FST-GTK17IP, FST-GTK37IP, RDH-GTK17IP, RDH-GTK37IP - Sony Audio Service Manual (repair manual)

fst-gtk17ip, fst-gtk37ip, rdh-gtk17ip, rdh-gtk37ip service manual
Model
FST-GTK17IP FST-GTK37IP RDH-GTK17IP RDH-GTK37IP
Pages
88
Size
7.97 MB
Type
PDF
Document
Service Manual
Brand
Device
Audio
File
fst-gtk17ip-fst-gtk37ip-rdh-gtk17ip-rdh-gtk37ip.pdf
Date

Read Sony FST-GTK17IP / FST-GTK37IP / RDH-GTK17IP / RDH-GTK37IP Service Manual online

SERVICE MANUAL
Sony Corporation
Published by Sony EMCS (Malaysia) PG Tec
PERSONAL AUDIO SYSTEM
9-890-615-03
2013I80-1
© 
2013.09
US Model
RDH-GTK37iP
AEP Model
UK Model
Malaysia Model
South African Model
Thai Model
RDH-GTK17iP
E Model
FST-GTK17iP/GTK37iP
Australian Model
RDH-GTK17iP/GTK37iP
Ver. 1.2  2013.09
FST-GTK17iP/GTK37iP/
RDH-GTK17iP/GTK37iP
Photo: RDH-GTK37iP
SPECIFICATIONS
AUDIO POWER SPECIFICATIONS
POWER OUTPUT AND TOTAL HARMONIC 
DISTORTION:
(US model only)
With 3.5 ohm loads, both channels driven, 
from 120 - 10,000 Hz; rated 50 watts per 
channel minimum RMS power, with no more 
than 0.7% total harmonic distortion from 250 
milliwatts to rated output.
Amplifi er Section
The following are measured at
US model:
 
AC 120 V, 60 Hz
Mexican model:
 
AC 120 V – 240 V, 60 Hz
Other models:
 
AC 120 V – 240 V, 50/60 Hz
FST-GTK37iP/RDH-GTK37iP
Power output (rated):
 
100 W + 100 W (at 3.5 ohms, 1 kHz, 
 1% 
THD)
RMS output power (reference):
 
210 W + 210 W (per channel at 3.5 ohms,
 1 
kHz)
FST-GTK17iP/RDH-GTK17iP
Power output (rated):
 
55 W + 55 W (at 3 ohms, 1 kHz, 1% THD)
RMS output power (reference):
 
115 W + 115 W (per channel at 3 ohms, 
 1 
kHz)
Speaker Section
Speaker system
 
2 way speaker system, Bass refl ex
Speaker units
 FST-GTK37iP/RDH-GTK37iP:
 
Woofer: 200 mm (7 
7
8
 in), cone type
 
Tweeter: 66 mm (2 
5
8
 in), cone type
 FST-GTK17iP/RDH-GTK17iP:
 
Woofer: 160 mm (6 
3
8
 in), cone type
 
Tweeter: 40 mm (1 
5
8
 in), cone type
Rated impedance
 FST-GTK37iP/RDH-GTK37iP:
 
3.5 ohms
 FST-GTK17iP/RDH-GTK17iP:
 
3 ohms
Input
DVD/PC IN (audio in L/R):
 FST-GTK37iP/RDH-GTK37iP:
 
Sensitivity 1 V, impedance 47 kilohms
 FST-GTK17iP/RDH-GTK17iP:
 
Sensitivity 1.5 V, impedance 47 kilohms
iPod/iPhone Section
Terminal for Apple Device
 
Output voltage: DC 5V
 
Maximum output current: 1 A
 
Compatible iPod/iPhone models:
 
– iPod touch 5th generation
 
– iPod nano 7th generation
 
– iPhone 5
 (USB) port: 
Maximum output current: 1 A
Compatible iPod/iPhone models:
 
– iPod touch 5th generation
 
– iPod touch 4th generation
 
– iPod touch 3rd generation
 
– iPod touch 2nd generation
 
– iPod nano 7th generation
 
– iPod nano 6th generation
 
– iPod nano 5th generation 
  
(video 
camera)
 
– iPod nano 4th generation (video)
 
– iPod nano 3rd generation (video)
 
– iPod classic
 
– iPhone 5
 
– iPhone 4S
 
– iPhone 4
 
– iPhone 3GS
 
– iPhone 3G
USB Section
Supported format
 
MP3 (MPEG 1 Audio Layer-3):
 32 
kbps 
– 320 kbps, VBR
 
WMA: 48 kbps – 192 kbps
 
AAC: 48 kbps – 320 kbps
 
WAV: 16 bit PCM
Sampling frequencies
 MP3 
(MPEG 1 Audio Layer-3):
 
32 kHz/44.1 kHz/48 kHz
 
WMA: 32 kHz/44.1 kHz/48 kHz
 AAC: 
32 kHz/44.1 kHz/48 kHz
 WAV: 
8 kHz – 48 kHz
Supported USB device
 
Mass Storage Class
 (USB) port: Type A
Bluetooth Section
Communication system
 
Bluetooth Standard version 3.0 + 
 
EDR (Enhanced Date Rate)
Output
 
Bluetooth Standard Power Class 2
Maximum communication range
 
Line of sight approx. 10m
1)
Frequency band
 
2.4 GHz band (2.4000 GHz – 2.4835 GHz)
Modulation method
 
FHSS (Freq Hopping Spread Spectrum)
Compatible Bluetooth profiles
2)
 
A2DP (Advanced Audio Distribution 
 Profile)
 
AVRCP 1.3 (Audio Video Remote 
 Control 
Profile)
Supported codecs
 
SBC (Sub Band Codec)
 
AAC (Advanced Audio Coding)
1)
The actual range will vary depending on 
factors such as obstacles between devices, 
magnetic fields around a microwave oven, 
static electricity, reception sensitivity, 
antenna’s performance, operating system, 
software application, etc.
2)
Bluetooth standard profiles indicate the 
purpose of Bluetooth 
communication 
between devices.
Tuner Section
FM stereo, FM/AM superheterodyne tuner
Antenna:
 
FM lead antenna
 
AM loop antenna
FM Tuner Section
Tuning range
 
US and Brazilian models:
 
87.5 MHz – 108.0 MHz (100 kHz step)
 Other 
models:
 
87.5 MHz – 108.0 MHz (50 kHz step)
AM Tuner Section
Tuning range
 
European, Russian and Saudi Arabian 
 models:
 
531 kHz – 1,602 kHz (9 kHz step)
 
US, Latin American and Australian 
 models:
 
530 kHz – 1,710 kHz (10 kHz step)
 
531 kHz – 1,710 kHz (9 kHz step)
 Other 
models:
 
530 kHz – 1,610 kHz (10 kHz step)
 
531 kHz – 1,602 kHz (9 kHz step)
General
Power requirements
 US 
model:
 
AC 120 V, 60 Hz
 Mexican 
model:
 
AC 120 V – 240 V, 60 Hz
 Other 
models:
 
AC 120 V – 240 V, 50/60 Hz
Power consumption
 
FST-GTK37iP/RDH-GTK37iP: 85 W
 
(0.5 W at the Power Saving mode)
 
FST-GTK17iP/RDH-GTK17iP: 60 W
 
(0.5 W at the Power Saving mode)
Dimensions (w/h/d) (Approx.)
 FST-GTK37iP/RDH-GTK37iP:
 
768.5 mm × 323 mm × 385 mm
 
(30 
3
8
 in × 12 
3
4
 in × 15 
1
4
 in)
 FST-GTK17iP/RDH-GTK17iP:
 
678.5 mm × 323 mm × 385 mm
 
(26 
3
4
 in × 12 
3
4
 in × 15 
1
4
 in)
Mass (Approx.)
 FST-GTK37iP/RDH-GTK37iP:
 
14.0 kg (30 lb 14 oz)
 FST-GTK17iP/RDH-GTK17iP:
 
12.0 kg (26 lb 8 oz)
Supplied accessories
 
Remote control (1)
 
R6 (Size AA) batteries (2)
 
FM lead/AM loop antenna (1)
Design and specifications are subject to 
change without notice.
– Continued on next page –
FST-GTK17iP/GTK37iP/RDH-GTK17iP/GTK37iP
2
NOTES  ON  CHIP  COMPONENT  REPLACEMENT
• 
Never reuse a disconnected chip component.
• 
Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
SAFETY  CHECK-OUT
After correcting the original service problem, perform the follow-
ing safety check before releasing the set to the customer:
Check the antenna terminals, metal trim, “metallized” knobs, 
screws, and all other exposed metal parts for AC leakage.
Check leakage as described below.
LEAKAGE  TEST
The AC leakage from any exposed metal part to earth ground and 
from all exposed metal parts to any exposed metal part having a 
return to chassis, must not exceed 0.5 mA (500 microamperes.). 
Leakage current can be measured by any one of three methods.
1.  A commercial leakage tester, such as the Simpson 229 or RCA 
WT-540A. Follow the manufacturers’ instructions to use these 
instruments.
2.  A battery-operated AC milliammeter. The Data Precision 245 
digital multimeter is suitable for this job.
3.  Measuring the voltage drop across a resistor by means of a 
VOM or battery-operated AC voltmeter. The “limit” indication 
is 0.75 V, so analog meters must have an accurate low-voltage 
scale. The Simpson 250 and Sanwa SH-63Trd are examples 
of a passive VOM that is suitable. Nearly all battery operated 
digital multimeters that have a 2 V AC range are suitable. (See 
Fig. A)
1.5 k
Ω
0.15 
μF
AC
voltmeter
(0.75 V)
To Exposed Metal
Parts on Set
Earth Ground
Fig. A.  Using an AC voltmeter to check AC leakage.
SAFETY-RELATED  COMPONENT  WARNING!
COMPONENTS  IDENTIFIED  BY  MARK  
0  OR  DOTTED  LINE  
WITH  MARK  
0  ON  THE  SCHEMATIC  DIAGRAMS  AND  IN  
THE  PARTS  LIST  ARE  CRITICAL  TO  SAFE  OPERATION.
REPLACE  THESE  COMPONENTS  WITH  SONY  PARTS 
 
WHOSE  PART  NUMBERS  APPEAR  AS  SHOWN  IN  THIS  
MANUAL  OR  IN  SUPPLEMENTS  PUBLISHED  BY  SONY.
License and Trademark Notice
• 
iPhone, iPod, iPod classic, iPod nano, and iPod touch are 
trademarks of Apple Inc., registered in the U.S. and other 
countries.
 
Lightning is a trademark of Apple Inc.
•  “Made for iPod” and “Made for iPhone” mean that an 
electronic accessory has been designed to connect specifi cally 
to iPod or iPhone, respectively, and has been certifi ed by the 
developer to meet Apple performance standards. Apple is not 
responsible for the operation of this device or its compliance 
with safety and regulatory standards. Please note that the use 
of this accessory with iPod or iPhone may affect wireless 
performance.
• The 
Bluetooth
®
 word mark and logos are registered trademarks 
owned by Bluetooth SIG, Inc. and any use of such marks by 
Sony Corporation is under license. Other trademarks and trade 
names are those of their respective owners.
•  The N Mark is a trademark or registered trademark of NFC 
Forum, Inc. in the United States and in other countries.
• 
Android is a trademark of Google Inc.
•  MPEG Layer-3 audio coding technology and patents
licensed from Fraunhofer IIS and Thomson.
•  Windows Media is either a registered trademark or 
trademark of Microsoft Corporation in the United States 
and/or other countries.
• 
This product is protected by certain intellectual property 
rights of Microsoft Corporation. Use or distribution of 
such technology outside of this product is prohibited
without a license from Microsoft or an authorized 
Microsoft subsidiary.
•  All other trademarks and registered trademarks are of 
their respective holders. In this manual, ™ and 
®
 marks 
are not specified.
FST-GTK17iP/GTK37iP/RDH-GTK17iP/GTK37iP
3
1. 
SERVICING  NOTES 
 .............................................  
4
2. DISASSEMBLY
2-1. Disassembly 
Flow 
...........................................................  12
2-2.  Side Panel (R) .................................................................   13
2-3.  Side Panel (L-base) .........................................................   14
2-4.  Cover (Back) Block ........................................................   15
2-5.  Back Panel (11) Block (GTK17iP) .................................   16
2-6.  Back Panel (22) Block (GTK37iP) .................................   17
2-7.  Shield Plate (Main) Block ...............................................   18
2-8. Panel 
Right 
Assy 
.............................................................  19
2-9. USB 
Board 
......................................................................  20
2-10.  Stage B (Bottom-I-PH) Block .........................................   20
2-11.  Spring (PWB) B ..............................................................   21
2-12. IP Board ..........................................................................   21
2-13.  Spring (Lock 2) ...............................................................   22
2-14. MAIN Board ...................................................................   23
2-15.  Shield Plate (SMPS) Block .............................................   24
2-16. Power Cord .....................................................................   25
2-17.  SMPS Board (GTK17iP) /SMPS Board (GTK37iP) ......   26
2-18.  Chassis (B-Tank), Bracket (BP)  .....................................   27
2-19.  Ornament Base Block .....................................................   27
2-20. Front Panel Assy .............................................................   28
2-21.  Loudspeaker (16 cm) (SP1, SP2) (GTK17iP) ................   29
2-22.  Loudspeaker (20 cm) (SP1, SP2) (GTK37iP) ................   30
3. 
TEST  MODE 
 ............................................................   31
4. 
ELECTRICAL  CHECK 
 .........................................   33
5. DIAGRAMS
5-1.  Block Diagram - MAIN Section - ...................................   35
5-2.  Block Diagram - AMP Section - .....................................   36
5-3.  Block Diagram - REGULATOR Section - ......................   37
5-4.  Block Diagram - POWER SUPPLY Section - ................   38
5-5. Printed 
Wiring 
Board 
- MAIN Board (Component Side) - ................................   40
5-6. Printed 
Wiring 
Board 
- MAIN Board (Conductor Side) - ..................................   41
5-7.  Schematic Diagram - MAIN Board (1/5) - .....................   42
5-8.  Schematic Diagram - MAIN Board (2/5) - .....................   43
5-9.  Schematic Diagram - MAIN Board (3/5) - .....................   44
5-10.  Schematic Diagram - MAIN Board (4/5) - .....................   45
5-11.  Schematic Diagram - MAIN Board (5/5) - .....................   46
TABLE  OF  CONTENTS
5-12. Printed Wiring Boards 
- AUDIO INPUT Section (1/2) - .....................................   47
5-13. Printed Wiring Boards 
- AUDIO INPUT Section (2/2) - .....................................   48
5-14.  Schematic Diagram - AUDIO INPUT Section - .............   49
5-15.  Printed Wiring Boards - PANEL Section - .....................   50
5-16.  Schematic Diagram - PANEL Section - ..........................   51
5-17. Printed Wiring Board 
- SMPS Board (GTK17iP) - ............................................   52
5-18. Schematic Diagram 
- SMPS Board (GTK17iP) - ............................................   53
5-19. Printed Wiring Board 
- SMPS Board (GTK37iP) - ............................................   54
5-20. Schematic Diagram 
- SMPS Board (GTK37iP) - ............................................   55
6. 
EXPLODED  VIEWS
6-1.  Side Panel Section ..........................................................   63
6-2.  Back Cover Section ........................................................   64
6-3.  Back Panel Section (GTK17iP) ......................................   65
6-4.  Back Panel Section (GTK37iP) ......................................   66
6-5. Ornament 
Section 
...........................................................  67
6-6.  Top Panel Section ...........................................................   68
6-7.  Front Panel Section .........................................................   69
6-8.  DC Fan Section ...............................................................   70
6-9.  MAIN Board Section ......................................................   71
6-10. Chassis Section ...............................................................   72
6-11.  SS-GTK17iP-ASSY Section (GTK17iP) .......................   73
6-12.  SS-GTK37iP-ASSY Section (GTK37iP) .......................   74
6-13.  LED Board Section .........................................................   75
7. 
ELECTRICAL  PARTS  LIST 
 ..............................   76
Accessories are given in the last of the electrical parts list.
FST-GTK17iP/GTK37iP/RDH-GTK17iP/GTK37iP
4
SECTION  1
SERVICING  NOTES
UNLEADED  SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution:  Some printed circuit boards may not come printed with 
the lead free mark due to their particular size)
 : LEAD  FREE  MARK
Unleaded solder has the following characteristics.
•  Unleaded solder melts at a temperature about 40 °C higher 
than ordinary solder.
 
Ordinary soldering irons can be used but the iron tip has to be 
applied to the solder joint for a slightly longer time.
 
Soldering irons using a temperature regulator should be set to 
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if 
the heated tip is applied for too long, so be careful!
• Strong 
viscosity
 
Unleaded solder is more viscous (sticky, less prone to fl ow) 
than ordinary solder so use caution not to let solder bridges 
occur such as on IC pins, etc.
•  Usable with ordinary solder
 
It is best to use only unleaded solder but unleaded solder may 
also be added to ordinary solder.
MODEL  IDENTIFICATION
Model
Power requirements
GTK17iP: AEP, UK, AUS
AC:120 - 240V - 50/60Hz 60W
GTK17iP: RU
-
 120 - 240V 50/60Hz 60W
GTK17iP: EA, SP6
AC:120 - 240V - 50/60Hz 60W
GTK17iP: MX
ca 120 - 240V - 60Hz 60W
GTK37iP: US
AC:120V - 60Hz 80W
GTK37iP: E2, E51
AC:120 - 240V - 50/60Hz 80W
GTK37iP: MX
ca 120 - 240V - 60Hz 80W
GTK37iP: AUS
AC:120 - 240V - 50/60Hz 80W
• Abbreviation
 AUS : 
Australian 
model
  E2 
: 120 V AC area in E model
  E51 
: Chiliean, Peruvian and PX models
  MX 
: Mexican model
  MY 
: Malaysia model
  RU 
: Russian model
  SAF  : South African model
 TH  : 
Thai 
model
THE  OPERATION  CHECK  AFTER  REPAIR
After repair is completed, connect corresponding “iPhone” etc. 
to this unit and perform operation checks (playback, recording, 
charging, etc.).
NOTE  OF  PERFORMING  THE  OPERATION  CHECK
Don’t perform the operation check in the state where the heat sink 
was removed from this unit, by any means. When the operation 
check is performed, be sure to fi x the heat sink to the board in 
advance.
NOTE  OF  REPLACING  THE  IC702  ON  THE  MAIN  
BOARD  AND  THE  COMPLETE  MAIN  BOARD
When IC702 on the MAIN board and the complete MAIN board 
are replaced, it is necessary to spread the compound between parts 
and heat sink.
Part No.
   
Description
7-300-009-67 
THERMAL COMPOUND (TIG2000)
Spread the compound referring to the fi gure below.
– Bottom side view –
Power requirements
Displayed characters/
  values are example.
The written example of 
model number label.
Displayed characters/
  values are example.
The written example of 
stamp.
Power requirements
 
R
– MAIN Board (Component Side) –
IC702
IC702
Ver. 1.1
Note: Refer to Supplement-1 for adding SERVICING NOTES.
Page of 88
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