GTK-X1BT - Sony Audio Service Manual (repair manual)

2014I80-1

© 

2014.09

Photo: GTK-X1BT

POWER OUTPUT AND TOTAL HARMONIC DISTORTION:
(US model only)
With 6 ohm loads, both channels driven, from 120 – 10,000 
Hz; rated 75 watts per channel minimum RMS power, with 
no more than 0.7% total harmonic distortion from 250 
milliwatts to rated output.

Amplifi er section
The following are measured at
 US 

model:

 

AC 120 V, 60 Hz

 Mexican 

model:

 

AC 127 V, 60 Hz

 

AEP, UK and Russian models:

 

AC 220 V – 240 V, 50/60 Hz

 E 

models:

 

AC 220 V – 240 V, 50 Hz

 Other 

models:

 

AC 120 V – 240 V, 50/60 Hz

Power output (rated)
 

150 W + 150 W (at 6 ohms, 1 kHz, 1% THD)

RMS output power (reference)
 

250 W + 250 W (per channel at 6 ohms, 1 kHz)

Inputs
AUDIO IN/PARTY CHAIN IN L/R
 

Voltage 2 V, impedance 47 kilohms

Outputs
AUDIO OUT/PARTY CHAIN OUT L/R
 

Voltage 2 V, impedance 1 kilohm

USB section
Supported format
 

MP3 (MPEG 1 Audio Layer-3):

 

32 kbps – 320 kbps, VBR

 

WMA: 48 kbps – 192 kbps

 

AAC: 48 kbps – 320 kbps

 

WAV: 16 bit PCM

Sampling frequencies
 MP3 

(MPEG 1 Audio Layer-3):

 

32 kHz/44.1 kHz/48 kHz

 

WMA: 32 kHz/44.1 kHz/48 kHz

 AAC: 

32 

kHz/44.1 kHz/48 kHz

 

WAV: 8 kHz – 48 kHz

Supported USB device
 

Mass Storage Class

Maximum current
 1 

A

 (USB) port

 Type 

A

Bluetooth section
Communication system
 

Bluetooth Standard version 3.0

Output
 

Bluetooth Standard Power Class 2

Maximum communication range
 

Line of sight approx. 10 m

1)

Frequency band
 

2.4 GHz band (2.4000 GHz – 2.4835 GHz)

Modulation method
 

FHSS (Freq Hopping Spread Spectrum)

Compatible Bluetooth profiles

2)

 

A2DP (Advanced Audio Distribution Profile)

 

AVRCP 1.3 (Audio Video Remote Control Profile)

Supported codecs
 

SBC (Sub Band Codec)

 

AAC (Advanced Audio Coding)

 

aptX (aptX Codec)

1)  

The actual range will vary depending on factors such as 
obstacles between devices, magnetic fields around a 
microwave oven, static electricity, reception sensitivity, 
antenna’s performance, operating system, software 
application, etc.

2)  

Bluetooth standard profiles indicate the purpose of 
Bluetooth communication between devices.

FM tuner section
FM stereo, FM superheterodyne tuner
Antenna
 

FM wire antenna

Tuning range
 US 

model:

 

 87.5 MHz – 108.0 MHz (100 kHz step)

 Other 

models:

 

 87.5 MHz – 108.0 MHz (50 kHz step)

Speaker section
Speaker system
 

2-way, Bass refl ex

Speaker unit
 

Woofer: 200 mm (7 

7

⁄

8

 in), cone type

 

Tweeter: 66 mm (2 

5

⁄

8

 in), cone type

Rated impedance
 

6 ohms

General
Power requirements
 US 

model:

 

AC 120 V, 60 Hz

 Mexican 

model:

 

AC 127 V, 60 Hz

 

AEP, UK and Russian models:

 

AC 220 V – 240 V, 50/60 Hz

 E 

models:

 

AC 220 V – 240 V, 50 Hz

 Other 

models:

 

AC 120 V – 240 V, 50/60 Hz

Power consumption
 

110 W

Power consumption (at the Power Saving mode)
 

AEP, UK and Russian models:

 

 0.5 W (When “BT STBY” is set to “OFF”)

 

 6 W (When “BT STBY” is set to “ON”)

Dimensions (w/h/d) (Approx.)
 

757 mm × 303 mm × 363 mm

 (29 

7

⁄

8

 in × 12 in × 14 

3

⁄

8

 in)

Mass (Approx.)
 

13.8 kg (30 lb 7 oz)

Supplied accessories
 

Remote control (1)

 

R6 (Size AA) batteries (2)

 

FM wire antenna (1)

Design and specifications are subject to change without 
notice.

– Continued on next page –

NOTES  ON  CHIP  COMPONENT  REPLACEMENT
• 

Never reuse a disconnected chip component.

• 

Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.

SAFETY  CHECK-OUT
After correcting the original service problem, perform the follow-
ing safety check before releasing the set to the customer:
Check the antenna terminals, metal trim, “metallized” knobs, 
screws, and all other exposed metal parts for AC leakage.
Check leakage as described below.

LEAKAGE  TEST
The AC leakage from any exposed metal part to earth ground and 
from all exposed metal parts to any exposed metal part having a 
return to chassis, must not exceed 0.5 mA (500 microamperes.). 
Leakage current can be measured by any one of three methods.
1.  A commercial leakage tester, such as the Simpson 229 or RCA 

WT-540A. Follow the manufacturers’ instructions to use these 
instruments.

2.  A battery-operated AC milliammeter. The Data Precision 245 

digital multimeter is suitable for this job.

3.  Measuring the voltage drop across a resistor by means of a 

VOM or battery-operated AC voltmeter. The “limit” indication 
is 0.75 V, so analog meters must have an accurate low-voltage 
scale. The Simpson 250 and Sanwa SH-63Trd are examples 
of a passive VOM that is suitable. Nearly all battery operated 
digital multimeters that have a 2 V AC range are suitable. (See 
Fig. A)

0  OR  DOTTED  LINE  

0  ON  THE  SCHEMATIC  DIAGRAMS  AND  IN  

License and Trademark Notice
•  iPhone and iPod touch are trademarks of Apple Inc., 

registered in the U.S. and other countries. App Store is a 
service mark of Apple Inc.

•   

“Made for iPod” and “Made for iPhone” mean that an 
electronic accessory has been designed to connect specifi cally 
to iPod or iPhone, respectively, and has been certifi ed by the 
developer to meet Apple performance standards. 

 

Apple is not responsible for the operation of this device or its 
compliance with safety and regulatory standards. Please note 
that the use of this accessory with iPod or iPhone may affect 
wireless performance.

• The 

®

 word mark and logos are registered trademarks 

owned by Bluetooth SIG, Inc. and any use of such marks by 
Sony Corporation is under license. Other trademarks and trade 
names are those of their respective owners.

•  The N Mark is a trademark or registered trademark of NFC 

Forum, Inc. in the United States and in other countries.

•  © 2013 CSR plc and its group companies. The aptX

®

 mark 

and the aptX logo are trade marks of CSR plc or one of its 
group companies and may be registered in one or more juris-
dictions.

• 

Android™ is a trademark of Google Inc.

• 

Google Play™ is a trademark of Google Inc.

•  MPEG Layer-3 audio coding technology and patents

licensed from Fraunhofer IIS and Thomson.

•  Windows Media is either a registered trademark or 

trademark of Microsoft Corporation in the United States 
and/or other countries.

• 

This product is protected by certain intellectual property 
rights of Microsoft Corporation. Use or distribution of 
such technology outside of this product is prohibited
without a license from Microsoft or an authorized 
Microsoft subsidiary.

•  All other trademarks and registered trademarks are of 

their respective holders. In this manual, ™ and 

®

 marks 

are not specified.

 .............................................  

4

2-1. Disassembly 

Flow 

...........................................................  11

2-2. Side-L 

Panel 

....................................................................  12

2-3. Back 

Panel 

......................................................................  13

2-4.  Shield Plate (Main) .........................................................   14
2-5.  Side-R Panel Block .........................................................   15
2-6.  Shield Plate (Power) Block .............................................   16
2-7. MAIN 

Board 

...................................................................  17

2-8. Power 

Cord 

.....................................................................  18

2-9. SMPS 

Board 

...................................................................  19

2-10. Chassis ............................................................................   19
2-11.  Front Panel Block ...........................................................   20
2-12.  Loudspeaker (20 cm) (SP1, SP2) ....................................   21

 ............................................................   22

 .........................................   24

5-1.  Block Diagram - MAIN Section - ...................................   25
5-2.  Block Diagram - AMP Section - .....................................   26
5-3.  Block Diagram - REGULATOR Section - ......................   27
5-4.  Block Diagram - POWER SUPPLY Section - ................   28
5-5. Printed 

Wiring 

Board 

- MAIN Board (Component Side) - ................................   30

5-6. Printed 

Wiring 

Board 

- MAIN Board (Conductor Side) - ..................................   31

5-7.  Schematic Diagram - MAIN Board (1/6) - .....................   32
5-8.  Schematic Diagram - MAIN Board (2/6) - .....................   33
5-9.  Schematic Diagram - MAIN Board (3/6) - .....................   34
5-10.  Schematic Diagram - MAIN Board (4/6) - .....................   35
5-11.  Schematic Diagram - MAIN Board (5/6) - .....................   36
5-12.  Schematic Diagram - MAIN Board (6/6) - .....................   37
5-13.  Printed Wiring Board - SMPS Board - ...........................   38
5-14.  Schematic Diagram - SMPS Board - ..............................   39
5-15.  Printed Wiring Boards - PANEL Section - .....................   40
5-16.  Schematic Diagram - PANEL Section - ..........................   41

5-17. Printed Wiring Boards 

- AUDIO INPUT Section (1/2) - .....................................   42

5-18. Printed Wiring Boards 

- AUDIO INPUT Section (2/2) - .....................................   43

5-19. Schematic Diagram 

- AUDIO INPUT Section (1/2) - .....................................   44

5-20. Schematic Diagram 

- AUDIO INPUT Section (2/2) - .....................................   45

5-21.  Printed Wiring Board - USB Board - ..............................   46
5-22.  Schematic Diagram - USB Board - .................................   46

6-1.  Back Panel Section .........................................................   57
6-2.  DC Fan Section ...............................................................   58
6-3.  Side-R Panel Section ......................................................   59
6-4.  MAIN Board Section ......................................................   60
6-5. Chassis 

Section 

...............................................................  61

6-6. SS-GTKX1BT-ASSY 

Section 

........................................  62

6-7.  SPK Board Section .........................................................   63

 ..............................   64

Accessories are given in the last of the electrical parts list.

UNLEADED  SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution:  Some printed circuit boards may not come printed with 

the lead free mark due to their particular size)

Unleaded solder has the following characteristics.
•  Unleaded solder melts at a temperature about 40 °C higher 

than ordinary solder.

 

Ordinary soldering irons can be used but the iron tip has to be 
applied to the solder joint for a slightly longer time.

 

Soldering irons using a temperature regulator should be set to 
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if 

the heated tip is applied for too long, so be careful!

• Strong 

viscosity

 

Unleaded solder is more viscous (sticky, less prone to fl ow) 
than ordinary solder so use caution not to let solder bridges 
occur such as on IC pins, etc.

• 

Usable with ordinary solder

 

It is best to use only unleaded solder but unleaded solder may 
also be added to ordinary solder.

US

AC: 120V - 60Hz 110W

AEP, UK, RU

AC: 220V - 240V - 50/60Hz 110W

E51

AC: 220V - 240V - 50Hz 110W

E2, E12, AUS, MY, 
AR

AC: 120V - 240V - 50/60Hz 110W

MX

ca 127V - 60Hz 110W

• Abbreviation
 AR  : 

Argentina 

model

 AUS : 

Australian 

model

  E2 

: 120 V AC area in E model

  E12 

: 220 – 240 V AC area in E model

  E51 

: Chilean, Peruvian and PX models

  MX 

: Mexican model

  MY 

: Malaysia model

  RU 

: Russian model

NOTICE  OF  CONNECTOR  CHECK
When changing MAIN board to Suffi x-14, the connector for MAIN 
board (CN301) is synchronized. When the connector replacement 
is necessary, order the connector which mentioned in part list.

NOTE  OF  REPLACING  THE  IC102,  IC306,  IC311  AND  
IC506  ON  THE  MAIN  BOARD
IC102, IC306, IC311 and IC506 on the MAIN board cannot 
exchange with single. When these parts on the MAIN board are 
damaged, exchange the entire mounted board.

THE  OPERATION  CHECK  AFTER  REPAIR
After repair is completed, connect through Bluetooth, FM, NFC, 
USB etc. to this unit and perform operation checks (playback, 
recording, charging, etc.).

NOTE  OF  PERFORMING  THE  OPERATION  CHECK
Don’t perform the operation check in the state where the heat sink 
was removed from this unit, by any means. When the operation 
check is performed, be sure to fi x the heat sink to the board in 
advance.

NOTE  OF  REPLACING  THE  IC604  ON  THE  MAIN  
BOARD  AND  THE  COMPLETE  MAIN  BOARD
When IC604 on the MAIN board and the complete MAIN board 
are replaced, it is necessary to spread the compound between parts 
and heat sink.

Part No.

   

Description

7-300-009-67 

THERMAL COMPOUND (TIG2000)

Spread the compound referring to the fi gure below.

Displayed characters/
  values are example.

Displayed characters/
  values are example.

 

R

Note: Refer to supplement-1 for the printed wiring board, 

schematic diagram of MAIN board (Suffi x-14)  and 
electrical part list for MAIN board.