HCD-VZ10 - Sony Audio Service Manual (repair manual). Page 3

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3
MODEL IDENTIFICATION
— BACK PANEL —
TABLE OF CONTENTS
1. SERVICE NOTE
······························································· 4
2. GENERAL
·········································································· 5
3. DISASSEMBLY
3-1.
Case ···················································································· 8
3-2.
Front Panel Section ···························································· 8
3-3.
Tape Mechanism Deck Section (TCM-230AWR12) and
MIC Board ·········································································· 9
3-4.
Back Panel Section ····························································· 9
3-5.
Main Board, Front AMP Board ········································ 10
3-6.
CD Base Unit (BU-K2BD37A) ········································ 10
3-7.
CD Mechanism Deck Section (CDM53F-K2BD37A) ····· 11
3-8.
Fitting Base (Guide) Assy, Bracket (Chassis) and
Fitting Base (Magnet) Assy ·············································· 11
3-9.
Tray (Sub) ········································································· 12
3-10. Chassis (Mold B) Section, Stocker Section and
Slider (Selection) ······························································ 12
3-11. Gears Installation ······························································ 13
3-12. Slider (Selection) Installation ··········································· 13
3-13. Stocker Section Installation ·············································· 14
3-14. Chassis (Mold B) Section Installation ······························ 14
4. TEST MODE
···································································· 15
5. MECHANICAL ADJUSTMENTS
····························· 20
6. ELECTRICAL ADJUSTMENTS
······························· 20
7. DIAGRAMS
7-1.
Circuit Board Location ····················································· 25
7-2.
Block Diagrams ································································ 28
7-3.
Printed Wiring Board – BD Section – ······························ 32
7-4.
Schematic Diagram – BD Section – ································· 33
7-5.
Printed Wiring Board – Video Section – ·························· 34
7-6.
Schematic Diagram – Video Section (1/3) – ···················· 35
7-7.
Schematic Diagram – Video Section (2/3) – ···················· 36
7-8.
Schematic Diagram – Video Section (3/3) – ···················· 37
7-9.
Printed Wiring Board – Deck Section – ··························· 38
7-10. Schematic Diagram – Deck Section – ······························ 39
7-11. Printed Wiring Board – Main Section – ··························· 40
7-12. Schematic Diagram – Main (1/3) Section – ····················· 41
7-13. Schematic Diagram – Main (2/3) Section – ····················· 42
7-14. Schematic Diagram – Main (3/3) Section – ····················· 43
7-15. Printed Wiring Board – AMP Section – ··························· 44
7-16. Schematic Diagram – AMP Section – ······························ 45
7-17. Printed Wiring Board – Panel Section – ··························· 46
7-18. Schematic Diagram – Panel Section – ····························· 47
7-19. Printed Wiring Board  – Switch Section – ······················· 48
7-20. Schematic Diagram – Switch Section – ··························· 49
7-21. Printed Wiring Board – CD Mechanism Section – ·········· 50
7-22. Schematic Diagram – CD Mechanism Section – ············· 51
7-23. Printed Wiring Board – Power Supply Section – ············· 52
7-24. Schematic Diagram – Power Supply Section – ················ 53
7-25. Printed Wiring Board – MIC Section – ···························· 54
7-26. Schematic Diagram – MIC Section – ······························· 54
7-27. Printed Wiring Board – Leaf SW Section – ····················· 55
7-28. Schematic Diagram – Leaf SW Section – ························ 55
7-29. IC Block Diagrams ··························································· 56
7-30. IC Pin Descriptions ·························································· 58
8. EXPLODED VIEWS
8-1.
Back Panel Section ··························································· 69
8-2.
Front Panel Section ·························································· 70
8-3.
Chassis Section ································································· 71
8-4.
CD Mechanism Deck Section-1 (CDM53F-K2BD37A) ·· 72
8-5.
CD Mechanism Deck Section-2 (CDM53F-K2BD37A) ·· 73
8-6.
Base Unit Section (BU-K2BD37A) ································· 74
8-7.
Tape Mechanism Deck Section-1 (TCM-230AWR12) ···· 75
8-8.
Tape Mechanism Deck Section-2 (TCM-230AWR12) ···· 76
9. ELECTRICAL PARTS LIST
······································· 78
• Abbreviation
SP
: Singapore model
MY
: Malaysia model
HK
: Hong Kong model
TH
: Thai model
EA
: Saudi Arabia model
MODEL
SP, MY models
HK model
TH model
EA model
PARTS No.
4-226-747-3
s
4-226-747-4
s
4-226-747-5
s
4-226-747-6
s
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