Read Sony DAV-X1G / HCD-X1G Service Manual online
4
HCD-X1G
The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
•
Unleaded solder melts at a temperature about 40 ˚C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 ˚C.
Caution: The printed pattern (copper foil) may peel away if
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
•
Strong viscosity
Unleaded solder is more viscou-s (sticky, less prone to flow)
Unleaded solder is more viscou-s (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
occur such as on IC pins, etc.
•
Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
RELEASING THE TRAY LOCK
The disc tray lock function for the antitheft of an demonstration
disc in the store is equipped.
disc in the store is equipped.
Releasing Procedure :
1. Press the
I
/1
button to turn the power on.
2. Press the [FUNCTION] button to select the “DVD”.
3. While pressing the
3. While pressing the
x
button, press the
Z
button until
“UNLOCKED” displayed on the fluorescent indicator tube
(around 5 seconds).
(around 5 seconds).
Note:
When “LOCKED” is displayed, the tray lock is not released by turning
power on/off with the
power on/off with the
I/
1
button.
RELEASING THE DEMO PLAY LOCK
Releasing Procedure :
1. Press the
I
/1
button to turn the power on.
2. Press the [FUNCTION] button to select the “DVD”.
3. While pressing the
3. While pressing the
x
button, press the
N
button until
“DEMO OFF” displayed on the fluorescent indicator tube
(around 5 seconds).
(around 5 seconds).
Note:
When “DEMO PLAY” is displayed, the DEMO play lock is not
released by turning power on/off with the
released by turning power on/off with the
I/
1
button.
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
BLOCK OR BASE UNIT
SECTION 1
SERVICING NOTES
NOTE OF REPLACING THE DMB10 BOARD (Part No.
A-1107-248-A)
A-1107-248-A)
New part of EEPROM (IC103) on the DMB10 board cannot be
used. Therefore, if the mounted DMB10 board is replaced, exchange
new EEPROM with that used before the replacement.
used. Therefore, if the mounted DMB10 board is replaced, exchange
new EEPROM with that used before the replacement.
S-FORCE FRONT SURROUND OPERATION CHECK
When complaint by the effect of the sound field, check as follows
and confirm abnormality is not found in the set.
and confirm abnormality is not found in the set.
Procedure:
1
Press
Z
on the system.
2
Load the Setup Disc.
Place the Setup Disc on the tray, and then press Z on the
system.
system.
The Setup Disc menu appears.
3
Sit in the listening position, then select one of the three
options on the screen using
options on the screen using
C/c
, and press
H
or
ENTER.
The selected option starts.
4
Listening carefully to how the option sounds to
determine the optimal surround sound effect.
determine the optimal surround sound effect.
If a satisfactory surround sound effect cannot be achieved,
adjust the speaker positions.
adjust the speaker positions.
5
Press
x
to stop the disc.
6
Press
Z
on the system to eject the disc.
DAV-X1 / DAR-X1 Series
This setup disc is common for DAV-X1/DAR-X1 series.
RL
RR
FL
FR
C
SW
Click on the first or last page to see other DAV-X1G / HCD-X1G service manuals if exist.