HCD-ESX6, HCD-ESX8, HCD-ESX9 - Sony Audio Service Manual (repair manual). Page 4

UNLEADED  SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution:  Some printed circuit boards may not come printed with 

the lead free mark due to their particular size)

Unleaded solder has the following characteristics.
•  Unleaded solder melts at a temperature about 40 °C higher 

than ordinary solder.

 

Ordinary soldering irons can be used but the iron tip has to be 
applied to the solder joint for a slightly longer time.

 

Soldering irons using a temperature regulator should be set to 
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if 

the heated tip is applied for too long, so be careful!

• Strong 

viscosity

 

Unleaded solder is more viscous (sticky, less prone to fl ow) 
than ordinary solder so use caution not to let solder bridges 
occur such as on IC pins, etc.

•  Usable with ordinary solder
 

It is best to use only unleaded solder but unleaded solder may 
also be added to ordinary solder.

NOTE  OF  REPLACING  THE  IC501,  IC502,  IC504  AND  
IC851  ON  THE  MB  BOARD
IC501, IC502, IC504 and IC851 on the MB board cannot exchange 
with single. When these parts on the MB board are damaged, 
exchange the entire mounted board.

RELEASING  THE  DISC  TRAY  LOCK
The disc tray lock function for the antitheft of an demonstration 
disc in the store is equipped.

Releasing Procedure:
1.  Press the [

?/1

] button to turn the power on.

2.  Press the [FUNCTION] button to select CD function.
3.  Press the [

x

] and [REC TO USB] button simultaneously and 

hold down for around 5 seconds.

4.  The message “UNLOCKED” is displayed and the disc tray is 

unlocked.

Note: When “LOCKED” is displayed, the slot lock is not released by turn-

ing power on/off with the [?/1] button.

The laser diode in the optical pick-up block may suffer electro-
static break-down because of the potential difference generated by 
the charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also 
use the procedure in the printed matter which is included in the 
repair parts.
The fl exible board is easily damaged and should be handled with 
care.

NOTES  ON  LASER  DIODE  EMISSION  CHECK
The laser beam on this model is concentrated so as to be focused 
on the disc refl ective surface by the objective lens in the optical 
pick-up block. Therefore, when checking the laser diode emission, 
observe from more than 30 cm away from the objective lens.

ESX6

4-460-373-0[]

ESX8

4-460-373-1[]

ESX9: E93

4-460-373-2[]

ESX9: E2, E51, MX

4-460-373-3[]

•

 Abbreviation

  E2 

: 120 V AC area in E model

 E4  : 

African 

model

  E51 

: Chilean and Peruvian models

  E93 

: 240 V AC area in E model

  MX 

: Mexican model

MB BOARD DISCRIMINATION
In this set, the MB board has been changed in the midway of 
production.
When MB board (Suffi x-11) is damaged, exchange to the MB 
board   (Suffi x-12).