ICD-BM1, ICD-BM1PRO - Sony Audio Service Manual (repair manual). Page 2

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Index to Parts and Controls ..................................................... 3
Getting Started ......................................................................... 3
Basic Operations ...................................................................... 5
Editing Messages ..................................................................... 8
Formatting a “Memory Stick” ................................................. 9

2-1.   Knob (Rear) ....................................................................... 10
2-2.   Chassis Block Assy ........................................................... 11
2-3.   SW Board .......................................................................... 11
2-4.   Plate (MS) Section ............................................................ 12
2-5.   LCD Board ........................................................................ 12
2-6.   Chassis Section ................................................................. 13
2-7.   Memory Stick Connector .................................................. 13
2-8.   Main Board ....................................................................... 14

3-1.   IC Pin Descriptions ........................................................... 15
3-2.   Block Diagram – Main Section – ...................................... 21
3-3.   Block Diagram – LCD/SW Section – ............................... 22
3-4.   Printed Wiring Board – Main Section – ............................ 24
3-5.   Schematic Diagram – Main Section (1/3) – ...................... 25
3-6.   Schematic Diagram – Main Section (2/3) – ...................... 26
3-7.   Schematic Diagram – Main Section (3/3) – ...................... 27
3-8.   Schematic Diagram – LCD/SW Section – ........................ 28
3-9.   Printed Wiring Board – LCD Section – ............................ 29
3-10. Printed Wiring Board – SW Section – .............................. 30
3-11. IC Block Diagrams ............................................................ 31

4-1.   Main Section ..................................................................... 34
4-2.   Case Section ...................................................................... 35
4-3.   Ornament Section .............................................................. 36
4-4.   Chassis (1) Section ............................................................ 37
4-5.   Chassis (2) Section ............................................................ 38

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Notes on Chip Component Replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-

aged by heat.

Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)

Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40

°C higher than

ordinary solder.

Ordinary soldering irons can be used but the iron tip has to be

applied to the solder joint for a slightly longer time.

Soldering irons using a temperature regulator should be set to

about 350

°C.

Caution: The printed pattern (copper foil) may peel away if

the heated tip is applied for too long, so be careful!

• Strong viscosity

Unleaded solder is more viscous (sticky, less prone to flow)

than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.

• Usable with ordinary solder

It is best to use only unleaded solder but unleaded solder may

also be added to ordinary solder.

Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270°C during

repairing.

• Do not touch the soldering iron on the same conductor of the

circuit board (within 3 times).

• Be careful not to apply force on the conductor when soldering

or unsoldering.

* Replacement of IC601, IC702 used in this set requires a special

tool.

• The voltage and waveform of CSP (chip size package) cannot

be measured, because its lead layout is different from that of
conventional IC.

• Lead layouts

Lead layout of

conventional IC

surface

CSP (chip size package)