Read Sony HCD-ZX10 / MHC-ZX10 Service Manual online
3
This appliance is classified as a CLASS 1 LASER product. The
CLASS 1 LASER PRODUCT MARKING is located on the rear
exterior.
CLASS 1 LASER PRODUCT MARKING is located on the rear
exterior.
Laser component in this product is capable
of emitting radiation exceeding the limit for
Class 1.
of emitting radiation exceeding the limit for
Class 1.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radiation
exposure.
other than those specified herein may result in hazardous radiation
exposure.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
• Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of soldering iron around 270˚C
during repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
BLOCK OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
MODEL IDENTIFICATION
— BACK PANEL —
TABLE OF CONTENTS
1. GENERAL
·········································································· 4
2. DISASSEMBLY
2-1.
Case ···················································································· 7
2-2.
Front Panel Section ···························································· 7
2-3.
Tape Mechanism Deck Section (TCM-230AWR12) ·········· 8
2-4.
Back Panel Section ····························································· 8
2-5.
Main Board, Front AMP Board ·········································· 9
2-6.
CD Base Unit (BU-K2BD38) ············································· 9
2-7.
CD Mechanism Deck Section (CDM53F-K2BD38) ········ 10
2-8.
Fitting Base (Guide) Assy, Bracket (Chassis) and
Fitting Base (Magnet) Assy ·············································· 10
Fitting Base (Magnet) Assy ·············································· 10
2-9.
Tray (Sub) ········································································· 11
2-10. Chassis (Mold B) Section, Stocker Section and
Slider (Selection) ······························································ 11
2-11. Gears Installation ······························································ 12
2-12. Slider (Selection) Installation ··········································· 12
2-13. Stocker Section Installation ·············································· 13
2-14. Chassis (Mold B) Section Installation ······························ 13
2-12. Slider (Selection) Installation ··········································· 12
2-13. Stocker Section Installation ·············································· 13
2-14. Chassis (Mold B) Section Installation ······························ 13
3. TEST MODE
···································································· 14
4. MECHANICAL ADJUSTMENTS
····························· 18
5. ELECTRICAL ADJUSTMENTS
······························· 18
6. DIAGRAMS
6-1.
Circuit Board Location ····················································· 23
6-2.
Block Diagrams ································································ 24
6-3.
Printed Wiring Board – BD Section – ······························ 28
6-4.
Schematic Diagram – BD Section – ································· 29
6-5.
Printed Wiring Board – Deck Section – ··························· 30
6-6.
Schematic Diagram – Deck Section – ······························ 31
6-7.
Printed Wiring Board – Main Section – ··························· 32
6-8.
Schematic Diagram – Main (1/3) Section – ····················· 33
6-9.
Schematic Diagram – Main (2/3) Section – ····················· 34
6-10. Schematic Diagram – Main (3/3) Section – ····················· 35
6-11. Printed Wiring Board – AMP Section – ··························· 36
6-12. Schematic Diagram – AMP Section – ······························ 37
6-13. Printed Wiring Board – Panel Section – ··························· 38
6-14. Schematic Diagram – Panel Section – ····························· 39
6-15. Printed Wiring Board – Switch Section – ······················· 40
6-16. Schematic Diagram – Switch Section – ··························· 41
6-17. Printed Wiring Board – CD Mechanism Section – ·········· 42
6-18. Schematic Diagram – CD Mechanism Section – ············· 43
6-19. Printed Wiring Board – Power Supply Section – ············· 44
6-20. Schematic Diagram – Power Supply Section – ················ 45
6-21. Printed Wiring Board – Leaf SW Section – ····················· 46
6-22. Schematic Diagram – Leaf SW Section – ························ 46
6-23. IC Block Diagrams ··························································· 47
6-24. IC Pin Descriptions ·························································· 50
6-11. Printed Wiring Board – AMP Section – ··························· 36
6-12. Schematic Diagram – AMP Section – ······························ 37
6-13. Printed Wiring Board – Panel Section – ··························· 38
6-14. Schematic Diagram – Panel Section – ····························· 39
6-15. Printed Wiring Board – Switch Section – ······················· 40
6-16. Schematic Diagram – Switch Section – ··························· 41
6-17. Printed Wiring Board – CD Mechanism Section – ·········· 42
6-18. Schematic Diagram – CD Mechanism Section – ············· 43
6-19. Printed Wiring Board – Power Supply Section – ············· 44
6-20. Schematic Diagram – Power Supply Section – ················ 45
6-21. Printed Wiring Board – Leaf SW Section – ····················· 46
6-22. Schematic Diagram – Leaf SW Section – ························ 46
6-23. IC Block Diagrams ··························································· 47
6-24. IC Pin Descriptions ·························································· 50
7. EXPLODED VIEWS
7-1.
Back Panel Section ··························································· 54
7-2.
Front Panel Section ·························································· 55
7-3.
Chassis Section ································································· 56
7-4.
CD Mechanism Deck Section-1 (CDM53F-K2BD38) ···· 57
7-5.
CD Mechanism Deck Section-2 (CDM53F-K2BD38) ···· 58
7-6.
Base Unit Section (BU-K2BD38A) ································· 59
7-7.
Tape Mechanism Deck Section-1 (TCM-230AWR12) ···· 60
7-8.
Tape Mechanism Deck Section-2 (TCM-230AWR12) ···· 61
8. ELECTRICAL PARTS LIST
······································· 63
• Abbreviation
CND : Canadian model
AED
AED
: North European model
G
: German model
Parts No.
MODEL
US model
CND model
AEP, G, AED, UK, CIS models
PARTS No.
4-226-747-0
s
4-226-747-1
s
4-226-747-2
s
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