Read Sony HT-XT3 Service Manual online
HT-XT3
4
SECTION 1
SERVICING NOTES
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher
• Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong
viscosity
Unleaded solder is more viscous (sticky, less prone to fl ow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
also be added to ordinary solder.
NOTE OF PERFORMING THE OPERATION CHECK IN
THE STATE THAT HEAT SINK WAS REMOVED
When performing the operation check in the state that this unit was
disassembled, it is possible to perform the operation check in the
state that heat sink was removed. But don’t perform the operation
check in the long time, and perform the operation check in the
volume state as low as possible.
THE STATE THAT HEAT SINK WAS REMOVED
When performing the operation check in the state that this unit was
disassembled, it is possible to perform the operation check in the
state that heat sink was removed. But don’t perform the operation
check in the long time, and perform the operation check in the
volume state as low as possible.
NOTE OF REPLACING THE IC1600 ON THE TOUCH
BOARD
IC1600 on the TOUCH board cannot replace with single. When
this part is damaged, replace the complete mounted board.
BOARD
IC1600 on the TOUCH board cannot replace with single. When
this part is damaged, replace the complete mounted board.
NOTE OF REPLACING THE IC101, IC102, IC103,
IC301, IC302, IC303, IC410, IC3004 AND IC5010 ON
THE MB-1408 BOARD
IC101, IC102, IC103, IC301, IC302, IC303, IC410, IC3004 and
IC5010 on the MB-1408 board cannot replace with single. When
these parts are damaged, replace the complete mounted board.
IC301, IC302, IC303, IC410, IC3004 AND IC5010 ON
THE MB-1408 BOARD
IC101, IC102, IC103, IC301, IC302, IC303, IC410, IC3004 and
IC5010 on the MB-1408 board cannot replace with single. When
these parts are damaged, replace the complete mounted board.
NOTE OF REPLACING THE IC102 AND IC103 ON
THE MB-1408 BOARD
Replacement of IC102 and IC103 on the MB-1408 board used in
this unit requires a special tool.
THE MB-1408 BOARD
Replacement of IC102 and IC103 on the MB-1408 board used in
this unit requires a special tool.
“PRTECT (PROTECT)” APPEARS ON THE DISPLAY
OF THE BAR SPEAKER
c Press the }/1 (on/standby) button to turn off the system. After
OF THE BAR SPEAKER
c Press the }/1 (on/standby) button to turn off the system. After
the indicator disappears, disconnect the AC power cord (mains
lead) then check that nothing is blocking the ventilation holes of
the system.
lead) then check that nothing is blocking the ventilation holes of
the system.
CAPACITOR ELECTRICAL DISCHARGE PROCESSING
When checking the board, for the electric shock prevention, con-
nect the resistors to both ends of respective capacitor (C201 and
C207) to discharge the capacitor (C201 and C207).
When checking the board, for the electric shock prevention, con-
nect the resistors to both ends of respective capacitor (C201 and
C207) to discharge the capacitor (C201 and C207).
800
:/2 W
800
:/2 W
C201 C207
(Conductor Side) –
– SWITCHING REGULATOR (3L405W) Board
NOTE OF REPLACING THE IC6001 AND IC6004 ON
THE AMP BOARD AND THE COMPLETE AMP BOARD
When IC6001 and IC6004 on the AMP board and the complete
AMP board are replaced, it is necessary to spread the compound
between the AMP board and the heat sink.
Spread the compound (THERMAL COMPOUND (G747))
referring to the figure below.
THE AMP BOARD AND THE COMPLETE AMP BOARD
When IC6001 and IC6004 on the AMP board and the complete
AMP board are replaced, it is necessary to spread the compound
between the AMP board and the heat sink.
Spread the compound (THERMAL COMPOUND (G747))
referring to the figure below.
– AMP Board (Component Side) –
IC6004
IC6001
thermal compound (G747)
BOND FIXATION OF ELECTRIC PARTS
When SWITCHING REGULATOR (3L405W) board or MB-
1408 board or AMP board is replaced or the following object parts
are replaced, it is necessary to fi x parts to the boards by using a
specifi ed bond without fail.
When SWITCHING REGULATOR (3L405W) board or MB-
1408 board or AMP board is replaced or the following object parts
are replaced, it is necessary to fi x parts to the boards by using a
specifi ed bond without fail.
• Object boards
SWITCHING REGULATOR (3L405W) board
Complete MB-1408 board
Complete AMP board
SWITCHING REGULATOR (3L405W) board
Complete MB-1408 board
Complete AMP board
• Object parts
Board
Ref. No.
SWITCHING
REGULATOR
(3L405W)
REGULATOR
(3L405W)
C101, C102, C103, C201, C207, C211, C402,
L401, NR101, R208, T201
L401, NR101, R208, T201
MB-1408
CN707
AMP
C6104, C6108, C6109, L6001, L6007, L6008
• Use bond
Part No.
Description
7-600-020-70
ADHESIVE (SC608Z2) 180ML
• Parts position
1. SWITCHING REGULATOR (3L405W) board (page 5)
2. MB-1408 board (page 5)
3. AMP board (page 5)
2. MB-1408 board (page 5)
3. AMP board (page 5)
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