HCD-ESX6, HCD-ESX8, HCD-ESX9 - Sony Audio Service Manual (repair manual)

hcd-esx6, hcd-esx8, hcd-esx9 service manual
Model
HCD-ESX6 HCD-ESX8 HCD-ESX9
Pages
90
Size
5.96 MB
Type
PDF
Document
Service Manual
Brand
Device
Audio
File
hcd-esx6-hcd-esx8-hcd-esx9.pdf
Date

Read Sony HCD-ESX6 / HCD-ESX8 / HCD-ESX9 Service Manual online

SERVICE MANUAL
Sony Corporation
Published by Sony EMCS (Malaysia) PG Tec
9-890-634-02
2013J80-1
© 
2013.10
E Model
Ver. 1.1  2013.10
•  HCD-ESX6 is the amplifi er, USB, CD player 
and tuner section in MHC-ESX6.
•  HCD-ESX8 is the amplifi er, USB, CD player 
and tuner section in MHC-ESX8.
•  HCD-ESX9 is the amplifi er, USB, CD player 
and tuner section in MHC-ESX9.
COMPACT DISC RECEIVER
CD Section
Model Name Using Similar Mechanism
NEW
Mechanism Type
CDM90-DVBU202//C
Optical Pick-up Block Name
CMS-S76RFS7G
SPECIFICATIONS
Amplifi er section
The following are measured at
MX model:
MHC-ESX9/ESX8:
AC 120 V – 240 V, 60 Hz
MHC-ESX6:
AC 127 V, 60 Hz
Other models:
AC 120 V – 240 V, 50/60 Hz 
MHC-ESX9
Power output (rated):
 High 
channel
 
140 W + 140 W (at 6 ohms, 1 kHz, 1% THD)
 Low 
channel
 
140 W + 140 W (at 6 ohms, 100 Hz, 1% THD)
RMS output power (reference):
 High 
channel
 
250 W + 250 W (per channel at 6 ohms, 1 kHz)
 Low 
channel
 
250 W + 250 W (per channel at 
 
6 ohms, 100 Hz)
MHC-ESX8
Power output (rated):
 
120 W + 120 W (at 5 ohms, 1 kHz, 1% THD)
RMS output power (reference):
 
300 W + 300 W (per channel at 5 ohms, 1 kHz)
MHC-ESX6
Power output (rated):
 
100 W + 100 W (at 4 ohms, 1 kHz, 1% THD)
RMS output power (reference):
 
180 W + 180 W (per channel at 4 ohms, 1 kHz) 
Inputs
DVD/PC IN L/R (audio in L/R):
 
Voltage 2 V, impedance 47 kilohms
USB section
Supported bit rate
 
MP3 (MPEG 1 Audio Layer-3):
 
32 kbps – 320 kbps, VBR
 
WMA: 48 kbps – 192 kbps
 
AAC: 48 kbps – 320 kbps
Sampling frequencies
 
MP3 (MPEG 1 Audio Layer-3):
 32/44.1/48 
kHz
 
WMA: 44.1 kHz
 
AAC: 44.1 kHz
 (USB) port:
 
Maximum current: 500 mA
CD player section
System
 
Compact disc and digital audio system
Laser Diode Properties
 
Emission Duration: Continuous
 
Laser Output*: Less than 44.6 
W
 
* This output is the value measurement
 
  at a distance of 200 mm from the
 
  objective lens surface on the Optical
 
  Pick-up Block with 7 mm aperture.
Frequency response: 20 Hz – 20 kHz
Signal-to-noise ratio: More than 65 dB
Tuner section
FM stereo, FM/AM superheterodyne tuner
Antenna:
 
FM lead antenna
 
AM loop antenna
FM tuner section
Tuning range:
 87.5 
MHz 
 108.0 MHz (50 kHz step)
AM tuner section
Tuning range
E2, E51, MX models:
 
530 kHz – 1,710 kHz (10 kHz step)
 
531 kHz – 1,710 kHz (9 kHz step)
E4, E93 model:
 
531 kHz – 1,602 kHz (9 kHz step)
 
530 kHz – 1,610 kHz (10 kHz step)
Photo: HCD-ESX9
“WALKMAN” and “WALKMAN” logo are registered trademarks of Sony 
Corporation.
MPEG Layer-3 audio coding technology and patents licensed from Fraunhofer 
IIS and Thomson.
Windows Media is either a registered trademark or trademark of Microsoft 
Corporation in the United States and/or other countries.
This product is protected by certain intellectual property rights of Microsoft 
Corporation. Use or distribution of such technology outside of this product 
is prohibited without a license from Microsoft or an authorized Microsoft 
subsidiary.
– Continued on next page –
HCD-ESX6/ESX8/ESX9
HCD-ESX6/ESX8/ESX9
2
NOTES  ON  CHIP  COMPONENT  REPLACEMENT
• 
Never reuse a disconnected chip component.
• 
Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
FLEXIBLE  CIRCUIT  BOARD  REPAIRING
• 
Keep the temperature of soldering iron around 270 °C during 
repairing.
• 
Do not touch the soldering iron on the same conductor of the 
circuit board (within 3 times).
• 
Be careful not to apply force on the conductor when soldering 
or unsoldering.
SAFETY-RELATED  COMPONENT  WARNING!
COMPONENTS  IDENTIFIED  BY  MARK  
0  OR  DOTTED  LINE  
WITH  MARK  
0  ON  THE  SCHEMATIC  DIAGRAMS  AND  IN  
THE  PARTS  LIST  ARE  CRITICAL  TO  SAFE  OPERATION.
REPLACE  THESE  COMPONENTS  WITH  SONY  PARTS 
 
WHOSE  PART  NUMBERS  APPEAR  AS  SHOWN  IN  THIS  
MANUAL  OR  IN  SUPPLEMENTS  PUBLISHED  BY  SONY.
CAUTION
The use of optical instruments with this product will increase eye 
hazard.
This appliance is classifi ed as 
a CLASS 1 LASER product.
This marking is located on the 
rear exterior.
General
Power requirements
 MX 
model:
 MHC-ESX9/ESX8:
 
AC 120 V – 240 V, 60 Hz
 MHC-ESX6:
 
AC 127 V, 60 Hz
 Other 
models:
 
AC 120 V – 240 V, 50/60 Hz
Power consumption
 MHC-ESX9: 
165 
W
 MHC-ESX8: 
100 
W
 MHC-ESX6: 
70 
W
Dimensions (w/h/d) (excl. speakers)
(Approx.)
 
240 mm × 308 mm × 246 mm
Mass (excl. speakers) (Approx.)
 
MHC-ESX9: 3.0 kg
 
MHC-ESX8: 2.9 kg
 
MHC-ESX6: 2.8 kg
Supplied accessories
 
Remote control (1)
 
R6 (Size AA) batteries (2)
 
FM lead/AM loop antenna (1)
Design and specifi cations are subject to change without notice.
• Abbreviation
  E2 
: 120 V AC area in E model
 E4  : 
African 
model
  E51 
: Chilean and Peruvian models
  E93 
: 240 V AC area in E model
  MX 
: Mexican model
Ver. 1.1
HCD-ESX6/ESX8/ESX9
3
TABLE  OF  CONTENTS
1. 
SERVICING  NOTES
 ................................................. 4
2. DISASSEMBLY
2-1.   Disassembly Flow .............................................................. 9
2-2.   Side Case (L), Side Case (R), Top Case .......................... 10
2-3.   Loading Panel .................................................................. 10
2-4.   CD Mechanism Section (CDM90-DVBU202//C) ............11
2-5.   Front Panel Section ...........................................................11
2-6.   MB Board ........................................................................ 12
2-7.   SMPS-300W Board (ESX6), SMPS-400W Board 
(ESX8), SMPS-600W Board (ESX9) .............................. 12
2-8.   Service Optical Device, Wire (Flat Type) ........................ 13
3. 
ESX TEST MODE
 ..................................................... 14
4. ELECTRICAL 
CHECK
 ............................................ 16
5. TROUBLESHOOTING
 ............................................ 17
6. DIAGRAMS
6-1.  Block Diagram - CD/USB Section - ................................ 27
6-2.  Block Diagram - MAIN Section - .................................... 28
6-3.  Block Diagram - AMP Section - ...................................... 29
6-4. Block 
Diagram
- PANEL/POWER SUPPLY Section - ............................. 30
6-5. Printed 
Wiring 
Board 
- MB Board (Component Side) (Suffi x-11) -  .................. 32
6-6. Printed 
Wiring 
Board 
- MB Board (Conductor Side) (Suffi x-11) - .................... 33
6-7. Printed 
Wiring 
Board 
- MB Board (Component Side) (Suffi x-12) -  .................. 34
6-8. Printed 
Wiring 
Board 
- MB Board (Conductor Side) (Suffi x-12) -  ................... 35
6-9. Schematic 
Diagram 
- MB Board (1/6) (Suffi x-11/-12) -  ................................. 36
6-10. Schematic Diagram 
- MB Board (2/6) (Suffi x-11/-12) -  ................................. 37
6-11. Schematic Diagram 
- MB Board (3/6) (Suffi x-11/-12) -  ................................. 38
6-12. Schematic Diagram 
- MB Board (4/6) (Suffi x-11/-12) -  ................................. 39
6-13. Schematic Diagram 
- MB Board (5/6) (Suffi x-11/-12) -  ................................. 40
6-14. Schematic Diagram 
- MB Board (6/6) (Suffi x-11/-12) -  ................................. 41
6-15.  Printed Wiring Board - PANEL Board -  ......................... 42
6-16.  Schematic Diagram - PANEL Board (1/2) -  ................... 43
6-17.  Schematic Diagram - PANEL Board (2/2) -  ................... 44
6-18. Printed Wiring Board 
- SMPS-300W Board (ESX6) - ....................................... 45
6-19. Schematic Diagram 
- SMPS-300W Board (ESX6) - ....................................... 46
6-20. Printed Wiring Board 
- SMPS-400W Board (ESX8) - ....................................... 47
6-21. Schematic Diagram 
- SMPS-400W Board (ESX8) - ....................................... 48
6-22. Printed Wiring Board 
- SMPS-600W Board (ESX9) - ....................................... 49
6-23. Schematic Diagram 
- SMPS-600W Board (ESX9) - ....................................... 50
6-24.  Printed Wiring Board - REGULATOR Board - ............... 51
6-25.  Schematic Diagram - REGULATOR Board - .................. 51
7. 
EXPLODED  VIEWS
7-1. Case 
Section 
..................................................................... 66
7-2.  Back Panel Section .......................................................... 67
7-3.  Front Panel Section .......................................................... 68
7-4. Chassis 
Section 
................................................................ 69
7-5.  CD Mechanism Section 
(CDM90-DVBU202//C) .................................................. 70
8. 
ELECTRICAL  PARTS  LIST
 ................................ 71
HCD-ESX6/ESX8/ESX9
4
SECTION  1
SERVICING  NOTES
UNLEADED  SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution:  Some printed circuit boards may not come printed with 
the lead free mark due to their particular size)
 : LEAD  FREE  MARK
Unleaded solder has the following characteristics.
•  Unleaded solder melts at a temperature about 40 °C higher 
than ordinary solder.
 
Ordinary soldering irons can be used but the iron tip has to be 
applied to the solder joint for a slightly longer time.
 
Soldering irons using a temperature regulator should be set to 
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if 
the heated tip is applied for too long, so be careful!
• Strong 
viscosity
 
Unleaded solder is more viscous (sticky, less prone to fl ow) 
than ordinary solder so use caution not to let solder bridges 
occur such as on IC pins, etc.
•  Usable with ordinary solder
 
It is best to use only unleaded solder but unleaded solder may 
also be added to ordinary solder.
NOTE  OF  REPLACING  THE  IC501,  IC502,  IC504  AND  
IC851  ON  THE  MB  BOARD
IC501, IC502, IC504 and IC851 on the MB board cannot exchange 
with single. When these parts on the MB board are damaged, 
exchange the entire mounted board.
RELEASING  THE  DISC  TRAY  LOCK
The disc tray lock function for the antitheft of an demonstration 
disc in the store is equipped.
Releasing Procedure:
1.  Press the [
?/1
] button to turn the power on.
2.  Press the [FUNCTION] button to select CD function.
3.  Press the [
x
] and [REC TO USB] button simultaneously and 
hold down for around 5 seconds.
4.  The message “UNLOCKED” is displayed and the disc tray is 
unlocked.
Note: When “LOCKED” is displayed, the slot lock is not released by turn-
ing power on/off with the [?/1] button.
NOTES  ON  HANDLING  THE OPTICAL  PICK-UP  
BLOCK  OR  BASE  UNIT
The laser diode in the optical pick-up block may suffer electro-
static break-down because of the potential difference generated by 
the charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also 
use the procedure in the printed matter which is included in the 
repair parts.
The fl exible board is easily damaged and should be handled with 
care.
NOTES  ON  LASER  DIODE  EMISSION  CHECK
The laser beam on this model is concentrated so as to be focused 
on the disc refl ective surface by the objective lens in the optical 
pick-up block. Therefore, when checking the laser diode emission, 
observe from more than 30 cm away from the objective lens.
Model
Part No.
ESX6
4-460-373-0[]
ESX8
4-460-373-1[]
ESX9: E93
4-460-373-2[]
ESX9: E2, E51, MX
4-460-373-3[]
MODEL  IDENTIFICATION
– Model Number Label –
Parts No.
 Abbreviation
  E2 
: 120 V AC area in E model
 E4  : 
African 
model
  E51 
: Chilean and Peruvian models
  E93 
: 240 V AC area in E model
  MX 
: Mexican model
MB BOARD DISCRIMINATION
In this set, the MB board has been changed in the midway of 
production.
When MB board (Suffi x-11) is damaged, exchange to the MB 
board   (Suffi x-12).
– MB Board (Component Side) –
SUFFIX-11 : 1-887-382-11
SUFFIX-12 : 1-887-382-12
Ver. 1.1
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