HCD-VZ10 - Sony Audio Service Manual (repair manual)

hcd-vz10 service manual
Model
HCD-VZ10
Pages
92
Size
8.83 MB
Type
PDF
Document
Service Manual
Brand
Device
Audio
File
hcd-vz10.pdf
Date

Read Sony HCD-VZ10 Service Manual online

1
HCD-VZ10
SERVICE MANUAL
HCD-VZ10 is the tuner, deck, CD and amplifier
section in MHC-VZ10.
SPECIFICATIONS
MINI Hi-Fi COMPONENT SYSTEM
— Continued on next page —
Model Name Using Similar Mechanism
NEW
CD Mechanism Type
CDM53F-K2BD37A
Base Unit Type
BU-K2BD37A
Optical Pick-up Type
KSM-213DAP
Model Name Using Similar Mechanism
HCD-ZX10
Tape Transport Mechanism Type
TCM-230AWR12
CD
SECTION
TAPE DECK
SECTION
E Model
Amplifier section
The following measured at AC 120/220/240 V,
50/60 Hz
DIN power output (rated) 160 + 160 W
(6 
Ω at 1 kHz, DIN)
Continuous RMS power output (reference)
200 + 200 W
(6 
Ω at 1 kHz,
10% THD)
Inputs
VIDEO (AUDIO) IN:
voltage 250 mV,
(phono jacks)
impedance 47 k
MD IN:
voltage 450 mV,
(phono jacks)
impedance 47 k
MIC 1/2:
Sensitivity 1 mV,
(mini jack)
impedance 10 k
Outputs
MD OUT:
voltage 250 mV
(phono jacks)
impedance 1 k
VIDEO OUT:
max. output level
(phono jack)
1Vp-p, unbalanced,
Sync negative, load impedance
75 
S-VIDEO  OUT:
Y: 1Vp-p, unbalanced,
(4-pin/mini-DIN jack)
Sync negative,
C: 0.286Vp-p,
load impedance 75 
PHONES:
accepts headphones of
(stereo mini jack)
Ω or more
FRONT SPEAKER:
accepts impedance of 6 to 16 
SURROUND SPEAKER: accepts impedance of 16 
SUPER WOOFER:
Voltage 1 V, impedance 1 k
VIDEO CD/CD player section
System
Compact disc and digital audio
system
Laser
Semiconductor laser
(
λ=780nm)
Emission duration:  continuous
Laser output
Max. 44.6 
µW*
*This output is the value measured
at a distance of 200 mm from the
objective lens surface on the
Optical Pick-up Block with 7 mm
aperture.
Wavelength
780 — 
790 nm
Frequency response
2 Hz — 20 kHz (–0.5 dB)
Signal-to-noise ratio
More than 90 dB
Dynamic range
More than 90 dB
Video color system format
NTSC, PAL
CD OPTICAL DIGITAL OUT
(Square optical connector jack, rear panel)
Wavelength
660 nm
Output Level
—18 
dBm
Tape player section
Recording system
4-track 2-channel stereo
Frequency response
40 — 
13,000 Hz (–3 dB),
(DOLBY NR OFF)
using Sony TYPE I cassette
40 — 
14,000 Hz (–3 dB),
using Sony TYPE II cassette
Tuner section
FM stereo, FM/AM superheterodyne tuner
FM tuner section
Tuning range                      87.5 – 108.0 MHz (50 kHz step)
Antenna
FM lead antenna
Antenna terminals
75 
Ω unbalanced
Intermediate frequency
10.7 MHz
AM tuner section
Tuning range
Middle Eastern model:
531 – 1,602 kHz
(with the interval set at
9 kHz)
Other models:
531 – 1,602 kHz
(with the interval set at
9 kHz)
530 – 1,710 kHz
(with the interval set at
10 kHz)
Antenna
AM loop antenna
Antenna terminals
External antenna terminal
Intermediate frequency
450 kHz
Ver 1.3  2003.12
9-929-270-14
2003L02-1
© 2003.12
Sony Corporation
Home Audio Company
Published by Sony Engineering Corporation
2
This appliance is classified as a CLASS 1 LASER product. The
CLASS 1 LASER PRODUCT MARKING is located on the rear
exterior.
Laser component in this product is capable
of emitting radiation exceeding the limit for
Class 1.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radiation
exposure.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of soldering iron around 270˚C
during repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
NOTES  ON  HANDLING  THE  OPTICAL  PICK-UP
BLOCK  OR  BASE  UNIT
The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
NOTES  ON  LASER  DIODE  EMISSION  CHECK
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH
MARK 
0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS
LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE
COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS
APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS
PUBLISHED BY SONY.
General
Power requirements
Thai model:
220 V AC, 50/60 Hz
Other models:
120 V, 220 V or
230 – 240 V AC, 50/60 Hz
Adjustable with voltage selector
Power consumption
240 W
Dimensions (w/h/d)
Approx. 250 x 375 x 395 mm
Mass
Approx. 13.0 kg
Supplied accessories:
AM loop antenna (1)
FM lead antenna (1)
Remote Commander (1)
Batteries (2)
Video cable (1)
Speaker cords (4)
Front speaker pads (8)
Design and specifications are subject to change
without notice.
3
MODEL IDENTIFICATION
— BACK PANEL —
TABLE OF CONTENTS
1. SERVICE NOTE
······························································· 4
2. GENERAL
·········································································· 5
3. DISASSEMBLY
3-1.
Case ···················································································· 8
3-2.
Front Panel Section ···························································· 8
3-3.
Tape Mechanism Deck Section (TCM-230AWR12) and
MIC Board ·········································································· 9
3-4.
Back Panel Section ····························································· 9
3-5.
Main Board, Front AMP Board ········································ 10
3-6.
CD Base Unit (BU-K2BD37A) ········································ 10
3-7.
CD Mechanism Deck Section (CDM53F-K2BD37A) ····· 11
3-8.
Fitting Base (Guide) Assy, Bracket (Chassis) and
Fitting Base (Magnet) Assy ·············································· 11
3-9.
Tray (Sub) ········································································· 12
3-10. Chassis (Mold B) Section, Stocker Section and
Slider (Selection) ······························································ 12
3-11. Gears Installation ······························································ 13
3-12. Slider (Selection) Installation ··········································· 13
3-13. Stocker Section Installation ·············································· 14
3-14. Chassis (Mold B) Section Installation ······························ 14
4. TEST MODE
···································································· 15
5. MECHANICAL ADJUSTMENTS
····························· 20
6. ELECTRICAL ADJUSTMENTS
······························· 20
7. DIAGRAMS
7-1.
Circuit Board Location ····················································· 25
7-2.
Block Diagrams ································································ 28
7-3.
Printed Wiring Board – BD Section – ······························ 32
7-4.
Schematic Diagram – BD Section – ································· 33
7-5.
Printed Wiring Board – Video Section – ·························· 34
7-6.
Schematic Diagram – Video Section (1/3) – ···················· 35
7-7.
Schematic Diagram – Video Section (2/3) – ···················· 36
7-8.
Schematic Diagram – Video Section (3/3) – ···················· 37
7-9.
Printed Wiring Board – Deck Section – ··························· 38
7-10. Schematic Diagram – Deck Section – ······························ 39
7-11. Printed Wiring Board – Main Section – ··························· 40
7-12. Schematic Diagram – Main (1/3) Section – ····················· 41
7-13. Schematic Diagram – Main (2/3) Section – ····················· 42
7-14. Schematic Diagram – Main (3/3) Section – ····················· 43
7-15. Printed Wiring Board – AMP Section – ··························· 44
7-16. Schematic Diagram – AMP Section – ······························ 45
7-17. Printed Wiring Board – Panel Section – ··························· 46
7-18. Schematic Diagram – Panel Section – ····························· 47
7-19. Printed Wiring Board  – Switch Section – ······················· 48
7-20. Schematic Diagram – Switch Section – ··························· 49
7-21. Printed Wiring Board – CD Mechanism Section – ·········· 50
7-22. Schematic Diagram – CD Mechanism Section – ············· 51
7-23. Printed Wiring Board – Power Supply Section – ············· 52
7-24. Schematic Diagram – Power Supply Section – ················ 53
7-25. Printed Wiring Board – MIC Section – ···························· 54
7-26. Schematic Diagram – MIC Section – ······························· 54
7-27. Printed Wiring Board – Leaf SW Section – ····················· 55
7-28. Schematic Diagram – Leaf SW Section – ························ 55
7-29. IC Block Diagrams ··························································· 56
7-30. IC Pin Descriptions ·························································· 58
8. EXPLODED VIEWS
8-1.
Back Panel Section ··························································· 69
8-2.
Front Panel Section ·························································· 70
8-3.
Chassis Section ································································· 71
8-4.
CD Mechanism Deck Section-1 (CDM53F-K2BD37A) ·· 72
8-5.
CD Mechanism Deck Section-2 (CDM53F-K2BD37A) ·· 73
8-6.
Base Unit Section (BU-K2BD37A) ································· 74
8-7.
Tape Mechanism Deck Section-1 (TCM-230AWR12) ···· 75
8-8.
Tape Mechanism Deck Section-2 (TCM-230AWR12) ···· 76
9. ELECTRICAL PARTS LIST
······································· 78
• Abbreviation
SP
: Singapore model
MY
: Malaysia model
HK
: Hong Kong model
TH
: Thai model
EA
: Saudi Arabia model
MODEL
SP, MY models
HK model
TH model
EA model
PARTS No.
4-226-747-3
s
4-226-747-4
s
4-226-747-5
s
4-226-747-6
s
Parts No.
4
SECTION 1
SERVICE NOTE
SELF-DIAGNOSIS
This model has the self-diagnosis function for the VIDEO and AUDIO decoder sections.
Connecting to the LED between TP522 and TP523 on the VIDEO BOARD.
Immediately after the power on, the self-diagnosis function searches each operation of IC’s around the mechanism control microcomputer
(IC701). and TP5
The results can be checked by LED of the VIDEO board.
Oscilloscope (Waveform)
Symptom
No error
MPEG decoder (IC505)
error
MPEG decoder (IC505)
or
DRAM (IC507) error
[VIDEO BOARD] (SIDE A)
H
L
Light
2 time blinking
H
L
H
L
3 time blinking
TP523 TP522
LED
IC505
100
91
33
64
90
65
1
32
Ver 1.2  2002.06
CN503
CN701
Jig (J-2501-076-A)
Jig (J-2501-165-A)
Jig (J-2501-167-A)
Jig (J-2501-050-A)
SERVICE POSITION
• CD MECHANISM BLOCK
Page of 92
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