Read Sony HCD-M700 Service Manual online
Ref. No.
Part No.
Description
Remarks
Ref. No.
Part No.
Description
Remarks
123
HCD-M700
R532
1-216-833-11 METAL CHIP
10K
5%
1/16W
R533
1-216-797-11 METAL CHIP
10
5%
1/16W
R554
1-216-797-11 METAL CHIP
10
5%
1/16W
R701
1-216-833-11 METAL CHIP
10K
5%
1/16W
R711
1-218-289-11 RES-CHIP
510
5%
1/10W
R712
1-218-289-11 RES-CHIP
510
5%
1/10W
R713
1-218-289-11 RES-CHIP
510
5%
1/10W
R717
1-218-285-11 RES-CHIP
75
5%
1/10W
R718
1-218-285-11 RES-CHIP
75
5%
1/10W
R719
1-218-285-11 RES-CHIP
75
5%
1/10W
R723
1-216-833-11 METAL CHIP
10K
5%
1/16W
R724
1-216-833-11 METAL CHIP
10K
5%
1/16W
R725
1-216-833-11 METAL CHIP
10K
5%
1/16W
R731
1-216-864-11 METAL CHIP
0
5%
1/16W
R732
1-216-864-11 METAL CHIP
0
5%
1/16W
R733
1-216-864-11 METAL CHIP
0
5%
1/16W
R734
1-216-864-11 METAL CHIP
0
5%
1/16W
R735
1-216-864-11 METAL CHIP
0
5%
1/16W
R802
1-216-864-11 METAL CHIP
0
5%
1/16W
R803
1-216-864-11 METAL CHIP
0
5%
1/16W
R805
1-216-809-11 METAL CHIP
100
5%
1/16W
R806
1-216-809-11 METAL CHIP
100
5%
1/16W
R807
1-216-809-11 METAL CHIP
100
5%
1/16W
R808
1-216-809-11 METAL CHIP
100
5%
1/16W
< VARIABLE RESISTOR >
RV501
1-223-583-11 RES, ADJ, CARBON 1K
< VIBRATOR >
X101
1-795-174-11 VIBRATOR, CERAMIC 16.5MHz
X102
1-767-519-11 VIBRATOR, CRYSTAL 29MHz
*************************************************************
A-4729-890-A JACK BOARD, COMPLETE
*********************
< CAPACITOR >
C850
1-164-227-11 CERAMIC CHIP
0.022uF
10%
25V
C851
1-164-227-11 CERAMIC CHIP
0.022uF
10%
25V
C852
1-216-864-11 METAL CHIP
0
5%
1/16W
C853
1-414-170-41 INDUCTOR
100u H
C854
1-162-964-11 CERAMIC CHIP
0.001uF
10%
50V
< FERRITE BEAD >
FB101
1-469-144-21 FERRITE
0uH
FB201
1-469-144-21 FERRITE
0uH
FB301
1-469-144-21 FERRITE
0uH
< JACK >
J301
1-764-106-21 JACK (PHONES)
< JUMPER RESISTOR >
JR801
1-216-864-11 METAL CHIP
0
5%
1/16W
< COIL >
L101
1-412-006-31 INDUCTOR
10uH
L201
1-412-006-31 INDUCTOR
10uH
< RESISTOR >
R849
1-216-821-11 METAL CHIP
1K
5%
1/16W
R850
1-216-815-11 METAL CHIP
330
5%
1/16W
R851
1-216-817-11 METAL CHIP
470
5%
1/16W
R852
1-216-819-11 METAL CHIP
680
5%
1/16W
R853
1-216-821-11 METAL CHIP
1K
5%
1/16W
R854
1-216-823-11 METAL CHIP
1.5K
5%
1/16W
R855
1-216-825-11 METAL CHIP
2.2K
5%
1/16W
R856
1-216-829-11 METAL CHIP
4.7K
5%
1/16W
< SWITCH >
S825
1-571-760-11 SWITCH, KEY BOARD(PLAY MODE/DIRECTION)
S826
1-571-760-11 SWITCH, KEY BOARD (REPEAT)
S827
1-571-760-11 SWITCH, KEY BOARD (SYNCHRO MODE)
S828
1-571-760-11 SWITCH, KEY BOARD (REC MODE)
S829
1-571-760-11 SWITCH, KEY BOARD (ENTER)
S830
1-571-760-11 SWITCH, KEY BOARD (MD REC)
S831
1-571-760-11 SWITCH, KEY BOARD (TAPE PAUSE)
S832
1-571-760-11 SWITCH, KEY BOARD (TAPE REC)
*************************************************************
1-674-336-12 LOADING BOARD
**************
< CONNECTOR >
* CN151
1-568-943-11 PIN, CONNECTOR 5P
< SWITCH >
S1
1-786-203-11 SWITCH, LEVER (SLIDE)
*************************************************************
A-4729-893-A MAIN BOARD, COMPLETE (AEP,UK)
****************************
A-4729-901-A MAIN BOARD, COMPLETE (HK)
************************
4-235-238-01 BUSHING (DIA.3), INSULATING
4-237-248-01 SHEET, INSULATING
4-951-620-31 SCREW (2.6), +BVTP
7-685-546-19 SCREW +BTP 3X8 TYPE2 N-S
7-685-547-19 SCREW +BTP 3X10 TYPE2 N-S
4-237-248-01 SHEET, INSULATING
4-951-620-31 SCREW (2.6), +BVTP
7-685-546-19 SCREW +BTP 3X8 TYPE2 N-S
7-685-547-19 SCREW +BTP 3X10 TYPE2 N-S
7-685-646-79 SCREW +BVTP 3X8 TYPE2 TT(B)
< CAPACITOR >
C101
1-126-963-11 ELECT
4.7uF
20.00% 50V
C102
1-126-963-11 ELECT
4.7uF
20.00% 50V
C103
1-126-163-11 ELECT
4.7uF
20%
50V
C104
1-126-963-11 ELECT
4.7uF
20.00% 50V
C106
1-126-163-11 ELECT
4.7uF
20%
50V
C107
1-162-979-11 CERAMIC CHIP
0.0027uF
10.00% 50V
C108
1-127-715-91 CERAMIC CHIP
0.22uF
10%
16V
C109
1-127-715-91 CERAMIC CHIP
0.22uF
10%
16V
C110
1-126-963-11 ELECT
4.7uF
20.00% 50V
C111
1-115-156-11 CERAMIC CHIP
1uF
10V
C114
1-126-963-11 ELECT
4.7uF
20.00% 50V
C115
1-126-163-11 ELECT
4.7uF
20%
50V
C130
1-162-927-11 CERAMIC CHIP
100PF
5%
50V
C131
1-124-259-11 ELECT
4.7uF
20.00% 16V
C141
1-126-967-11 ELECT
47uF
20.00% 50V
Ref. No.
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Description
Remarks
Ref. No.
Part No.
Description
Remarks
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