BDV-E670W, BDV-E970W, HBD-E970W - Sony Audio Service Manual (repair manual). Page 34

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HBD-E670W/E970W
HBD-E670W/E970W
34
34
For Schematic Diagrams.
Note:
•  All capacitors are in μF unless otherwise noted. (p: pF) 50 
WV or less are not indicated except for electrolytics and 
tantalums.
•  All resistors are in Ω and 1/4 W or less unless otherwise 
specifi ed.
•      f  : Internal component.
•  2 : Nonfl ammable resistor.
•  5 : Fusible resistor.
•  C : Panel designation.
THIS  NOTE  IS  COMMON  FOR  PRINTED  WIRING  BOARDS  AND  SCHEMATIC DIAGRAMS.
(In addition to this, the necessary note is printed in each block.)
•  A : B+ Line.
•  B : B– Line.
•  Voltages and waveforms are dc with respect to ground 
under no-signal conditions.
  – MB-134 board –
  no mark : BD PLAY
       
*
  : Impossible to measure
  – Other board –
  no mark : TUNER
       
*
  : Impossible to measure
•  Voltages are taken with VOM (Input impedance 10 M
Ω).
  Voltage variations may be noted due to normal production 
tolerances.
•  Waveforms are taken with a oscilloscope.
  Voltage variations may be noted due to normal production 
tolerances.
•  Circled numbers refer to waveforms.
•  Signal path.
  F 
: AUDIO
  E 
: VIDEO
  J 
: DISC PLAY
  L  : USB
  d 
: LAN
  f 
: TUNER
  N 
: MIC
• Abbreviation
  CH 
: Chinese model
 RU  : Russian model
  TW 
: Taiwan model
•  The voltage and waveform of CSP (chip size package) 
cannot be measured, becaise its lead layout is different 
from that of conventional IC.
For Printed Wiring Boards.
Note:
•  X : Parts extracted from the component side.
•  Y : Parts extracted from the conductor side.
•      f  : Internal component.
• 
 : Pattern from the side which enables seeing.
  (The other layers' patterns are not indicated.)
•  Indication of transistor.
 
C
B
These are omitted. 
E
Q
 
B
These are omitted.
C E
Q
•  Lead layouts
surface 
CSP (Chip Size Package) 
Lead layout of conventional IC 
Caution:
Pattern face side:
(Conductor Side)
Parts face side: 
(Component Side)
Parts on the pattern face side seen 
from the pattern face are indicated.
Parts on the parts face side seen from 
the parts face are indicated.
•  MAIN and MB-134 boards are multi-layer printed board. 
However, the patterns of intermediate-layers have not 
been included in this diagrams.
• Circuit Boards Location
Note 2: When the POWER board is replaced, spread the compound 
referring to “NOTE OF REPLACING THE D913, D931, 
IC901 AND IC921 ON THE POWER BOARD AND THE 
COMPLETE POWER BOARD” on servicing notes (page 9).
Note 2: When the POWER board is replaced, spread the compound 
referring to “NOTE OF REPLACING THE D913, D931, 
IC901 AND IC921 ON THE POWER BOARD AND THE 
COMPLETE POWER BOARD” on servicing notes (page 9).
Note 1: When the MAIN board is replaced, spread the compound 
referring to “NOTE OF REPLACING THE IC3100 AND 
IC3200 ON THE MAIN BOARD AND THE COMPLETE 
MAIN BOARD” on servicing notes (page 8).
Note 1: When the MAIN board is replaced, spread the compound 
referring to “NOTE OF REPLACING THE IC3100 AND 
IC3200 ON THE MAIN BOARD AND THE COMPLETE 
MAIN BOARD” on servicing notes (page 8).
AUDIO board
MB-134 board
R-USB board
F-USB board
MAIN board
REG board
TUNER (FM) (TU1)
INCLUDE board
POWER board
KEY board
P-KEY board
FL board
• Abbreviation
  RU 
: Russian model
  TW 
: Taiwan model
Note: 
The components identi-
fi
 ed by mark 0 or dotted 
line with mark 0 are criti-
cal for safety. 
Replace only with part 
number specifi ed.
Ver. 1.1
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