HT-XT3 - Sony Audio Service Manual (repair manual)

2015F80-1

© 

2015.06

Amplifi er section
US and Canadian models only:
POWER OUTPUT AND TOTAL HARMONIC
DISTORTION:
(FTC)
Front L + Front R:
 

 With 4 ohms loads, both channels driven, 
from 300 Hz – 20,000 Hz; rated 50 watts 
per channel minimum RMS power, with 
no more than 1% total harmonic distortion 
from 250 milliwatts to rated output.

POWER OUTPUT (reference)
Front L/Front R speaker:
 

115 W (per channel at 4 ohms, 1 kHz)

Subwoofer:
 

120 W (at 4 ohms, 80 Hz)

Other models:
POWER OUTPUT (rated)
Front L + Front R:
 

50 W + 50 W (at 4 ohms, 1 kHz, 1% THD)

POWER OUTPUT (reference)
Front L/Front R speaker:
 

115 W (per channel at 4 ohms, 1 kHz)

Subwoofer:
 

120 W (at 4 ohms, 80 Hz)

Inputs
 

HDMI IN 1*/2/3

 

TV (DIGITAL IN)

 ANALOG 

IN

Output
 

HDMI OUT* (ARC)

*  HDMI IN 1 and HDMI OUT jacks support 

HDCP 2.2 protocol. HDCP 2.2 is newly 
enhanced copyright protection technology that is 
used to protect content such as 4K movies.

HDMI section
Connector
 Type 

A 

(19pin)

 (USB) port:

 

 Type A (For connecting USB memory, 
memory card reader, and digital still 
camera)

LAN section
LAN (100) terminal
 100BASE-TX 

Terminal

Wireless LAN section
Standards Compliance
 

IEEE 802.11 a/b/g/n

Frequency band
 

2.4 GHz, 5 GHz

BLUETOOTH section
Communication system
 

BLUETOOTH Specifi cation version 3.0

Output
 BLUETOOTH 

Specifi cation Power

 Class 

1

Maximum communication range
 

Line of sight approx. 30 m (98.4 ft)

1)

Frequency band
 2.4 

GHz

Modulation method
 

FHSS (Freq Hopping Spread Spectrum)

Compatible BLUETOOTH profi les

2)

 

 A2DP 1.2 (Advanced Audio Distribution 
Profi le)

 

 AVRCP 1.5 (Audio Video Remote 
Control Profi le)

Supported Codecs

3)

 SBC

4)

, AAC, LDAC

Transmission range (A2DP)
 

 20 Hz – 20,000 Hz (Sampling frequency 
44.1 kHz, 48 kHz, 88.2 kHz, 96 kHz)

1)

 The actual range will vary depending on 
factors such as obstacles between devices, 
magnetic fi elds around a microwave oven, static 
electricity, cordless phone, reception sensitivity, 
antenna’s performance, operating system, 
software application, etc.

2)

 

 

BLUETOOTH standard profi les indicate the 
purpose of BLUETOOTH communication 
between devices.

3) 

Codec: Audio signal compression and 
conversion format

4)

Subband Codec

Front L/Front R speaker section
Speaker system
 

 2-way speaker system, Acoustic suspen-
sion

Speaker
 

 Woofer: 65 mm (2 5/8 in) cone type, 
magnetic fl uid speaker ×2

 

 Tweeter: 18 mm (23/32 in) dome type ×2

Subwoofer section
Speaker system
 Subwoofer 

system

 Bass 

refl ex

Speaker
 

110 mm (4 3/8 in) cone type ×2

General
Power requirements
 

US and Canadian models:

 120V 

AC, 

60Hz 

 Other 

models:

 

220V - 240V AC, 50/60 Hz 

Power consumption
 On: 

68 

W

 Standby:
  

0.3 

W

 

 

 5.5 W (Except US and Canadian 
models)

Dimensions (w/h/d) (approx.)
 

750 mm × 83 mm × 358 mm

 

 (29 5/8 in × 3 3/8 in × 14 1/8 in) incl. 
projecting parts

Mass (approx.)
 

10.5 kg (23 lb 3 oz)

Video formats supported by the system
Input/Output (HDMI Repeater block)

4096 × 2160p @ 59.94/60 Hz

*1

a

–

–

–

4096 × 2160p @ 50 Hz

*1

a

–

–

–

4096 × 2160p @ 23.98/24 Hz

*2

a

–

–

–

3840 × 2160p @ 59.94/60 Hz

*1

a

–

–

–

3840 × 2160p @ 50 Hz

*1

a

–

–

–

3840 × 2160p @ 29.97/30 Hz

*2

a

–

–

–

3840 × 2160p @ 25 Hz

*2

a

–

–

–

3840 × 2160p @ 23.98/24 Hz

*2

a

–

–

–

1920 × 1080p @ 59.94/60 Hz

a

–

a

a

1920 × 1080p @ 50 Hz

a

–

a

a

1920 × 1080p @ 29.97/30 Hz

a

a

a

a

1920 × 1080p @ 25 Hz

a

a

a

a

1920 × 1080p @ 23.98/24 Hz

a

a

a

a

1920 × 1080i @ 59.94/60 Hz

a

a

a

a

1920 × 1080i @ 50 Hz

a

a

a

a

1280 × 720p @ 59.94/60 Hz

a

a

a

a

1280 × 720p @ 50 Hz

a

a

a

a

1280 × 720p @ 29.97/30 Hz

a

a

a

a

1280 × 720p @ 23.98/24 Hz

a

a

a

a

720 × 480p @ 59.94/60 Hz

a

–

–

–

720 × 576p @ 50 Hz

a

–

–

–

640 × 480p @ 59.94/60 Hz

a

–

–

–

*1)

 YCbCr 4:2:0/Supported 8-bit only

*2)

 Supported 8-bit only

Supplied accessories
Remote control (1)
R03 (size AAA) batteries (2) 
High Speed HDMI cable (1) (EXCEPT AEP, UK)
Optical digital cable (1) (AEP, UK)

Design and specifi cations are subject to change without notice.

NOTES  ON  CHIP  COMPONENT  REPLACEMENT
• 

Never reuse a disconnected chip component.

• 

Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.

SAFETY  CHECK-OUT
After correcting the original service problem, perform the follow-
ing safety check before releasing the set to the customer:
Check the antenna terminals, metal trim, “metallized” knobs, 
screws, and all other exposed metal parts for AC leakage.
Check leakage as described below.

LEAKAGE  TEST
The AC leakage from any exposed metal part to earth ground and 
from all exposed metal parts to any exposed metal part having a 
return to chassis, must not exceed 0.5 mA (500 microamperes.). 
Leakage current can be measured by any one of three methods.
1.  A commercial leakage tester, such as the Simpson 229 or RCA 

WT-540A. Follow the manufacturers’ instructions to use these 
instruments.

2.  A battery-operated AC milliammeter. The Data Precision 245 

digital multimeter is suitable for this job.

3.  Measuring the voltage drop across a resistor by means of a 

VOM or battery-operated AC voltmeter. The “limit” indication 
is 0.75 V, so analog meters must have an accurate low-voltage 
scale. The Simpson 250 and Sanwa SH-63Trd are examples 
of a passive VOM that is suitable. Nearly all battery operated 
digital multimeters that have a 2 V AC range are suitable. (See 
Fig. A)

0  OR  DOTTED  LINE  

0  ON  THE  SCHEMATIC  DIAGRAMS  AND  IN  

0  SUR  

Copyrights and Trademarks
•  This system incorporates Dolby* Digital and the DTS** Digital Surround System.
 

*   Manufactured under license from Dolby Laboratories. Dolby and the double-D symbol are 

trademarks of Dolby Laboratories.

 

**  For DTS patents, see http://patents.dts.com.

Manufactured under license from DTS Licensing Limited. DTS, DTS-HD, the Symbol, 
& DTS and the Symbol together are registered trademarks of DTS, Inc. © DTS, Inc. All 
Rights Reserved.

•  This system incorporates High-Defi nition Multimedia Interface (HDMI™) technology.
 

The terms HDMI and HDMI High-Defi nition Multimedia Interface, and the HDMI Logo are 
trademarks or registered trademarks of HDMI Licensing LLC in the United States and other 
countries.

•  “BRAVIA” is a trademark of Sony Corporation.
•  “PlayStation” is a registered trademark of Sony Computer Entertainment Inc.
• Wi-Fi

®

, Wi-Fi Protected Access

®

, Wi-Fi Alliance

®

 and Wi-Fi CERTIFIED Miracast

®

 are 

registered trademarks of Wi-Fi Alliance

®

.

•  Wi-Fi CERTIFIED™, WPA™, WPA2™, Wi-Fi Protected Setup™ and Miracast™ are 

trademarks of Wi-Fi Alliance

®

.

•  The N Mark is a trademark or registered trademark of NFC Forum, Inc. in the United States and 

in other countries.

•  Android™ is a trademark of Google Inc.
•  Google Play™ is a trademark of Google Inc.
•  “Xperia” is a trademark of Sony Mobile Communications AB.
• The 

BLUETOOTH

®

 word mark and logos are registered trademarks owned by Bluetooth SIG, 

Inc. and any use of such marks by Sony Corporation is under license. Other trademarks and trade 
names are those of their respective owners.

•  LDAC™ and LDAC logo are trademarks of Sony Corporation.
•  “DSEE HX” is a trademark of Sony Corporation.
•  MPEG Layer-3 audio coding technology and patents licensed from Fraunhofer IIS and 

Thomson.

•  Windows Media is either a registered trademark or trademark of Microsoft Corporation in the 

United States and/or other countries.

 

This product is protected by certain intellectual property rights of Microsoft Corporation. Use 
or distribution of such technology outside of this product is prohibited without a license from 
Microsoft or an authorized Microsoft subsidiary.

• Opera

®

 Devices SDK from Opera Software ASA. Copyright 1995-2013 Opera Software ASA. 

All rights reserved.

•  “ClearAudio+” is a trademark of Sony Corporation.
•  “x.v.Color” and “x.v.Color” logo are trademarks of Sony Corporation.
•  Apple, the Apple logo, iPhone, iPod, iPod touch, and Retina are trademarks of Apple Inc., regis-

tered in the U.S. and other countries. App Store is a service mark of Apple Inc.

“Made for iPod,” and “Made for iPhone” mean that an electronic accessory has been designed to 
connect specifi cally to iPod or iPhone, respectively, and has been certifi ed by the developer to meet 
Apple performance standards. Apple is not responsible for the operation of this device or its compli-
ance with safety and regulatory standards. Please note that the use of this accessory with iPod or 
iPhone may affect wireless performance.

Compatible iPod/iPhone models
The compatible iPod/iPhone models are as follows. Update your iPod/iPhone with the latest soft-
ware before using with the system.
BLUETOOTH technology works with:
– iPhone
 

iPhone 6 Plus/iPhone 6/iPhone 5s/iPhone 5c/iPhone 5/iPhone 4s/iPhone 4/iPhone 3GS

– iPod 

touch

 

iPod touch (5th generation)/iPod touch (4th generation)

•  All other trademarks are trademarks of their respective owners.
•  Other system and product names are generally trademarks or registered trademarks of the 

manufacturers. ™ and ® marks are not indicated in this document.

Notice on GNU GPL/LGPL applied software and other Open Source Softwares
This product contains software that is subject to the GNU General Public License (“GPL”) or GNU 
Lesser General Public License (“LGPL”). These establish that customers have the right to acquire, 
modify, and redistribute the source code of said software in accordance with the terms of the GPL 
or the LGPL.

For details of the GPL, LGPL and other software licenses, please refer to [Software License 
Information] in [System Settings] of the [Setup] menu on the product.

The source code for the software used in this product is subject to the GPL and LGPL, and is avail-
able on the Web. To download, please access the following:
URL:
http://oss.sony.net/Products/Linux

Please note that Sony cannot answer or respond to any inquiries regarding the content of this source 
code.

 .............................................  

4

2-1. Disassembly 

Flow 

...........................................................   9

2-2.  Front Grill Section, Top Glass ........................................   10
2-3. TOUCH 

Board 

................................................................  11

2-4. AMP 

Section 

...................................................................  12

2-5.  How to Install AMP Section ...........................................   13
2-6. Power 

Cord 

.....................................................................  14

2-7. MB-1408 

Board 

..............................................................  15

2-8.  AMP Board, SWITCHING REGULATOR

(3L405W) ........................................................................   15

2-9.  Panel (L, R) .....................................................................   16
2-10.  FRONT SPK CABINET Section ....................................   17
2-11.  Loudspeaker (11CM) (Subwoofer) (SP1, SP2) ..............   18

 ............................................................   19

 ..........................................   25

5-1.  Block Diagram - DIGITAL Section -..............................   27
5-2.  Block Diagram - MEMORY Section - ............................   28
5-3.  Block Diagram - MAIN Section - ...................................   29
5-4.  Block Diagram - AMP Section - .....................................   30
5-5.  Block Diagram - POWER SUPPLY Section - ................   31
5-6. Printed 

Wiring 

Board 

 

- MB-1408 Board (Component Side) - ...........................   33

5-7. Printed 

Wiring 

Board 

 

- MB-1408 Board (Conductor Side) - .............................   34

5-8.  Schematic Diagram - MB-1408 Board (1/11) - ..............   35
5-9.  Schematic Diagram - MB-1408 Board (2/11) - ..............   36
5-10.  Schematic Diagram - MB-1408 Board (3/11) - ..............   37
5-11.  Schematic Diagram - MB-1408 Board (4/11) - ..............   38
5-12.  Schematic Diagram - MB-1408 Board (5/11) - ..............   39
5-13.  Schematic Diagram - MB-1408 Board (6/11) - ..............   40
5-14.  Schematic Diagram - MB-1408 Board (7/11) - ..............   41
5-15.  Schematic Diagram - MB-1408 Board (8/11) - ..............   42
5-16.  Schematic Diagram - MB-1408 Board (9/11) - ..............   43
5-17.  Schematic Diagram - MB-1408 Board (10/11) - ............   44
5-18.  Schematic Diagram - MB-1408 Board (11/11) - ............   45

5-19. Printed Wiring Board 
 

- AMP Board (Component Side) - ..................................   46

5-20. Printed Wiring Board 
 

- AMP Board (Conductor Side) - ....................................   47

5-21.  Schematic Diagram - AMP Board - ................................   48
5-22.  Printed Wiring Board - OLED CHUKEI Board - ...........   49
5-23.  Schematic Diagram - OLED CHUKEI Board - ..............   49
5-24.  Printed Wiring Board - TOUCH Board - ........................   50
5-25.  Schematic Diagram - TOUCH Board - ...........................   50
5-26.  Printed Wiring Board - USB Board - ..............................   51
5-27.  Schematic Diagram - USB Board - .................................   51

6-1.  Top Glass Section ...........................................................   78
6-2. Subwoofer 

Section 

..........................................................  79

6-3. Panel 

Section 

...................................................................  80

6-4. AMP 

Section 

...................................................................  81

 ..............................   82

Accessories are given in the last of the electrical parts list.

UNLEADED  SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution:  Some printed circuit boards may not come printed with 

the lead free mark due to their particular size)

Unleaded solder has the following characteristics.
•  Unleaded solder melts at a temperature about 40 °C higher 

than ordinary solder.

 

Ordinary soldering irons can be used but the iron tip has to be 
applied to the solder joint for a slightly longer time.

 

Soldering irons using a temperature regulator should be set to 
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if 

the heated tip is applied for too long, so be careful!

• Strong 

viscosity

 

Unleaded solder is more viscous (sticky, less prone to fl ow) 
than ordinary solder so use caution not to let solder bridges 
occur such as on IC pins, etc.

•  Usable with ordinary solder
 

It is best to use only unleaded solder but unleaded solder may 
also be added to ordinary solder.

NOTE  OF  PERFORMING  THE  OPERATION  CHECK  IN  
THE  STATE  THAT  HEAT  SINK  WAS  REMOVED
When performing the operation check in the state that this unit was 
disassembled, it is possible to perform the operation check in the 
state that heat sink was removed. But don’t perform the operation 
check in the long time, and perform the operation check in the 
volume state as low as possible.

NOTE  OF  REPLACING  THE  IC1600  ON  THE  TOUCH 
BOARD
IC1600 on the TOUCH board cannot replace with single. When 
this part is damaged, replace the complete mounted board.

NOTE  OF  REPLACING  THE  IC101,  IC102,  IC103,  
IC301,  IC302,  IC303,  IC410,  IC3004  AND  IC5010  ON  
THE  MB-1408  BOARD
IC101, IC102, IC103, IC301, IC302, IC303, IC410, IC3004 and 
IC5010 on the MB-1408 board cannot replace with single. When 
these parts are damaged, replace the complete mounted board.

NOTE  OF  REPLACING  THE  IC102  AND  IC103  ON  
THE  MB-1408  BOARD
Replacement of IC102 and IC103 on the MB-1408 board used in 
this unit requires a special tool.

“PRTECT  (PROTECT)”  APPEARS  ON  THE  DISPLAY  
OF  THE  BAR  SPEAKER
c  Press the }/1 (on/standby) button to turn off the system. After 

the indicator disappears, disconnect the AC power cord (mains 
lead) then check that nothing is blocking the ventilation holes of 
the system.

CAPACITOR  ELECTRICAL  DISCHARGE  PROCESSING 
When checking the board, for the electric shock prevention, con-
nect the resistors to both ends of respective capacitor (C201 and 
C207) to discharge the capacitor (C201 and C207).

:/2 W

:/2 W

NOTE  OF  REPLACING  THE  IC6001  AND  IC6004  ON  
THE  AMP  BOARD  AND  THE  COMPLETE  AMP  BOARD
When IC6001 and IC6004 on the AMP board and the complete 
AMP board are replaced, it is necessary to spread the compound 
between the AMP board and the heat sink.
Spread the compound (THERMAL COMPOUND (G747)) 
referring to the figure below.

BOND  FIXATION  OF  ELECTRIC  PARTS
When SWITCHING REGULATOR (3L405W) board or MB-
1408 board or AMP board is replaced or the following object parts 
are replaced, it is necessary to fi x parts to the boards by using a 
specifi ed bond without fail.

• Object boards
SWITCHING REGULATOR (3L405W) board 
Complete MB-1408 board 
Complete AMP board

SWITCHING 
REGULATOR 
(3L405W)

C101, C102, C103, C201, C207, C211, C402, 
L401, NR101, R208, T201

MB-1408

CN707

AMP

C6104, C6108, C6109, L6001, L6007, L6008

Part No.

   

Description

7-600-020-70 

ADHESIVE (SC608Z2) 180ML

1. SWITCHING REGULATOR (3L405W) board (page 5)
2. MB-1408 board (page 5)
3. AMP board (page 5)