Read Sony PHA-1A / PHA-1AEU Service Manual online
PHA-1A/1AEU
PHA-1A/1AEU
10
10
For Schematic Diagrams.
Note:
• All capacitors are in
• All capacitors are in
μF unless otherwise noted. (p: pF) 50
WV or less are not indicated except for electrolytics and
tantalums.
tantalums.
• All resistors are in
Ω and 1/4 W or less unless otherwise
specifi ed.
• C : Panel designation.
THIS NOTE IS COMMON FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS.
(In addition to this, the necessary note is printed in each block.)
(In addition to this, the necessary note is printed in each block.)
• A : B+ Line.
• B : B– Line.
• Voltages and waveforms are dc with respect to ground
• B : B– Line.
• Voltages and waveforms are dc with respect to ground
under no-signal conditions.
no mark : POWER ON
• Voltages are taken with VOM (Input impedance 10 M
• Voltages are taken with VOM (Input impedance 10 M
).
Voltage variations may be noted due to normal production
tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal production
Voltage variations may be noted due to normal production
tolerances.
• Circled numbers refer to waveforms.
• Signal path.
F :
F :
AUDIO
(ANALOG)
J :
AUDIO
(DIGITAL)
E :
iPhone/iPad/iPod
j :
WALKMAN/Xperia
• The voltage and waveform of CSP (chip size package)
cannot be measured, because its lead layout is different
from that of conventional IC.
from that of conventional IC.
For Printed Wiring Boards.
Note:
• X : Parts extracted from the component side.
• Y : Parts extracted from the conductor side.
•
• X : Parts extracted from the component side.
• Y : Parts extracted from the conductor side.
•
: Pattern from the side which enables seeing.
(The other layers’ patterns are not indicated.)
• Waveforms
– MAIN Board –
Caution:
Pattern face side:
(Conductor Side)
Parts face side:
(Component Side)
Pattern face side:
(Conductor Side)
Parts face side:
(Component Side)
Parts on the pattern face side seen
from the pattern face are indicated.
Parts on the parts face side seen from
the parts face are indicated.
from the pattern face are indicated.
Parts on the parts face side seen from
the parts face are indicated.
• Lead layouts
surface
CSP (Chip Size Package)
Lead layout of conventional IC
* Replacement of IC704 on the MAIN board used in this unit
requires a special tool.
* Replacement of IC704 on the MAIN board used in this unit
requires a special tool.
Note:
When replacing the MAIN board, be sure to re-
place the case simultaneously. Among the repair
parts, the MAIN board and case are supplied as
one unit.
place the case simultaneously. Among the repair
parts, the MAIN board and case are supplied as
one unit.
Note:
When replacing the MAIN board, be sure to re-
place the case simultaneously. Among the repair
parts, the MAIN board and case are supplied as
one unit.
place the case simultaneously. Among the repair
parts, the MAIN board and case are supplied as
one unit.
5
IC500
6,7 (SW)
2 V/DIV, 500 ns/DIV
750 ns
8 Vp-p
6
IC501
9 (EXT)
1 V/DIV, 2
Ps/DIV
3.1
Ps
4.1 Vp-p
2
IC401
qk (MCLK_OUT)
1 V/DIV, 50 ns/DIV
59.5 ns
4.5 Vp-p
3
IC401
wj (BCLK_OUT)
1 V/DIV, 200 ns/DIV
470 ns
4 Vp-p
1
IC401
7 (CF2)
500 mV/DIV, 50 ns/DIV
83 ns
3 Vp-p
22.4
Ps
3.5 Vp-p
4
IC401
wk (LRCK_OUT)
1 V/DIV, 20
Ps/DIV
Note: The components identifi ed by mark 0 or
dotted line with mark 0 are critical for safety.
Replace only with part number specifi ed.
Note: Les composants identifi és par une marque
0 sont critiques pour la sécurité.
Ne les remplacer que par une piéce portant
le numéro spécifi é.
le numéro spécifi é.
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