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KLV-MV32M1 (CH) 4
TABLE OF CONTENTS
1. DISASSEMBLY ............................................. 1-1
1-1.
STAND REMOVAL .......................................... 1-1
1-2.
REAR CABINET ASSY REMOVAL ............... 1-1
1-3.
BL BOARD REMOVAL ................................... 1-2
1-4.
GL BOARD REMOVAL ................................... 1-2
1-5.
ULG BOARD REMOVAL ................................ 1-3
1-6.
AE BOARD REMOVAL ................................... 1-3
1-7.
LCD PANEL REMOVAL ................................. 1-4
1-8.
H1 AND H3 BOARDS REMOVAL ................. 1-5
1-9.
H2 BOARD REMOVAL ................................... 1-5
2. ADJUSTMENT .............................................. 2-1
2-1.
AGING ................................................................ 2-1
2-1-1. Aging setting .................................................. 2-1
2-1-2. Aging condition ................................................ 2-1
2-2.
ADJUSTMENT OF SIGNAL LEVEL .............. 2-1
2-2-1. Check AD (2163 case) calibration
registration items .......................................... 2-1
2-2-2. Y signal AD calibration of 2163 decode ...... 2-1
2-2-3. C signal AD calibration of 2163 decode ...... 2-1
2-2-4. Check AD (CCP2 case) calibration
registration items .......................................... 2-2
2-2-5. Y signal AD calibration of CCP2 decode .... 2-2
2-2-6. C signal AD calibration of CCP2 decode .... 2-2
2-2-7. Check AD (Component case) calibration
registration items ............................................ 2-2
2-2-8. Y signal AD calibration of component input
........................................................................ 2-2
2-2-9. C signal AD calibration of componet input
........................................................................ 2-2
2-3.
WHITE BALANCE ADJUSTMENT ................ 2-3
2-3-1. White balance of Color temperature “Cool”
........................................................................ 2-3
2-3-2. White balance of Color temperature “Normal”
........................................................................ 2-3
2-3-3. White balance of Color temperatur “Warm”
........................................................................ 2-4
3. DIAGRAMS ................................................... 3-1
3-1.
BLOCK DIAGRAMS ........................................ 3-1
3-2.
FRAME DIAGRAMS ........................................ 3-5
3-3.
CIRCUIT BOARDS LOCATION ..................... 3-6
3-4.
SCHEMATIC DIAGRAMS AND
PRINTED WIRING BOARDS ........................ 3-6
(1)
Schematic Diagram of AE Board .................. 3-7
(2)
Schematic Diagram of BL Board .................. 3-13
(3)
Schematic Diagram of GL Board .................. 3-19
(4)
Schematic Diagram of H1 and H2 Boards .... 3-21
(5)
Schematic Diagram of H3 Board .................. 3-22
(6)
Schematic Diagram of ULE Board ................ 3-23
3-5.
SEMICONDUCTORS ....................................... 3-27
4. EXPLODED VIEWS ...................................... 4-1
4-1.
REAR CABINET ASSY AND STAND ........... 4-2
4-2.
CHASSIS-1 ........................................................ 4-3
4-3.
CHASSIS-2 ........................................................ 4-4
4-4.
BEZEL ASSY .................................................... 4-5
4-5.
PACKING MATERIALS .................................. 4-6
5. ELECTRICAL PARTS LIST ......................... 5-1
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