BM-23MK2 - Sony Audio Service Manual (repair manual). Page 2

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2
BM-23MK2
Notes on chip component replacement
Never reuse a disconnected chip component.
Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
Keep the temperature of soldering iron around 270˚C during
repairing.
Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
Be careful not to apply force on the conductor when soldering
or unsoldering.
TABLE OF CONTENTS
1.
SERVICING  NOTES
...............................................
3
2.
GENERAL
...................................................................
4
3.
DISASSEMBLY
3-1.
Disassembly Flow ...........................................................
5
3-2.
Cabinet (Rear) Block Assembly ......................................
6
3-3.
Control Panel Block Assembly ........................................
7
3-4.
AUDIO Board ..................................................................
8
3-5.
Mechanism Deck (MB-23MK2-101) ..............................
9
3-6.
Holder Panel Assembly ...................................................
9
4.
MECHANICAL ADJUSTMENTS
......................... 10
5.
ELECTRICAL ADJUSTMENTS
.......................... 10
6.
DIAGRAMS
6-1.
Block Diagram – AUDIO Section – ................................ 13
6-2.
Printed Wiring Boards ..................................................... 14
6-3.
Schematic Diagram – AUDIO Board (1/4) – .................. 15
6-4.
Schematic Diagram – AUDIO Board (2/4) – .................. 16
6-5.
Schematic Diagram – AUDIO Board (3/4) – .................. 17
6-6.
Schematic Diagram – AUDIO Board (4/4) – .................. 18
6-7.
Schematic Diagram – LCD Board  – ............................... 19
7.
EXPLODED VIEWS
7-1.
Cabinet Section ................................................................ 22
7-2.
Chassis Section ................................................................ 23
7-3.
Mechanism Deck Section-1 (MB-23MK2-101) .............. 24
7-4.
Mechanism Deck Section-2 (MB-23MK2-101) .............. 25
8.
ELECTRICAL PARTS LIST
.................................. 26
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
Unleaded solder melts at a temperature about 40 
°
C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 
°
C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
Strong viscosity
Unleaded solder is more viscou-s (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radiation
exposure.
SAFETY-RELATED  COMPONENT  WARNING!!
COMPONENTS  IDENTIFIED  BY  MARK  
0
  OR  DOTTED  LINE
WITH  MARK  
0
  ON  THE  SCHEMATIC  DIAGRAMS  AND  IN
THE  PARTS  LIST  ARE  CRITICAL  TO  SAFE  OPERATION.
REPLACE  THESE  COMPONENTS  WITH  SONY  PARTS  WHOSE
PART  NUMBERS  APPEAR  AS  SHOWN  IN  THIS  MANUAL  OR
IN  SUPPLEMENTS  PUBLISHED  BY  SONY.
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