HKTS 210SUB - Harman Kardon Audio EMC - CB Certificate (repair manual). Page 10

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Page 10 of 56 
 
Report No.1018947 
  
IEC60065  
Clause 
Requirement + Test 
Result - Remark 
Verdict 
 
 
TRF No. IEC60065J 
10 Insulation 
requirements 
 
10.1 
Insulation resistance (MΩ) at least 2 MΩ min. after 
surge test for basic and 4 MΩ min. for reinforced 
insulation .................................................................: 
 N/A 
10.2 
Humidity treatment 48 h or 120 h  ...........................: 48 
10.3 
Insulation resistance and dielectric strength 
between mains terminals  
(see appended table 10.3) 
 
Insulation Resistance and dielectric strength across 
BASIC or SUPPLEMENTARY insulation (Class 1)  
 N/A 
 
Insulation resistance and dielectric strength across 
REINFORCED insulation (Class II)  
(see appended table 10.3) 
 
11 Fault 
conditions 
 
11.1 
No shock hazard under fault condition  
 
11.2 
Heating under fault condition  
 
 
Flames extinguish within 10 seconds  
 
N/A 
 
No hazard from softening solder  
 
 
Soldered terminations not used  as protective mechanism 
 N/A 
11.2.1 
Measurement of temperature rises  
(see appended table 11.2) 
11.2.2 
Temperature rise of accessible parts  
(see appended table 11.2) 
11.2.3 
Temperature rise of parts, other than windings, 
providing electrical insulation  
(see appended table 11.2) 
 
Temperature rise of printed circuit boards (PCB) 
exceeding the limits of table 3 by max. 100 K for 
max. 5 min  
 N/A 
 
a) Temperature rise of printed circuit boards (PCB) 
to 20.1.3, exceeding the limits of table 3 by not 
more than 100 K for an area not greater than 2 cm² 
 N/A 
 
b) Temperature rise of printed circuit boards (PCB) 
to 20.1.3 up to 300 K for an area not greater than 
2 cm² for a maximum of 5 min  
 N/A 
 
Meets all the special conditions if conductors on 
printed circuit boards are interrupted  
 N/A 
 
Class I protective earthing maintained  
 
N/A 
11.2.4 
Temperature rise of parts acting as a support or  
mechanical barrier  
 P 
11.2.5 
Temperature rise of windings  
(see appended table 11.2) 
11.2.6 
Temperature rise of parts not subject to the limits of 
11.2.1 to 11.2.5  
(see appended table 11.2) 
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