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FST-GTK17iP/GTK37iP/RDH-GTK17iP/GTK37iP
9
3. GTK37-SMPS board (GTK37iP only)
– GTK37-SMPS Board (Component Side) –
Confirmation points:
1. The bond does not become thin on
1. The bond does not become thin on
the way and is applied in a fixed
quantity around positive and negative
terminal
area.
2. There is no space between C914 and
board.
3. The bond is applied to both C914 and
board.
4. The bond total amount is not less
board.
3. The bond is applied to both C914 and
board.
4. The bond total amount is not less
than 5 g.
The portion which applies bond:
Fix the 180 degrees or larger
circumferences of C914, and fix
C911 and C912 with the board.
circumferences of C914, and fix
C911 and C912 with the board.
C914
C943
Fix A931 with the board.
Fix between C943
and C944.
and C944.
C944
Fix A930 with the board.
A930
A931
Fix A932 with the board.
A932
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