FST-GTK1I, FST-GTK2I, HCD-GTK1I, HCD-GTK2I, RDH-GTK1I - Sony Audio Service Manual (repair manual). Page 4

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HCD-GTK1i/GTK2i
4
UNLEADED  SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution:  Some printed circuit boards may not come printed with 
the lead free mark due to their particular size)
 : LEAD  FREE  MARK
Unleaded solder has the following characteristics.
•  Unleaded solder melts at a temperature about 40 °C higher 
than ordinary solder.
 
Ordinary soldering irons can be used but the iron tip has to be 
applied to the solder joint for a slightly longer time.
 
Soldering irons using a temperature regulator should be set to 
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if 
the heated tip is applied for too long, so be careful!
• Strong 
viscosity
 
Unleaded solder is more viscous (sticky, less prone to fl ow) 
than ordinary solder so use caution not to let solder bridges 
occur such as on IC pins, etc.
•  Usable with ordinary solder
 
It is best to use only unleaded solder but unleaded solder may 
also be added to ordinary solder.
CAUTION
Use of controls or adjustments or performance of procedures 
other than those specifi ed herein may result in hazardous radia-
tion exposure.
SECTION  1
SERVICING NOTES
HOW  TO  DISASSEMBLE  THE  FRONT  PANEL  ASSY
Step:  1) Unscrew the hexagon bolt to remove the handle from the front panel.
 
2) Unscrew the 3.5 x 14 TAPPING then use the hexagon bolt to screw into hole A. It will raise up the front panel assy by 1-1.5 cm.
 3) 
Use 
fl at-head screwdrive to push out the front panel assy from the speaker cabinet. Make sure that your fl at-head screwdriver
 
  away from speaker cabinet so that it does not damage the speaker cabinet.
1
handle
hole A
front panel assy
handle
1
2
3
hole A
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