GTK-X1BT - Sony Audio Service Manual (repair manual). Page 4

UNLEADED  SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution:  Some printed circuit boards may not come printed with 

the lead free mark due to their particular size)

Unleaded solder has the following characteristics.
•  Unleaded solder melts at a temperature about 40 °C higher 

than ordinary solder.

 

Ordinary soldering irons can be used but the iron tip has to be 
applied to the solder joint for a slightly longer time.

 

Soldering irons using a temperature regulator should be set to 
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if 

the heated tip is applied for too long, so be careful!

• Strong 

viscosity

 

Unleaded solder is more viscous (sticky, less prone to fl ow) 
than ordinary solder so use caution not to let solder bridges 
occur such as on IC pins, etc.

• 

Usable with ordinary solder

 

It is best to use only unleaded solder but unleaded solder may 
also be added to ordinary solder.

US

AC: 120V - 60Hz 110W

AEP, UK, RU

AC: 220V - 240V - 50/60Hz 110W

E51

AC: 220V - 240V - 50Hz 110W

E2, E12, AUS, MY, 
AR

AC: 120V - 240V - 50/60Hz 110W

MX

ca 127V - 60Hz 110W

• Abbreviation
 AR  : 

Argentina 

model

 AUS : 

Australian 

model

  E2 

: 120 V AC area in E model

  E12 

: 220 – 240 V AC area in E model

  E51 

: Chilean, Peruvian and PX models

  MX 

: Mexican model

  MY 

: Malaysia model

  RU 

: Russian model

NOTICE  OF  CONNECTOR  CHECK
When changing MAIN board to Suffi x-14, the connector for MAIN 
board (CN301) is synchronized. When the connector replacement 
is necessary, order the connector which mentioned in part list.

NOTE  OF  REPLACING  THE  IC102,  IC306,  IC311  AND  
IC506  ON  THE  MAIN  BOARD
IC102, IC306, IC311 and IC506 on the MAIN board cannot 
exchange with single. When these parts on the MAIN board are 
damaged, exchange the entire mounted board.

THE  OPERATION  CHECK  AFTER  REPAIR
After repair is completed, connect through Bluetooth, FM, NFC, 
USB etc. to this unit and perform operation checks (playback, 
recording, charging, etc.).

NOTE  OF  PERFORMING  THE  OPERATION  CHECK
Don’t perform the operation check in the state where the heat sink 
was removed from this unit, by any means. When the operation 
check is performed, be sure to fi x the heat sink to the board in 
advance.

NOTE  OF  REPLACING  THE  IC604  ON  THE  MAIN  
BOARD  AND  THE  COMPLETE  MAIN  BOARD
When IC604 on the MAIN board and the complete MAIN board 
are replaced, it is necessary to spread the compound between parts 
and heat sink.

Part No.

   

Description

7-300-009-67 

THERMAL COMPOUND (TIG2000)

Spread the compound referring to the fi gure below.

Displayed characters/
  values are example.

Displayed characters/
  values are example.

 

R

Note: Refer to supplement-1 for the printed wiring board, 

schematic diagram of MAIN board (Suffi x-14)  and 
electrical part list for MAIN board.