Read Sony DAR-X1R / HCD-X1R Service Manual online
HCD-X1R
29
29
HCD-X1R
•
Note for Printed Wiring Boards and Schematic Diagrams
•
RD-60AU board is multi-layer printed board.
However, the patterns of intermediate-layer have not been
included in diagram.
However, the patterns of intermediate-layer have not been
included in diagram.
•
Indication of transistor
C
B
These are omitted.
E
Q
•
Circuit Boards Location
Note on Schematic Diagram:
•
All capacitors are in
µ
F unless otherwise noted. (p: pF)
50 WV or less are not indicated except for electrolytics
and tantalums.
and tantalums.
•
All resistors are in
Ω
and
1
/
4
W or less unless otherwise
specified.
•
C
: panel designation.
Note: The components identified by mark
0
or dotted line
with mark
0
are critical for safety.
Replace only with part number specified.
•
A
: B+ Line.
•
B
: B– Line.
•
Voltages and waveforms are dc with respect to ground
under no-signal conditions.
no mark : DVD PLAY
under no-signal conditions.
no mark : DVD PLAY
∗
: Impossible to measure
•
Voltages are taken with a VOM (Input impedance 10 M
Ω
).
Voltage variations may be noted due to normal produc-
tion tolerances.
tion tolerances.
•
Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal produc-
tion tolerances.
Voltage variations may be noted due to normal produc-
tion tolerances.
•
Circled numbers refer to waveforms.
•
Signal path.
J
: PB (AUDIO)
c
: REC (AUDIO)
F
: PB (CHROMA)
L
: PB (Y)
g
: PB (CHROMA/Y)
f
: REC (CHROMA)
h
: REC (Y)
i
: REC (CHROMA/Y)
Note on Printed Wiring Board:
•
X
: parts extracted from the component side.
•
Y
: parts extracted from the conductor side.
•
: Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
Caution:
Pattern face side:
Pattern face side:
Parts on the pattern face side seen from
(Conductor Side)
the pattern face are indicated.
Parts face side:
Parts on the parts face side seen from
(Component Side) the parts face are indicated.
Caution:
Pattern face side:
Pattern face side:
Parts on the pattern face side seen from
(Side B)
the pattern face are indicated.
Parts face side:
Parts on the parts face side seen from
(Side A)
the parts face are indicated.
•
The voltage and waveform of CSP (chip size package)
cannot be measured, because its lead layout is different
from that of conventional IC.
cannot be measured, because its lead layout is different
from that of conventional IC.
*
Replacement of IC103 on the RD-60AU board used in
this set requires a special tool.
this set requires a special tool.
surface
•
Lead Layouts
*
Replacement of IC103 on the RD-60AU board used in
this set requires a special tool.
this set requires a special tool.
Lead layout of conventional IC CSP (chip size package)
POWER SW board
KEY board
PANEL L board
PANEL R board
CHUKEI board
RD-60AU board
POWER block
ER board
AV-103AU board
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