Read Sony ICF-R45 / ICF-T45 Service Manual online
ICF-R45/T45
2
Specifications ............................................................................ 1
1. GENERAL
Locating the Controls ......................................................... 3
2. DISASSEMBLY
2-1. Cabinet (Front) ASSY ................................................ 4
2-2. Jack Board, Main Board (R45) ................................... 4
2-3. Jack Board, Main Board (T45) ................................... 5
2-2. Jack Board, Main Board (R45) ................................... 4
2-3. Jack Board, Main Board (T45) ................................... 5
3. ELECTRICAL ADJUSTMENS
............................... 6
4. DIAGRAMS
4-1. Printed Wiring Boards ................................................ 9
4-2. Schematic Diagram ................................................... 10
4-2. Schematic Diagram ................................................... 10
5. EXPLODED VIEWS
5-1. ICF-R45 ..................................................................... 11
5-2. ICF-T45 .................................................................... 12
5-2. ICF-T45 .................................................................... 12
6. ELECTRICAL PARTS LIST
................................... 13
TABLE OF CONTENTS
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
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UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the
lead-free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed
with the lead free mark due to their particular size.)
lead-free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed
with the lead free mark due to their particular size.)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40
• Unleaded solder melts at a temperature about 40
°C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to
be applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set
to about 350
Ordinary soldering irons can be used but the iron tip has to
be applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set
to about 350
°C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
the heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscous (sticky, less prone to
flow) than ordinary solder so use caution not to let solder
bridges occur such as on IC pins, etc.
flow) than ordinary solder so use caution not to let solder
bridges occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder
may also be added to ordinary solder.
may also be added to ordinary solder.
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