DVP-CX995V - Sony DVD Service Manual (repair manual)

dvp-cx995v service manual
Model
DVP-CX995V
Pages
116
Size
8.44 MB
Type
PDF
Document
Service Manual
Brand
Device
DVD
File
dvp-cx995v.pdf
Date

Read Sony DVP-CX995V Service Manual online

SERVICE MANUAL
CD/DVD PLAYER
US Model
Canadian Model
DVP-CX995V
Ver. 1.2  2007.06
SPECIFICATIONS
9-879-772-03
2005F05-1
© 2007.06
Sony Corporation
Home Audio Division
Published by Sony Techno Create Corporation
Model Name Using Similar Mechanism
NEW
CD/DVD Mechanism Type
CDM62-DVBU65
Base Unit Name
DVBU65
Optical Traverse Unit Name
DBU-3
 * Manufactured under license from Dolby 
Laboratories. “Dolby,” “Pro Logic,” and the 
double-D symbol are trademarks of Dolby 
Laboratories.
** “DTS” and “DTS Digital Surround” are 
registered trademarks of Digital Theater 
Systems, Inc.
System
Laser: Semiconductor laser
λ = 780 nm for CD
λ = 650 nm for Super Audio CD and 
DVD
Emission duration: continuous
Signal format system: NTSC
Audio characteristics
Frequency response: DVD VIDEO (PCM 
96 kHz): 2 Hz to 44 kHz (44 kHz: –2 dB 
±1 dB), Super Audio CD: 2 Hz to 
100 kHz (50 kHz: –3 dB 
±1 dB), CD: 
2 Hz to 20 kHz (
±0.5 dB)
Signal-to-noise ratio (S/N ratio): 115 dB 
(LINE OUT AUDIO L/R 1/2 jacks only)
Harmonic distortion: 0.003 %
Dynamic range: DVD VIDEO/Super Audio 
CD: 103 dB, CD: 99 dB
Wow and flutter: Less than detected value 
(
±0.001% W PEAK)
Outputs
(Jack name: Jack type/Output level/Load 
impedance)
LINE OUT AUDIO L/R 1/2: Phono jack/
2 Vrms/10 kilohms
DIGITAL OUT (OPTICAL): Optical 
output jack/–18 dBm (wave length: 
660 nm)
DIGITAL OUT (COAXIAL): Phono jack/
0.5 Vp-p/75 ohms
HDMI OUTPUT: TypeA (19 pin)
5.1CH OUTPUT: Phono jack/2 Vrms/
10 kilohms
COMPONENT VIDEO OUT(Y, P
B
/C
B
, P
R
/
C
R
): 
Phono jack/Y: 1.0 Vp-p/P
B
/C
B
, P
R
/C
R
:
interlace
1)
 = 0.648 Vp-p, progressive or 
interlace
2)
  = 0.7 Vp-p/75 ohms 
1) BLACK LEVEL (COMPONENT 
OUT) is ON 
2) BLACK LEVEL (COMPONENT 
OUT) is OFF
LINE OUT (VIDEO) 1/2: Phono jack/
1.0 Vp-p/75 ohms
S VIDEO OUT 1/2: 4-pin mini DIN/Y:
1.0 Vp-p, C: 0.286 Vp-p/75 ohms
General
Power requirements: 
120 V AC, 60 Hz
Power consumption: 25 W
Dimensions (approx.): 430 
× 189 × 545 mm 
(17 
× 7 
1
/
2
 
× 21
1
/
2
 in.) (width/height/depth) 
incl. projecting parts
Mass (approx.): 8.6 kg (18 lb 15 oz)
Operating temperature: 5
°C to 35 °C 
(41
°
F to 95
°
F)
Operating humidity: 25 % to 80 %
Supplied accessories
• Audio/video cord 
(pinplug
× 3 y pinplug × 3) (1)
Specifications and design are subject to 
change without notice.
• Remote commander (remote) (1)
• Size AA (R6) batteries (2)
2
DVP-CX995V
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270 ˚C
during repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radiation
exposure.
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 ˚C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 ˚C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscou-s (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
SAFETY-RELATED  COMPONENT  WARNING!!
COMPONENTS  IDENTIFIED  BY  MARK 
 0
  OR  DOTTED  LINE
WITH  MARK  
0
  ON  THE  SCHEMATIC  DIAGRAMS  AND  IN
THE  PARTS  LIST  ARE  CRITICAL  TO  SAFE  OPERATION.
REPLACE  THESE  COMPONENTS  WITH  SONY  PARTS  WHOSE
PART  NUMBERS  APPEAR  AS  SHOWN  IN  THIS  MANUAL  OR
IN  SUPPLEMENTS  PUBLISHED  BY  SONY.
SAFETY  CHECK-OUT
After correcting the original service problem, perform the following
safety check before releasing the set to the customer:
Check the antenna terminals, metal trim, “metallized” knobs, screws,
and all other exposed metal parts for AC leakage.
Check leakage as described below.
LEAKAGE  TEST
The AC leakage from any exposed metal part to earth ground and
from all exposed metal parts to any exposed metal part having a
return to chassis, must not exceed 0.5 mA (500 microamperes.).
Leakage current can be measured by any one of three methods.
1. A commercial leakage tester, such as the Simpson 229 or RCA
WT-540A. Follow the manufacturers’ instructions to use these
instruments.
2. A battery-operated AC milliammeter. The Data Precision 245
digital multimeter is suitable for this job.
3. Measuring the voltage drop across a resistor by means of a
VOM or battery-operated AC voltmeter. The “limit” indication
is 0.75 V, so analog meters must have an accurate low-voltage
scale. The Simpson 250 and Sanwa SH-63Trd are examples
of a passive VOM that is suitable. Nearly all battery operated
digital multimeters that have a 2 V AC range are suitable.  (See
Fig. A)
Fig. A.
Using an AC voltmeter to check AC leakage.
1.5 k
0.15 
µ
F
AC
voltmeter
(0.75 V)
To Exposed Metal
Parts on Set
Earth Ground
ATTENTION  AU  COMPOSANT  AYANT  RAPPORT
À  LA  SÉCURITÉ!
LES  COMPOSANTS  IDENTIFIÉS  PAR  UNE  MARQUE  
0
  SUR
LES  DIAGRAMMES  SCHÉMATIQUES  ET  LA  LISTE  DES
PIÈCES  SONT  CRITIQUES  POUR  LA  SÉCURITÉ  DE
FONCTIONNEMENT.  NE  REMPLACER  CES  COM-  POSANTS
QUE  PAR  DES  PIÈCES  SONY  DONT  LES  NUMÉROS  SONT
DONNÉS  DANS  CE  MANUEL  OU  DANS  LES  SUPPLÉMENTS
PUBLIÉS  PAR  SONY.
3
DVP-CX995V
TABLE  OF  CONTENTS
1.
SERVICING  NOTES
...............................................
4
2.
GENERAL
...................................................................
9
3.
DISASSEMBLY
3-1.
Disassembly Flow ........................................................... 10
3-2.
Case ................................................................................. 11
3-3.
MB Board ........................................................................ 11
3-4.
AV Board ......................................................................... 12
3-5.
Bracket (L)/(R) ................................................................ 12
3-6.
Front Panel Section ......................................................... 13
3-7.
Cover (PT)/(CDM) .......................................................... 13
3-8.
DVBU65 Assy ................................................................. 14
3-9.
Switching Regulator ........................................................ 14
3-10. Table (400) Assy .............................................................. 15
3-11. Door Assy, Base (Door) Assy .......................................... 15
3-12. DC Motor (Door) (M603) ............................................... 16
3-13. Holder (Table Sensor 400) ............................................... 16
3-14. D. SENS OUT Board, D. SENS IN Board ...................... 17
3-15. Pop-up (400) Assy ........................................................... 17
3-16. DOOR SW Board ............................................................ 18
3-17. LOCK SW Board, LOADING SW Board ...................... 19
3-18. CD/DVD Mechanism Deck Block
(CDM62-DVBU65) ......................................................... 20
3-19. Motor (400) Assy (Loading) (M602)/(Table) (M601),
LOADING MOTOR Board ............................................. 20
3-20. Optical Traverse Unit (DBU-3) ....................................... 21
4.
TEST  MODE
.............................................................. 22
5.
MECHANICAL  ADJUSTMENTS
....................... 32
6.
ELECTRICAL  ADJUSTMENTS
......................... 33
7.
DIAGRAMS
7-1.
Block Diagram – SERVO Section – ................................ 38
7-2.
Block Diagram – AUDIO Section – ................................ 39
7-3.
Block Diagram – VIDEO Section – ................................ 40
7-4.
Block Diagram
– PANEL, TABLE, POWER SUPPLY Section – ............ 41
7-5.
Printed Wiring Board – RF TRANSLATION Board – ... 43
7-6.
Printed Wiring Board – MB Board (Side A) – ................ 44
7-7.
Printed Wiring Board – MB Board (Side B) – ................ 45
7-8.
Schematic Diagram – MB Section (1/7) – ...................... 46
7-9.
Schematic Diagram – MB Section (2/7) – ...................... 47
7-10. Schematic Diagram – MB Section (3/7) – ...................... 48
7-11. Schematic Diagram – MB Section (4/7) – ...................... 49
7-12. Schematic Diagram – MB Section (5/7) – ...................... 50
7-13. Schematic Diagram – MB Section (6/7) – ...................... 51
7-14. Schematic Diagram – MB Section (7/7) – ...................... 52
7-15. Schematic Diagram – AV Board (1/5) – .......................... 53
7-16. Schematic Diagram – AV Board (2/5) – .......................... 54
7-17. Schematic Diagram – AV Board (3/5) – .......................... 55
7-18. Schematic Diagram – AV Board (4/5) – .......................... 56
7-19. Schematic Diagram – AV Board (5/5) – .......................... 57
7-20. Printed Wiring Board
– AV Board (Component Side) – ..................................... 58
7-21. Printed Wiring Board
– AV Board (Conductor Side) – ....................................... 59
7-22. Printed Wiring Boards – TABLE Section – ..................... 60
7-23. Schematic Diagram – TABLE Section – ......................... 61
7-24. Printed Wiring Board – DRIVER Board – ...................... 62
7-25. Schematic Diagram – DRIVER Board – ......................... 63
7-26. Printed Wiring Board – PANEL-L Board – ..................... 64
7-27. Schematic Diagram – PANEL-L Board – ....................... 65
7-28. Printed Wiring Boards – PANEL-R Section – ................. 66
7-29. Schematic Diagram – PANEL-R Section – ..................... 67
8.
EXPLODED  VIEWS
8-1.
Overall Section ................................................................ 90
8-2.
Front Panel Section ......................................................... 91
8-3.
Power Block Section ....................................................... 92
8-4.
Table Section ................................................................... 93
8-5.
Chassis Section ................................................................ 94
8-6.
Base (Door) Section ........................................................ 95
8-7.
CD/DVD Mechanism Deck Section-1
(Pop-up Block) ................................................................ 96
8-8.
CD/DVD Mechanism Deck Section-2
(Pulley Block) .................................................................. 97
8-9.
CD/DVD Mechanism Deck Section-3
(Lever, Holder Block) ...................................................... 98
8-10. CD/DVD Mechanism Deck Section-4
(Gear, Motor Block) ........................................................ 99
8-11. Base Unit Section (DVBU65) ........................................ 100
9.
ELECTRICAL  PARTS  LIST
............................... 101
4
DVP-CX995V
SECTION  1
SERVICING  NOTES
The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
NOTES  ON  LASER  DIODE  EMISSION  CHECK
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
NOTES  ON  REPLACEMENT  OF  THE  MB  BOARD
1. Flash Memory
New part of flash memory (IC202) on the MB board cannot be
used. Therefore, if the mounted MB board (A-1132-163-A) is
replaced, exchange new flash memory with that used before the
replacement.
2. Adjustment
When replacing the mounted MB board (A-1132-163-A), since the
adjustment value is not set up correctly, “Drive Auto Adjustment”
in the Test Mode can’t be performed.
In this case, initialize memory in the following procedures.
Procedure:
1. Connect a video monitor to VIDEO LINE OUT jack (J103).
2. Press the [TOP MENU], [CLEAR],
I/
1
keys on the remote
commander (RM-ASP001) in this order with standby status
to enter the Test Mode, then “DIAG START” will be displayed
on the fluorescent indicator tube and the Test Mode Menu
screen will be displayed on the video monitor.
3. Press the [2] key on the remote commander to select the “2.
Drive Manual Operation”.
4. Press the [6] key on the remote commander to select the “6.
Memory Check”.
5. Press the [CLEAR] key on the remote commander to initialize
the memory.
Note:
Refer to page 22 for detail of the Test Mode.
NOTE  OF  HANDLING  THE  AV  BOARD (Part No. A-
1126-999-A)
When the AV board is replaced by a repair for a fee, throw away the
AV board after obtaining consent of not returning of the AV board
to the customer. When throwing away the AV board, be sure to throw
away after destroying IC600 physically with the hammer etc.
SETTING  OR  RELEASING  THE  FRONT  COVER  LOCK
Procedure:
1. Press the
I/
1
button to turn the power on.
2. Press two buttons of
x
and [OPEN/CLOSE] on the main unit
for 5 seconds or more.
Note:
The setting method and the releasing method are the same operation.
NOTES  ON  HANDLING  THE  OPTICAL  PICK-UP
BLOCK  OR  BASE  UNIT
Ver. 1.2
Page of 116
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