Read Sony HCD-ESX6 / HCD-ESX8 / HCD-ESX9 Service Manual online
SERVICE MANUAL
Sony Corporation
Published by Sony EMCS (Malaysia) PG Tec
9-890-634-02
2013J80-1
©
2013.10
E Model
Ver. 1.1 2013.10
• HCD-ESX6 is the amplifi er, USB, CD player
and tuner section in MHC-ESX6.
• HCD-ESX8 is the amplifi er, USB, CD player
and tuner section in MHC-ESX8.
• HCD-ESX9 is the amplifi er, USB, CD player
and tuner section in MHC-ESX9.
COMPACT DISC RECEIVER
CD Section
Model Name Using Similar Mechanism
NEW
Mechanism Type
CDM90-DVBU202//C
Optical Pick-up Block Name
CMS-S76RFS7G
SPECIFICATIONS
Amplifi er section
The following are measured at
MX model:
MHC-ESX9/ESX8:
AC 120 V – 240 V, 60 Hz
MHC-ESX6:
AC 127 V, 60 Hz
Other models:
AC 120 V – 240 V, 50/60 Hz
MX model:
MHC-ESX9/ESX8:
AC 120 V – 240 V, 60 Hz
MHC-ESX6:
AC 127 V, 60 Hz
Other models:
AC 120 V – 240 V, 50/60 Hz
MHC-ESX9
Power output (rated):
High
High
channel
140 W + 140 W (at 6 ohms, 1 kHz, 1% THD)
Low
channel
140 W + 140 W (at 6 ohms, 100 Hz, 1% THD)
RMS output power (reference):
High
High
channel
250 W + 250 W (per channel at 6 ohms, 1 kHz)
Low
channel
250 W + 250 W (per channel at
6 ohms, 100 Hz)
MHC-ESX8
Power output (rated):
120 W + 120 W (at 5 ohms, 1 kHz, 1% THD)
RMS output power (reference):
300 W + 300 W (per channel at 5 ohms, 1 kHz)
MHC-ESX6
Power output (rated):
100 W + 100 W (at 4 ohms, 1 kHz, 1% THD)
RMS output power (reference):
180 W + 180 W (per channel at 4 ohms, 1 kHz)
Inputs
DVD/PC IN L/R (audio in L/R):
Voltage 2 V, impedance 47 kilohms
USB section
Supported bit rate
MP3 (MPEG 1 Audio Layer-3):
32 kbps – 320 kbps, VBR
WMA: 48 kbps – 192 kbps
AAC: 48 kbps – 320 kbps
Sampling frequencies
MP3 (MPEG 1 Audio Layer-3):
32/44.1/48
kHz
WMA: 44.1 kHz
AAC: 44.1 kHz
(USB) port:
Maximum current: 500 mA
CD player section
System
Compact disc and digital audio system
Laser Diode Properties
Emission Duration: Continuous
Laser Output*: Less than 44.6
W
* This output is the value measurement
at a distance of 200 mm from the
objective lens surface on the Optical
Pick-up Block with 7 mm aperture.
Frequency response: 20 Hz – 20 kHz
Signal-to-noise ratio: More than 65 dB
Signal-to-noise ratio: More than 65 dB
Tuner section
FM stereo, FM/AM superheterodyne tuner
Antenna:
Antenna:
FM lead antenna
AM loop antenna
FM tuner section
Tuning range:
87.5
87.5
MHz
–
108.0 MHz (50 kHz step)
AM tuner section
Tuning range
E2, E51, MX models:
E2, E51, MX models:
530 kHz – 1,710 kHz (10 kHz step)
531 kHz – 1,710 kHz (9 kHz step)
E4, E93 model:
531 kHz – 1,602 kHz (9 kHz step)
530 kHz – 1,610 kHz (10 kHz step)
Photo: HCD-ESX9
“WALKMAN” and “WALKMAN” logo are registered trademarks of Sony
Corporation.
MPEG Layer-3 audio coding technology and patents licensed from Fraunhofer
IIS and Thomson.
Windows Media is either a registered trademark or trademark of Microsoft
Corporation in the United States and/or other countries.
This product is protected by certain intellectual property rights of Microsoft
Corporation. Use or distribution of such technology outside of this product
is prohibited without a license from Microsoft or an authorized Microsoft
subsidiary.
Corporation.
MPEG Layer-3 audio coding technology and patents licensed from Fraunhofer
IIS and Thomson.
Windows Media is either a registered trademark or trademark of Microsoft
Corporation in the United States and/or other countries.
This product is protected by certain intellectual property rights of Microsoft
Corporation. Use or distribution of such technology outside of this product
is prohibited without a license from Microsoft or an authorized Microsoft
subsidiary.
– Continued on next page –
HCD-ESX6/ESX8/ESX9
HCD-ESX6/ESX8/ESX9
2
NOTES ON CHIP COMPONENT REPLACEMENT
•
•
Never reuse a disconnected chip component.
•
Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
aged by heat.
FLEXIBLE CIRCUIT BOARD REPAIRING
•
•
Keep the temperature of soldering iron around 270 °C during
repairing.
repairing.
•
Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
circuit board (within 3 times).
•
Be careful not to apply force on the conductor when soldering
or unsoldering.
or unsoldering.
SAFETY-RELATED COMPONENT WARNING!
COMPONENTS IDENTIFIED BY MARK
0 OR DOTTED LINE
WITH MARK
0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS
REPLACE THESE COMPONENTS WITH SONY PARTS
WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
CAUTION
The use of optical instruments with this product will increase eye
hazard.
The use of optical instruments with this product will increase eye
hazard.
This appliance is classifi ed as
a CLASS 1 LASER product.
This marking is located on the
rear exterior.
a CLASS 1 LASER product.
This marking is located on the
rear exterior.
General
Power requirements
MX
MX
model:
MHC-ESX9/ESX8:
AC 120 V – 240 V, 60 Hz
MHC-ESX6:
AC 127 V, 60 Hz
Other
models:
AC 120 V – 240 V, 50/60 Hz
Power consumption
MHC-ESX9:
MHC-ESX9:
165
W
MHC-ESX8:
100
W
MHC-ESX6:
70
W
Dimensions (w/h/d) (excl. speakers)
(Approx.)
(Approx.)
240 mm × 308 mm × 246 mm
Mass (excl. speakers) (Approx.)
MHC-ESX9: 3.0 kg
MHC-ESX8: 2.9 kg
MHC-ESX6: 2.8 kg
Supplied accessories
Remote control (1)
R6 (Size AA) batteries (2)
FM lead/AM loop antenna (1)
Design and specifi cations are subject to change without notice.
• Abbreviation
E2
E2
: 120 V AC area in E model
E4 :
African
model
E51
: Chilean and Peruvian models
E93
: 240 V AC area in E model
MX
: Mexican model
Ver. 1.1
HCD-ESX6/ESX8/ESX9
3
TABLE OF CONTENTS
1.
SERVICING NOTES
................................................. 4
2. DISASSEMBLY
2-1. Disassembly Flow .............................................................. 9
2-2. Side Case (L), Side Case (R), Top Case .......................... 10
2-3. Loading Panel .................................................................. 10
2-4. CD Mechanism Section (CDM90-DVBU202//C) ............11
2-5. Front Panel Section ...........................................................11
2-6. MB Board ........................................................................ 12
2-7. SMPS-300W Board (ESX6), SMPS-400W Board
2-2. Side Case (L), Side Case (R), Top Case .......................... 10
2-3. Loading Panel .................................................................. 10
2-4. CD Mechanism Section (CDM90-DVBU202//C) ............11
2-5. Front Panel Section ...........................................................11
2-6. MB Board ........................................................................ 12
2-7. SMPS-300W Board (ESX6), SMPS-400W Board
(ESX8), SMPS-600W Board (ESX9) .............................. 12
2-8. Service Optical Device, Wire (Flat Type) ........................ 13
3.
ESX TEST MODE
..................................................... 14
4. ELECTRICAL
CHECK
............................................ 16
5. TROUBLESHOOTING
............................................ 17
6. DIAGRAMS
6-1. Block Diagram - CD/USB Section - ................................ 27
6-2. Block Diagram - MAIN Section - .................................... 28
6-3. Block Diagram - AMP Section - ...................................... 29
6-4. Block
6-2. Block Diagram - MAIN Section - .................................... 28
6-3. Block Diagram - AMP Section - ...................................... 29
6-4. Block
Diagram
- PANEL/POWER SUPPLY Section - ............................. 30
6-5. Printed
Wiring
Board
- MB Board (Component Side) (Suffi x-11) - .................. 32
6-6. Printed
Wiring
Board
- MB Board (Conductor Side) (Suffi x-11) - .................... 33
6-7. Printed
Wiring
Board
- MB Board (Component Side) (Suffi x-12) - .................. 34
6-8. Printed
Wiring
Board
- MB Board (Conductor Side) (Suffi x-12) - ................... 35
6-9. Schematic
Diagram
- MB Board (1/6) (Suffi x-11/-12) - ................................. 36
6-10. Schematic Diagram
- MB Board (2/6) (Suffi x-11/-12) - ................................. 37
6-11. Schematic Diagram
- MB Board (3/6) (Suffi x-11/-12) - ................................. 38
6-12. Schematic Diagram
- MB Board (4/6) (Suffi x-11/-12) - ................................. 39
6-13. Schematic Diagram
- MB Board (5/6) (Suffi x-11/-12) - ................................. 40
6-14. Schematic Diagram
- MB Board (6/6) (Suffi x-11/-12) - ................................. 41
6-15. Printed Wiring Board - PANEL Board - ......................... 42
6-16. Schematic Diagram - PANEL Board (1/2) - ................... 43
6-17. Schematic Diagram - PANEL Board (2/2) - ................... 44
6-16. Schematic Diagram - PANEL Board (1/2) - ................... 43
6-17. Schematic Diagram - PANEL Board (2/2) - ................... 44
6-18. Printed Wiring Board
- SMPS-300W Board (ESX6) - ....................................... 45
6-19. Schematic Diagram
- SMPS-300W Board (ESX6) - ....................................... 46
6-20. Printed Wiring Board
- SMPS-400W Board (ESX8) - ....................................... 47
6-21. Schematic Diagram
- SMPS-400W Board (ESX8) - ....................................... 48
6-22. Printed Wiring Board
- SMPS-600W Board (ESX9) - ....................................... 49
6-23. Schematic Diagram
- SMPS-600W Board (ESX9) - ....................................... 50
6-24. Printed Wiring Board - REGULATOR Board - ............... 51
6-25. Schematic Diagram - REGULATOR Board - .................. 51
6-25. Schematic Diagram - REGULATOR Board - .................. 51
7.
EXPLODED VIEWS
7-1. Case
Section
..................................................................... 66
7-2. Back Panel Section .......................................................... 67
7-3. Front Panel Section .......................................................... 68
7-4. Chassis
7-3. Front Panel Section .......................................................... 68
7-4. Chassis
Section
................................................................ 69
7-5. CD Mechanism Section
(CDM90-DVBU202//C) .................................................. 70
8.
ELECTRICAL PARTS LIST
................................ 71
HCD-ESX6/ESX8/ESX9
4
SECTION 1
SERVICING NOTES
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher
• Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong
viscosity
Unleaded solder is more viscous (sticky, less prone to fl ow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
also be added to ordinary solder.
NOTE OF REPLACING THE IC501, IC502, IC504 AND
IC851 ON THE MB BOARD
IC501, IC502, IC504 and IC851 on the MB board cannot exchange
with single. When these parts on the MB board are damaged,
exchange the entire mounted board.
IC851 ON THE MB BOARD
IC501, IC502, IC504 and IC851 on the MB board cannot exchange
with single. When these parts on the MB board are damaged,
exchange the entire mounted board.
RELEASING THE DISC TRAY LOCK
The disc tray lock function for the antitheft of an demonstration
disc in the store is equipped.
The disc tray lock function for the antitheft of an demonstration
disc in the store is equipped.
Releasing Procedure:
1. Press the [
1. Press the [
?/1
] button to turn the power on.
2. Press the [FUNCTION] button to select CD function.
3. Press the [
3. Press the [
x
] and [REC TO USB] button simultaneously and
hold down for around 5 seconds.
4. The message “UNLOCKED” is displayed and the disc tray is
unlocked.
Note: When “LOCKED” is displayed, the slot lock is not released by turn-
ing power on/off with the [?/1] button.
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
BLOCK OR BASE UNIT
The laser diode in the optical pick-up block may suffer electro-
static break-down because of the potential difference generated by
the charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The fl exible board is easily damaged and should be handled with
care.
static break-down because of the potential difference generated by
the charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The fl exible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused
on the disc refl ective surface by the objective lens in the optical
pick-up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
The laser beam on this model is concentrated so as to be focused
on the disc refl ective surface by the objective lens in the optical
pick-up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
Model
Part No.
ESX6
4-460-373-0[]
ESX8
4-460-373-1[]
ESX9: E93
4-460-373-2[]
ESX9: E2, E51, MX
4-460-373-3[]
MODEL IDENTIFICATION
– Model Number Label –
– Model Number Label –
Parts No.
•
Abbreviation
E2
: 120 V AC area in E model
E4 :
African
model
E51
: Chilean and Peruvian models
E93
: 240 V AC area in E model
MX
: Mexican model
MB BOARD DISCRIMINATION
In this set, the MB board has been changed in the midway of
production.
When MB board (Suffi x-11) is damaged, exchange to the MB
board (Suffi x-12).
In this set, the MB board has been changed in the midway of
production.
When MB board (Suffi x-11) is damaged, exchange to the MB
board (Suffi x-12).
– MB Board (Component Side) –
SUFFIX-11 : 1-887-382-11
SUFFIX-12 : 1-887-382-12
SUFFIX-12 : 1-887-382-12
Ver. 1.1