
board. (Q003, Q004: PHA-1AEU only)
IC001, IC002, IC003, IC101, IC201, IC301, IC401, IC403, IC500,
IC501, IC502, IC503, IC505, IC506, IC507, IC601, IC602, IC701,
IC702, Q001, Q002, Q003, Q004
IC501, IC502, IC503, IC505, IC506, IC507, IC601, IC602, IC701,
IC702, Q001, Q002, Q003, Q004
NOTE OF REPLACING THE IC704 ON THE MAIN
BOARD
Replacement of IC704 on the MAIN board used in this unit re-
quires a special tool.
BOARD
Replacement of IC704 on the MAIN board used in this unit re-
quires a special tool.
Ver. 1.1
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