FST-GTK1I, FST-GTK2I, HCD-GTK1I, HCD-GTK2I, RDH-GTK1I - Sony Audio Service Manual (repair manual). Page 3

NOTES  ON  CHIP  COMPONENT  REPLACEMENT
•  Never reuse a disconnected chip component.
•  Notice that the minus side of a tantalum capacitor may be dam-

aged by heat.

FLEXIBLE  CIRCUIT  BOARD  REPAIRING
•  Keep the temperature of soldering iron around 270 °C during 

repairing.

•  Do not touch the soldering iron on the same conductor of the 

circuit board (within 3 times).

•  Be careful not to apply force on the conductor when soldering 

or unsoldering.

SAFETY  CHECK-OUT  (US  MODEL)
After correcting the original service problem, perform the follow-
ing safety check before releasing the set to the customer:
Check the antenna terminals, metal trim, “metallized” knobs, 
screws, and all other exposed metal parts for AC leakage.
Check leakage as described below.

LEAKAGE  TEST
The AC leakage from any exposed metal part to earth ground and 
from all exposed metal parts to any exposed metal part having a 
return to chassis, must not exceed 0.5 mA (500 microamperes.). 
Leakage current can be measured by any one of three methods.
1.  A commercial leakage tester, such as the Simpson 229 or RCA 

WT-540A. Follow the manufacturers’ instructions to use these 
instruments.

2.  A battery-operated AC milliammeter. The Data Precision 245 

digital multimeter is suitable for this job.

3.  Measuring the voltage drop across a resistor by means of a 

VOM or battery-operated AC voltmeter. The “limit” indication 
is 0.75 V, so analog meters must have an accurate low-voltage 
scale. The Simpson 250 and Sanwa SH-63Trd are examples 
of a passive VOM that is suitable. Nearly all battery operated 
digital multimeters that have a 2 V AC range are suitable. (See 
Fig. A)

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2-1.   Top Panel Block and Back Panel ....................................   6
2-2.   Power SW Board, Trans Board and DC Fan...................   6
2-3. Main 

Board 

.....................................................................   7

2-4.  VOL Board, LCD Board and IPOD Board .....................   7
2-5.   Front Panel ......................................................................   8
2-6.   Loudspeaker ....................................................................   8

  ............................................................   9

  ........................   11

5-1.  Block Diagram –Display and Power Section– ...............   13
5-2.  Block Diagram –Main Section– .....................................   14
5-3.  Printed Wiring Boards –VOL, LCD and IPOD Board– .   16
5-4.  Schematic Diagram –VOL and LCD Board– .................   17
5-5.  Schematic Diagram –IPOD Board– ................................   18
5-6.  Printed Wiring Boards –MAIN, SPK LED LEFT and SPK 

LED RIGHT Board– .......................................................   19

5-7.  Schematic Diagram –MAIN Board (1/3)– ......................   20
5-8.  Schematic Diagram –MAIN (2/3), SPK LED LEFT and 

SPK LED RIGHT Board– ..............................................   21

5-9.  Schematic Diagram –MAIN Board (3/3)– ......................   22
5-10.  Printed Wiring Boards –TRANS and 
 

POWER SW Board– .......................................................   23

5-11.  Schematic Diagram –TRANS and 
 

POWER SW Board– .......................................................   24

6-1.  Back Panel Section .........................................................   29
6-2.  Top Panel Section ...........................................................   30
6-3.  Front Panel Section .........................................................   31

  ..............................   32