Read JBL SB 200 (serv.man3) EMC - CB Certificate online
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Report No.: 350-120155AX
TRF No. IEC60065K
List of Attachments (including a total number of pages in each attachment):
Manufacturer’s Declaration: 1 sheet
Photograph: 7 sheet(s) / 14 Fig(s).
Summary of testing:
1. The sample tested complies with the requirements of the test specification.
2. Model CINEMA STV200 is identical to model CINEMA SB200 except for model designation and market.
1. The sample tested complies with the requirements of the test specification.
2. Model CINEMA STV200 is identical to model CINEMA SB200 except for model designation and market.
Unless otherwise specified, all tests were performed on model CINEMA SB200.
3. The subject model as above is a Cinema Powered Soundbar Speaker Based on applicant’s testing
instruction and all requirements were tested on an open bench.
4. Power Transformers (T5311-1) were made by these factories, Jingquanli / Sunshine / Haixinxing, there
are the same winding specifications and electrical characteristics. Accordingly all tests were conducted
on as follows.
on as follows.
Haixinxing / BCK-03EC28.
5. Following symbols and abbreviations are used in this test report.
S/C= Short-Circuit
O/C= Open-Circuit
O/L= Overload
MT= Mains Transformer TW= Transformer Winding (measured by resistance method)
TC= Transformer Core
TC= Transformer Core
TP= Thermal Protector
NH= No Hazard Occurred NFR= No Further Results existed
TRSR = Test Repeated Similar Results as just before the test
NCH= No component Heated higher than Heating under normal operating condition, CL. 7.
NCD= No component Damaged.
CD (X)= Component Damaged. (X: damage component ID indicated)
CH (X)= Component Heated (X: heated component ID indicated) and thermally stabilized.
+ = total overheated areas of the printed board(s) are not larger than 2 cm².
LC= Lead Connection on the printed board
PCB= Printed Circuit Board
IE= Inside of Enclosure
TRSR = Test Repeated Similar Results as just before the test
NCH= No component Heated higher than Heating under normal operating condition, CL. 7.
NCD= No component Damaged.
CD (X)= Component Damaged. (X: damage component ID indicated)
CH (X)= Component Heated (X: heated component ID indicated) and thermally stabilized.
+ = total overheated areas of the printed board(s) are not larger than 2 cm².
LC= Lead Connection on the printed board
PCB= Printed Circuit Board
IE= Inside of Enclosure
OE= Outside of Enclosure
KH= Knob, Handle
PW= Primary Wire
IB=Insulating Barrier
E = Emitter
C = Collector
B = Base
* = Determined by the method specified in Note f to Table 3.
Tests performed (name of test and test clause):
Full tests.
Testing location:
See CB Testing Laboratory information.
See CB Testing Laboratory information.
Summary of compliance with National Differences
List of countries addressed:
EN, AU, NZ, KR, MY, UA, JP
SG, KE, BR, RU (no national differences in CB-Bulletin)
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