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HCD-GTZ2/GTZ2i/GTZ3/GTZ3i
HCD-GTZ2/GTZ2i/GTZ3/GTZ3i
17
17
• Circuit Boards Location
For Schematic Diagrams.
Note:
• All capacitors are in μF unless otherwise noted. (p: pF) 50
• All capacitors are in μF unless otherwise noted. (p: pF) 50
WV or less are not indicated except for electrolytics and
tantalums.
tantalums.
• All resistors are in Ω and 1/4 W or less unless otherwise
specifi ed.
• f : Internal component.
• 2 : Nonfl ammable resistor.
• 5 : Fusible resistor.
• C : Panel designation.
• 5 : Fusible resistor.
• C : Panel designation.
THIS NOTE IS COMMON FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS.
(In addition to this, the necessary note is printed in each block.)
(In addition to this, the necessary note is printed in each block.)
• A : B+ Line.
• B : B– Line.
• Voltages and waveforms are dc with respect to ground
• B : B– Line.
• Voltages and waveforms are dc with respect to ground
under no-signal (detuned) conditions.
no mark : TUNER (FM/AM)
( ) : CD PLAY
< > : USB
{ } : PC
( ) : CD PLAY
< > : USB
{ } : PC
*
: Impossible to measure
• Voltages are taken with VOM (Input impedance 10 M
Ω).
Voltage variations may be noted due to normal production
tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal production
Voltage variations may be noted due to normal production
tolerances.
• Circled numbers refer to waveforms.
• Signal path.
F :
F :
AUDIO
J
: CD PLAY
f :
TUNER
(FM/AM)
L :
MIC
E :
USB
• Abbreviation
AR :
AR :
Argentine
model
E2
: 120V AC area in E model
E3
: 240V AC area in E model
E51
: Chilean and Peruvian models
MX
: Mexican model
For Printed Wiring Boards.
Note:
• X : Parts extracted from the component side.
• Y : Parts extracted from the conductor side.
• f : Internal component.
• X : Parts extracted from the component side.
• Y : Parts extracted from the conductor side.
• f : Internal component.
•
: Pattern from the side which enables seeing.
(The other layers’ patterns are not indicated.)
• Indication of transistor.
C
B
These are omitted.
E
Q
C E
B
These are omitted.
Caution:
Pattern face side:
(SIDE B)
Parts face side:
(SIDE A)
Pattern face side:
(SIDE B)
Parts face side:
(SIDE A)
Parts on the pattern face side seen
from the pattern face are indicated.
Parts on the parts face side seen from
the parts face are indicated.
from the pattern face are indicated.
Parts on the parts face side seen from
the parts face are indicated.
Note: The components identifi ed by mark 0 or dotted
line with mark 0 are critical for safety.
Replace only with part number specifi ed.
Caution:
Pattern face side:
(Conductor Side)
Parts face side:
(Component Side)
Pattern face side:
(Conductor Side)
Parts face side:
(Component Side)
Parts on the pattern face side seen
from the pattern face are indicated.
Parts on the parts face side seen from
the parts face are indicated.
from the pattern face are indicated.
Parts on the parts face side seen from
the parts face are indicated.
• Abbreviation
AR :
AR :
Argentine
model
E2
: 120V AC area in E model
E3
: 240V AC area in E model
E51
: Chilean and Peruvian models
MX
: Mexican model
• DMB19 board is multi-layer printed board.
However, the patterns of intermediate layers have not
However, the patterns of intermediate layers have not
been included in diagrams.
TRANS1S board (GTZ2: E51)
TRANSX board (GTZ2: MX/GTZ2i)
TRANS board (GTZ3/GTZ3i)
TRANSX board (GTZ2: MX/GTZ2i)
TRANS board (GTZ3/GTZ3i)
MAIN board
POWER AMP board
DMB19 board
HUB board
LED board
VOLUME board
HEADPHONE board
USB board
MIC board
DISPLAY board
TUNER (FM/AM)
Ver. 1.1
• Abbreviation
E51
E51
: Chilean and Peruvian models
MX
: Mexican model
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