CMT-NEZ7DAB, HCD-NEZ7 - Sony Audio Service Manual (repair manual). Page 2

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2
HCD-NEZ7
Notes on chip component replacement
Never reuse a disconnected chip component.
Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
Keep the temperature of the soldering iron around 270 ˚C
during repairing.
Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
Be careful not to apply force on the conductor when soldering
or unsoldering.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radiation
exposure.
SAFETY-RELATED  COMPONENT  WARNING!!
COMPONENTS  IDENTIFIED  BY  MARK 
 0
  OR  DOTTED  LINE
WITH  MARK  
0
  ON  THE  SCHEMATIC  DIAGRAMS  AND  IN
THE  PARTS  LIST  ARE  CRITICAL  TO  SAFE  OPERATION.
REPLACE  THESE  COMPONENTS  WITH  SONY  PARTS  WHOSE
PART  NUMBERS  APPEAR  AS  SHOWN  IN  THIS  MANUAL  OR
IN  SUPPLEMENTS  PUBLISHED  BY  SONY.
The following caution label is located inside the unit.
This appliance is 
classified as a CLASS 1 
LASER product. This 
marking is located on the 
rear exterior.
L-Band 
Frequency
Label
1,452.960 MHz
LA
1,454.672 MHz
LB
1,456.384 MHz
LC
1,458.096 MHz
LD
1,459.808 MHz
LE
1,461.520 MHz
LF
1,463.232 MHz
LG
1,464.944 MHz
LH
1,466.656 MHz
LI
1,468.368 MHz
LJ
1,470.080 MHz
LK
1,471.792 MHz
LL
1,473.504 MHz
LM
1,475.216 MHz
LN
1,476.928 MHz
LO
1,478.640 MHz
LP
1,480.352 MHz
LQ
1,482.064 MHz
LR
1,483.776 MHz
LS
1,485.488 MHz
LT
1,487.200 MHz
LU
1,488.912 MHz
LV
1,490.624 MHz
LW
Note
L-Band is not available for the UK model.
General
Power requirements
AC 230 V, 50/60 Hz
Power consumption
50 W
0.3 W (in Power Saving 
Mode)
Dimensions (w/h/d) 
Approx. 164 
×
235 
×
265 mm
Mass  
Approx. 
3.6 
kg
Design and specifications are subject to change 
without notice.
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