Read Sony DAV-F200 / DAV-F500 / HCD-F200 / HCD-F500 Service Manual online
SERVICE MANUAL
Sony Corporation
Audio&Video Business Group
Published by Sony Techno Create Corporation
HCD-F200/F500
SPECIFICATIONS
DVD RECEIVER
9-889-150-02
2008H05-1
©
2008.08
Canadian Model
E Model
Australian Model
Russian Model
HCD-F500
AEP Model
UK Model
HCD-F200
Singapore Model
Thai Model
HCD-F200/F500
Ver. 1.1 2008.08
• HCD-F200 is the DVD system, USB, tuner and video section
in DAV-F200.
• HCD-F500 is the DVD system, USB, tuner and video section
in DAV-F500.
Note:
• In this set, repair in the state of having connected with SA-
• In this set, repair in the state of having connected with SA-
WSF200.
• In this set, repair in the state of having connected with SA-
WSF500.
Model Name Using Similar Mechanism
NEW
DVD Mechanism Type
CDM86-DVBU101
Optical Pick-up Block Name
KHM-313CAB
Photo: HCD-F500
This product incorporates copyright protection technology that is
protected by U.S. patents and other intellectual property rights.
Use of this copyright protection technology must be authorized by
Macrovision, and is intended for home and other limited viewing
uses only unless otherwise authorized by Macrovision. Reverse
engineering or disassembly is prohibited.
protected by U.S. patents and other intellectual property rights.
Use of this copyright protection technology must be authorized by
Macrovision, and is intended for home and other limited viewing
uses only unless otherwise authorized by Macrovision. Reverse
engineering or disassembly is prohibited.
This system incorporates with Dolby* Digital and Dolby Pro Log-
ic (II) adaptive matrix surround decoder and the DTS** Digital
Surround System.
ic (II) adaptive matrix surround decoder and the DTS** Digital
Surround System.
* Manufactured under license from Dolby Laboratories.
Dolby, Pro Logic, and the double-D symbol are trademarks of
Dolby, Pro Logic, and the double-D symbol are trademarks of
Dolby Laboratories.
** Manufactured under license under U.S. Patent #’s: 5,451,942;
5,956,674; 5,974,380; 5,978,762; 6,487,535 & other U.S. and
worldwide patents issued & pending. DTS and DTS Digital
Surround are registered trademarks and the DTS logos and
Symbol are trademarks of DTS, Inc. © 1996-2007 DTS, Inc.
All Rights Reserved.
worldwide patents issued & pending. DTS and DTS Digital
Surround are registered trademarks and the DTS logos and
Symbol are trademarks of DTS, Inc. © 1996-2007 DTS, Inc.
All Rights Reserved.
This system incorporates High-Defi nition Multimedia Interface
(HDMITM) technology.
HDMI, the HDMI logo and High-Defi nition Multimedia Interface
are trademarks or registered trademarks of HDMI Licensing LLC.
(HDMITM) technology.
HDMI, the HDMI logo and High-Defi nition Multimedia Interface
are trademarks or registered trademarks of HDMI Licensing LLC.
“BRAVIA” is a trademark of Sony Corporation.
“S-AIR” and its logo are trademarks of Sony Corporation.
Tuner Section
System
System
PLL quartz-locked digital
synthesizer
synthesizer
FM tuner section
Tuning range
Canadian models:
Tuning range
Canadian models:
87.5 MHz - 108.0 MHz
(100 kHz step)
Other models:
87.5 MHz - 108.0 MHz
(50 kHz step)
Antenna (aerial)
FM wire antenna (aerial)
Antenna (aerial) terminals
75 ohms, unbalanced
Intermediate frequency 10.7 MHz
Video Section
Outputs
Outputs
VIDEO: 1 Vp-p 75 ohms
COMPONENT:
Y: 1 Vp-p 75 ohms
P
B
/C
B
, P
R
/C
R
: 0.7 Vp-p
75
ohms
HDMI
OUT:
Type
A
(19
pin)
Inputs (Analog)
TV (AUDIO IN)
TV (AUDIO IN)
Sensitivity: 450/250 mV
Inputs (Digital)
SAT/CABLE (COAXIAL)
Impedance: 75 ohms
Output (Digital) (HCD-F200)
Output (Digital) (HCD-F200)
Impedance: 75 ohms
DVD System
Laser Semiconductor
Laser Semiconductor
laser
(DVD:
λ = 650 nm)
(CD:
λ = 790 nm)
Emission duration: continuous
Signal format system
Canadian and Latin American models:
NTSC
Other models:
Canadian and Latin American models:
NTSC
Other models:
NTSC/PAL
USB Section
Supported bit rate
MP3 (MPEG 1 Audio Layer-3):
Supported bit rate
MP3 (MPEG 1 Audio Layer-3):
32 kbps - 320 kbps
WMA:
48 kbps - 192 kbps
AAC:
48 kbps - 320 kbps
Sampling frequencies
MP3 (MPEG 1 Audio Layer-3):
32/44.1/48
MP3 (MPEG 1 Audio Layer-3):
32/44.1/48
kHz
WMA: 44.1
kHz
AAC: 44.1
kHz
(USB) port:
Maximum current: 500 mA
– Continued on next page –
HCD-F200/F500
2
NOTES ON CHIP COMPONENT REPLACEMENT
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
FLEXIBLE CIRCUIT BOARD REPAIRING
• Keep the temperature of soldering iron around 270 °C during
• Keep the temperature of soldering iron around 270 °C during
repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
SAFETY-RELATED COMPONET WARNING!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE
WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS
WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS
WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
ATTENTION AU COMPOSANT AYANT RAPPORT
À LA SÉCURITÉ!
LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE 0 SUR
LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES
PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE FONC-
TIONNEMENT. NE REMPLACER CES COMPOSANTS QUE
PAR DES PIÈCES SONY DONT LES NUMÉROS SONT DON-
NÉS DANS CE MANUEL OU DANS LES SUPPLÉMENTS
PUBLIÉS PAR SONY.
LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES
PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE FONC-
TIONNEMENT. NE REMPLACER CES COMPOSANTS QUE
PAR DES PIÈCES SONY DONT LES NUMÉROS SONT DON-
NÉS DANS CE MANUEL OU DANS LES SUPPLÉMENTS
PUBLIÉS PAR SONY.
Control unit (HCD-F200)
Output voltage (DIGITAL MEDIA PORT)
DC
Output voltage (DIGITAL MEDIA PORT)
DC
5
V
Output current (DIGITAL MEDIA PORT)
700
700
mA
Dimensions (approx.)
434 mm × 185 mm × 78 mm
(w/h/d)
(w/h/d)
434 mm × 214 mm × 124 mm
(w/h/d) with stand
(w/h/d) with stand
Mass (approx.)
3.6 kg
3.7 kg with stand
Control unit (HCD-F500)
Output voltage (DIGITAL MEDIA PORT)
DC
Output voltage (DIGITAL MEDIA PORT)
DC
5
V
Output current (DIGITAL MEDIA PORT)
700
700
mA
Dimensions (approx.)
434 mm × 185 mm × 78 mm
(w/h/d)
(w/h/d)
434 mm × 214 mm × 124 mm
(w/h/d) with stand
(w/h/d) with stand
Mass (approx.)
3.6 kg
3.7 kg with stand
Design and specifi cations are subject to change without
notice.
notice.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specifi ed herein may result in hazardous radia-
tion exposure.
Use of controls or adjustments or performance of procedures
other than those specifi ed herein may result in hazardous radia-
tion exposure.
Self-diagnosis Function
(When letters/numbers appear in the
display)
display)
When the self-diagnosis function is activated to
prevent the system from malfunctioning, a 5-
character service number (e.g., C 13 50) with a
combination of a letter and 4 digits appears on
the TV screen or front panel display. In this case,
check the following table.
prevent the system from malfunctioning, a 5-
character service number (e.g., C 13 50) with a
combination of a letter and 4 digits appears on
the TV screen or front panel display. In this case,
check the following table.
When displaying the version number
on the TV screen
on the TV screen
When you turn on the system, the version
number [VER.X.XX] (X is a number) may
appear on the TV screen. Although this is not a
malfunction and for Sony service use only,
normal system operation will not be possible.
Turn off the system, and then turn on the system
again to operate.
number [VER.X.XX] (X is a number) may
appear on the TV screen. Although this is not a
malfunction and for Sony service use only,
normal system operation will not be possible.
Turn off the system, and then turn on the system
again to operate.
First 3
characters of
the service
number
characters of
the service
number
Cause and/or corrective action
C 13
• The disc is dirty.
Clean the disc with a soft cloth.
• The disc is a format that the
system cannot play.
C 31
The disc is not inserted correctly.
Restart the system, then re-insert
Restart the system, then re-insert
the disc correctly.
E XX
(XX is a
number)
number)
To prevent a malfunction, the
system has performed the self-
diagnosis function.
Contact your nearest Sony
system has performed the self-
diagnosis function.
Contact your nearest Sony
dealer or local authorized Sony
service facility and give the 5-
character service number.
service facility and give the 5-
character service number.
Example: E 61 10
C:13:50
VER.X.XX
This appliance is
classified as a CLASS 1
LASER product. This
marking is located on
the bottom exterior.
classified as a CLASS 1
LASER product. This
marking is located on
the bottom exterior.
HCD-F200/F500
3
1.
SERVICING NOTES
............................................. 4
2. GENERAL
.................................................................. 8
3. DISASSEMBLY
3-1. Disassembly Flow ........................................................... 10
3-2. Panel (Stand Top) ............................................................ 11
3-3. Cover (Read-HCD), Holder (Terminal-HCD) ................ 11
3-4. Process In The Solder Bridge ......................................... 12
3-5. Optical Pick-up Block ..................................................... 13
3-6. KEY-R/FL/KEY-L/USB Board ....................................... 13
3-7. Main Block ..................................................................... 14
3-8. Shield Plate (Front) ......................................................... 15
3-9. MAIN Board Block ........................................................ 15
3-10. MAIN Board ................................................................... 16
3-11. DMB-FIT Board ............................................................. 16
3-12. DVD Mechanism Block .................................................. 17
3-13. Motor (Pulley) Assy (Loading) (M001) .......................... 17
3-14. Holder (BU) Assy ........................................................... 18
3-15. Lever (BU Lock) ............................................................. 18
3-16. Close Lever ..................................................................... 19
3-17. Lever (DIR), Gear (IDL-B) ............................................ 19
3-18. Chassis (Top) .................................................................. 20
3-19. Lever (Loading-L/R) ....................................................... 21
3-20. Lever (Disc Sensor)/(Disc Stop) ..................................... 22
3-21. Gear (IDL-C) .................................................................. 22
3-2. Panel (Stand Top) ............................................................ 11
3-3. Cover (Read-HCD), Holder (Terminal-HCD) ................ 11
3-4. Process In The Solder Bridge ......................................... 12
3-5. Optical Pick-up Block ..................................................... 13
3-6. KEY-R/FL/KEY-L/USB Board ....................................... 13
3-7. Main Block ..................................................................... 14
3-8. Shield Plate (Front) ......................................................... 15
3-9. MAIN Board Block ........................................................ 15
3-10. MAIN Board ................................................................... 16
3-11. DMB-FIT Board ............................................................. 16
3-12. DVD Mechanism Block .................................................. 17
3-13. Motor (Pulley) Assy (Loading) (M001) .......................... 17
3-14. Holder (BU) Assy ........................................................... 18
3-15. Lever (BU Lock) ............................................................. 18
3-16. Close Lever ..................................................................... 19
3-17. Lever (DIR), Gear (IDL-B) ............................................ 19
3-18. Chassis (Top) .................................................................. 20
3-19. Lever (Loading-L/R) ....................................................... 21
3-20. Lever (Disc Sensor)/(Disc Stop) ..................................... 22
3-21. Gear (IDL-C) .................................................................. 22
4.
TEST MODE
............................................................ 23
5. ELECTRICAL
ADJUSTMENT
........................... 28
6. DIAGRAMS
6-1. Block Diagram - DVD SERVO Section - ....................... 29
6-2. Block Diagram - MAIN Section - ................................... 30
6-3. Block Diagram - HDMI, VIDEO Section - .................... 31
6-4. Block
6-2. Block Diagram - MAIN Section - ................................... 30
6-3. Block Diagram - HDMI, VIDEO Section - .................... 31
6-4. Block
Diagram
- PANEL, POWER SUPPLY Section - ........................... 32
6-5. Printed Wiring Boards - DMB-FIT Section (1/2) - ......... 34
6-6. Printed Wiring Boards - DMB-FIT Section (2/2) - ......... 35
6-7. Schematic Diagram - DMB-FIT Section (1/4) - ............. 36
6-8. Schematic Diagram - DMB-FIT Section (2/4) - ............. 37
6-9. Schematic Diagram - DMB-FIT Section (3/4) - ............. 38
6-10. Schematic Diagram - DMB-FIT Section (4/4) - ............. 39
6-11. Printed Wiring Board
6-6. Printed Wiring Boards - DMB-FIT Section (2/2) - ......... 35
6-7. Schematic Diagram - DMB-FIT Section (1/4) - ............. 36
6-8. Schematic Diagram - DMB-FIT Section (2/4) - ............. 37
6-9. Schematic Diagram - DMB-FIT Section (3/4) - ............. 38
6-10. Schematic Diagram - DMB-FIT Section (4/4) - ............. 39
6-11. Printed Wiring Board
- MAIN Board (Component Side) - ................................ 40
6-12. Printed Wiring Board
- MAIN Board (Conductor Side) - .................................. 41
6-13. Schematic Diagram - MAIN Board (1/3) - ..................... 42
6-14. Schematic Diagram - MAIN Board (2/3) - ..................... 43
6-15. Schematic Diagram - MAIN Board (3/3) - ..................... 44
6-16. Printed Wiring Board - CENTER Board - ...................... 45
6-17. Schematic Diagram - CENTER Board - ......................... 45
6-18. Printed Wiring Board - FL Board - ................................. 46
6-19. Schematic Diagram - FL Board - .................................... 47
6-20. Printed Wiring Boards - KEY Section - .......................... 48
6-21. Schematic Diagram - KEY Section - .............................. 49
6-14. Schematic Diagram - MAIN Board (2/3) - ..................... 43
6-15. Schematic Diagram - MAIN Board (3/3) - ..................... 44
6-16. Printed Wiring Board - CENTER Board - ...................... 45
6-17. Schematic Diagram - CENTER Board - ......................... 45
6-18. Printed Wiring Board - FL Board - ................................. 46
6-19. Schematic Diagram - FL Board - .................................... 47
6-20. Printed Wiring Boards - KEY Section - .......................... 48
6-21. Schematic Diagram - KEY Section - .............................. 49
TABLE OF CONTENTS
7.
EXPLODED VIEWS
7-1. Rear Cover Section ......................................................... 58
7-2. Front Panel Section ......................................................... 59
7-3. Main
7-2. Front Panel Section ......................................................... 59
7-3. Main
Section
................................................................... 60
7-4. Chassis
Section
............................................................... 61
7-5. DVD Mechanism Deck Section-1
(CDM86-DVBU101)
(CDM86-DVBU101)
......................................................
62
7-6. DVD Mechanism Deck Section-2
(CDM86-DVBU101)
(CDM86-DVBU101)
......................................................
63
7-7. DVD Mechanism Deck Section-3
(CDM86-DVBU101)
(CDM86-DVBU101)
......................................................
64
7-8. DVD Mechanism Deck Section-4
(CDM86-DVBU101)
(CDM86-DVBU101)
......................................................
65
8.
ELECTRICAL PARTS LIST
.............................. 66
HCD-F200/F500
4
SECTION 1
SERVICING NOTES
Model
Part No.
F200: AEP and UK models
3-294-269-0[]
F200: Singapore model
3-294-270-0[]
F500: Canadian model
3-294-272-0[]
F500: Russian model
3-294-274-0[]
F500: Singapore model
3-294-275-0[]
F500: 240V AC area in E model
3-294-276-0[]
F500: Korean and Thai models
3-294-277-0[]
F500: Australian model
3-294-279-0[]
F500: Latin American model
(110 – 240V AC area)
3-294-281-0[]
F500: Mexican model
3-294-282-0[]
F500: Taiwan model
3-294-283-0[]
F200: Thai model
3-452-613-0[]
F500: Iranian model
3-876-712-0[]
F500: Saudi Arabia model
4-114-165-0[]
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher
• Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong
viscosity
Unleaded solder is more viscous (sticky, less prone to fl ow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
also be added to ordinary solder.
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
BLOCK OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostat-
ic break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The fl exible board is easily damaged and should be handled with
care.
ic break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The fl exible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused
on the disc refl ective surface by the objective lens in the optical
pickup block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
The laser beam on this model is concentrated so as to be focused
on the disc refl ective surface by the objective lens in the optical
pickup block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
RELEASING THE DISC SLOT LOCK
The disc slot lock function for the antitheft of an demonstration
disc in the store is equipped.
The disc slot lock function for the antitheft of an demonstration
disc in the store is equipped.
Releasing Procedure:
1. Press the [
1. Press the [
?/1
] button to turn on the system.
2. Press the [FUNCTION] button on the remote commander to
select “DVD”.
3. Press
the
[
x
] and [
Z
] button on the set simultaneously and hold
down until “UNLOCKED” displayed on the fl uorescent indi-
cator tube (around 5 seconds).
cator tube (around 5 seconds).
Note: When “LOCKED” is displayed, the disc slot lock is not released by
turning power on/off with the [?/1] button.
RELEASING THE DEMO PLAY LOCK
Releasing Procedure :
1. Press the [
Releasing Procedure :
1. Press the [
?/1
] button to turn on the system.
2. Press the [FUNCTION] button on the remote commander to
select “DVD”.
3. Press the [
x
] and [
N
] button on the set simultaneously and
hold down until “DEMO OFF” displayed on the fl uorescent
indicator tube (around 5 seconds).
indicator tube (around 5 seconds).
Note: When “DEMO PLAY” is displayed, the DEMO play lock is not
released by turning power on/off with the [?/1] button.
NOTE OF REPLACING THE IC102 AND IC103 ON
THE DMB-FIT BOARD
IC102 and IC103 on the DMB-FIT board cannot exchange with
single. When IC102 and IC103 on the DMB-FIT board is dam-
aged, exchange the entire mounted board.
THE DMB-FIT BOARD
IC102 and IC103 on the DMB-FIT board cannot exchange with
single. When IC102 and IC103 on the DMB-FIT board is dam-
aged, exchange the entire mounted board.
MODEL IDENTIFICATION
– Rear View –
– Rear View –
Part No.
BEGIN IT BEFORE THE REPAIR (HCD-F200)
When the HCD-F200 is checked, connect to SA-WSF200 (for ac-
tive speaker of DAV-F200).
Be sure in advance the SA-WSF200 is prepared.
When the HCD-F200 is checked, connect to SA-WSF200 (for ac-
tive speaker of DAV-F200).
Be sure in advance the SA-WSF200 is prepared.
BEGIN IT BEFORE THE REPAIR (HCD-F500)
When the HCD-F500 is checked, cannot to SA-WSF500 (for ac-
tive speaker of DAV-F500).
Be sure in advance the SA-WSF500 is prepared.
When the HCD-F500 is checked, cannot to SA-WSF500 (for ac-
tive speaker of DAV-F500).
Be sure in advance the SA-WSF500 is prepared.
Ver. 1.1