CMT-SE9, MDS-SE9 - Sony Audio Service Manual (repair manual)

MDS-SE9 is MD deck and Tape deck
section in CMT-SE9.

Model Name Using Similar Mechanism

HCD-CP505

MD Mechanism Type

MDM-7S2D

Optical Pick-up Type

KMS-262E

Model Name Using Similar Mechanism

NEW

Tape Transport Mechanism Type

CMAL2Z8

MD

Section

Tape deck

Section

System

Minidisc digital audio 
system

Laser

Semiconductor laser 
(

λ=780 nm) 

Emission duration: 
continuous

Sampling frequency

44.1 kHz

Frequency response

5 Hz – 20 kHz

Recording system

4-track 2-channel stereo

Frequency response

50 – 13,000 Hz, using 
Sony TYPE I cassettes

Power requirements

230 V AC, 50/60 Hz

Power consumption

13 W

Dimensions(w/h/d)

Approx. 155 

× 120 × 345 mm

Mass

Approx. 4.0 kg

Design and specifications are subject to change 
without notice.

UK Model

2004B1678-1

© 2004.02

2

0

0

This appliance is
classified as a CLASS 1
LASER product. This
label is located on the
rear exterior.

The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.

Never look into the laser diode emission from right above when
checking it for adjustment. It is feared that you will lose your sight.

Laser component in this product is capable
of emitting radiation exceeding the limit for
Class 1.

• Keep the temperature of the soldering iron around 270 ˚C dur-

ing repairing.

• Do not touch the soldering iron on the same conductor of the

circuit board (within 3 times).

• Be careful not to apply force on the conductor when soldering

or unsoldering.

• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be

damaged by heat.

Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)

Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40°C higher than

ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350°C.
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!

• Strong viscosity

Unleaded solder is more viscous (sticky, less prone to flow) than
ordinary solder so use caution not to let solder bridges occur such
as on IC pins, etc.

• Usable with ordinary solder

It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.

MDS-SE9 does not operate independently. HCD-SE9 is required to operate this.
In this case of a service, please connect HCD-SE9.

Incorrect operations may be performed if the test mode is not entered properly.
In this case, press the  ?/1  button to turn the power off, and retry to enter the test mode.

3

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········································································ 13

······························································ 15

3-1.

Top Cover ··································································· 16

3-2.

Front Panel Section ···················································· 16

3-3.

PANEL Board ···························································· 17

3-4.

Power Transformer ····················································· 17

3-5.

MD DIGITAL Board ·················································· 18

3-6.

MD Mechanism Deck (MDM-7S2D) ························ 18

3-7.

Holder Assy ································································ 19

3-8.

BD Board ··································································· 19

3-9.

Loarding Motor, Spindle Motor, Sled Motor ············· 20

3-10. Over Write Head (HR901) ········································· 20
3-11. Optical Pick-up (KMS-262E) ···································· 21
3-12. Bracket (MDM) ·························································· 21
3-13. MAIN Board ······························································ 22
3-14. POWER Board ··························································· 22
3-15. Tape Mechanism Deck ··············································· 23

···································································· 24

····························· 28

TAPE SECTION ·································································· 28
MD SECTION ····································································· 30

······································································ 41

7-1.

Block Diagrams
– Main Section – ························································ 42
– MD Section – ·························································· 43
– USB Section – ························································· 44

7-2.

Printed Wiring Board – BD Board – ·························· 45

7-3.

Schematic Diagram – BD Board (1/2) – ···················· 46

7-4.

Schematic Diagram – BD Board (2/2) – ···················· 47

7-5.

Printed Wiring Board – MAIN Board (Side A) – ······ 48

7-6.

Printed Wiring Board – MAIN Board (Side B) – ······ 49

7-7.

Schematic Diagram – MAIN Board (1/2) – ··············· 50

7-8.

Schematic Diagram – MAIN Board (2/2) – ··············· 51

7-9.

Printed Wiring Board – MD DIGITAL Board – ········ 52

7-10. Schematic Diagram – MD DIGITAL Board – ··········· 53
7-11. Printed Wiring Board – PANEL Board – ··················· 54
7-12. Schematic Diagram – PANEL Board – ······················ 55
7-13. Printed Wiring Board – POWER Board – ·················· 56
7-14. Schematic Diagram – POWER Board – ···················· 57
7-15.  IC Pin Function Description ······································ 61

8-1.

Overall Section ··························································· 64

8-2.

Front Panel Section ···················································· 65

8-3.

Chassis Section ·························································· 66

8-4.

MD Mechanism Deck Section-1 (MDM-7S2D) ········ 67

8-5.

MD Mechanism Deck Section-2 (MDM-7S2D) ········ 68

······································· 69

4

This system has a Self-diagnosis display 
function to let you know if there is a system 
malfunction. The display shows a code made up 
of three or five letters and a message alternately 
to show you the problem. To solve the problem 
refer to the following list. If any problem 
persists, consult your nearest Sony dealer. 

The MD is protected against erasure.

cRemove the MD and slide the tab to close the slot. 

You tried to record a disc with a format that the 
system does not support, such as a CD-ROM.

cRemove the disc and turn off the system once, 

then turn it on again.

You tried to record sound that cannot be digitally 
recorded with this system from a connected optional 
component.

cSwitch the digital audio output of the optional 

component to PCM mode.

Recording could not be performed properly.

cMove the system to a stable place, and start 

recording over from the beginning.

The MD is dirty or scratched, or the MD does not 
meet the standards.

cReplace the MD and start recording over from the 

beginning.

The MD deck cannot read the disc information 
properly.

cRemove the MD once, then insert it again.

The MD deck cannot read the disc information 
properly.

cReplace the MD.

cErase all the recorded contents of the MD using 

the All Erase Function.

The sound source is a copy of a commercially 
available music software or CD-R.

cThe Serial Copy Management System prevents 

making a digital copy.  In addition, you cannot 
copy from a CD-R. 

The digital optical cable is disconnected, or the 
power of the connected component is turned off 
while recording the digital audio from an optional 
component connected to the VIDEO/SAT 
DIGITAL IN OPTICAL jack or a CD.

cConnect the digital optical cable, or turn on the 

power of the connected component.

The DVD player and the MD deck are not 
connected correctly with the digital optical cable, or 
you tried to start the recording immediately afte r 
setting the recording pause mode when making a 
digital recording from a optional component 
connected to the VIDEO/SAT DIGITAL IN 
OPTICAL jack or a CD.

cConnect the digital optical cable correctly, or wait 

for several seconds in the recording pause mode 
before starting the recording.

The component has internal problem.

cConsult your nearest Sony dealer.

There is a problem with the laser pickup.

cThe laser pickup may be damaged. Consult your 

nearest Sony dealer.

There is a problem with loading.

cConsult your nearest Sony dealer.