Read Sony FST-GTK17IP / FST-GTK37IP / RDH-GTK17IP / RDH-GTK37IP Service Manual online
FST-GTK17iP/GTK37iP/RDH-GTK17iP/GTK37iP
4
SECTION 1
SERVICING NOTES
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher
• Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong
viscosity
Unleaded solder is more viscous (sticky, less prone to fl ow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
also be added to ordinary solder.
MODEL IDENTIFICATION
Model
Power requirements
GTK17iP: AEP, UK, AUS
AC:120 - 240V - 50/60Hz 60W
GTK17iP: RU
-
120 - 240V 50/60Hz 60W
GTK17iP: EA, SP6
AC:120 - 240V - 50/60Hz 60W
GTK17iP: MX
ca 120 - 240V - 60Hz 60W
GTK37iP: US
AC:120V - 60Hz 80W
GTK37iP: E2, E51
AC:120 - 240V - 50/60Hz 80W
GTK37iP: MX
ca 120 - 240V - 60Hz 80W
GTK37iP: AUS
AC:120 - 240V - 50/60Hz 80W
• Abbreviation
AUS :
AUS :
Australian
model
E2
: 120 V AC area in E model
E51
: Chiliean, Peruvian and PX models
MX
: Mexican model
MY
: Malaysia model
RU
: Russian model
SAF : South African model
TH :
TH :
Thai
model
THE OPERATION CHECK AFTER REPAIR
After repair is completed, connect corresponding “iPhone” etc.
to this unit and perform operation checks (playback, recording,
charging, etc.).
After repair is completed, connect corresponding “iPhone” etc.
to this unit and perform operation checks (playback, recording,
charging, etc.).
NOTE OF PERFORMING THE OPERATION CHECK
Don’t perform the operation check in the state where the heat sink
was removed from this unit, by any means. When the operation
check is performed, be sure to fi x the heat sink to the board in
advance.
Don’t perform the operation check in the state where the heat sink
was removed from this unit, by any means. When the operation
check is performed, be sure to fi x the heat sink to the board in
advance.
NOTE OF REPLACING THE IC702 ON THE MAIN
BOARD AND THE COMPLETE MAIN BOARD
When IC702 on the MAIN board and the complete MAIN board
are replaced, it is necessary to spread the compound between parts
and heat sink.
BOARD AND THE COMPLETE MAIN BOARD
When IC702 on the MAIN board and the complete MAIN board
are replaced, it is necessary to spread the compound between parts
and heat sink.
Part No.
Description
7-300-009-67
THERMAL COMPOUND (TIG2000)
Spread the compound referring to the fi gure below.
– Bottom side view –
Power requirements
Displayed characters/
values are example.
values are example.
The written example of
model number label.
model number label.
Displayed characters/
values are example.
values are example.
The written example of
stamp.
stamp.
Power requirements
R
– MAIN Board (Component Side) –
IC702
IC702
Ver. 1.1
Note: Refer to Supplement-1 for adding SERVICING NOTES.
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