Read Sony KDF-50E2000 / KDF-50E2010 Service Manual online
- 1 -
KDF-E50A2000/2010
RM-ED007
SERVICE MANUAL
LE-4C
CHASSIS
MODEL
COMMANDER
DEST
KDF-50E2000
RM-ED007
UK
RM-ED007
KDF-50E2000/KDF-50E2010
LCD PROJECTION TV
MODEL
COMMANDER
DEST
KDF-50E2010
RM-ED007
UK
KDF-50E2010
RM-ED007
AEP
KDF-50E2000
RM-ED007
AEP
- 2 -
KDF-E50A2000/2010
RM-ED007
TABLE OF CONTENTS
Section
Title
Page
Section
Title
Page
Caution ................................................................
3
Specifications ......................................................
4
Connectors ..........................................................
5
1. SELF DIAGNOSIS FUNCTION
LE-4C Self Diagnostic Software ........................
6
2. GENERAL ...................................................................
8
3. DISASSEMBLY
3-1.
Rear Cover Removal ..........................................
23
3-2.
Pillar Removal ....................................................
23
3-3.
Main Bracket Cover Removal ............................
23
3-4.
Main Bracket Removal ......................................
23
3-5.
Service Position .................................................
24
3-6.
TBD, J, AG, X Boards ......................................
24
3-7.
Power Block Removal ........................................
24
3-8.
Optical Unit .........................................................
24
3-9.
C Board Removal ................................................
25
3-10. Screen, Mirror Block Assembly Removal ..........
25
3-11. Mirror Cover Block Assembly Removal ............
26
3-12. Mirror Removal ..................................................
26
3-13. Contrast Screen, Diffusion Plate Removal .........
27
3-14. H3 Removal ........................................................
27
3-15. Speaker Removal ................................................
27
4. SET-UP ADJUSTMENTS
4-1.
Service Mode Adjustment ..................................
28
4-2.
Using the Remote Commander to Change
Service Data ........................................................
29
4-3.
Test Test Mode ...................................................
29
5. DIAGRAMS
5-1.
Block Diagrams (1) ............................................
30
Block Diagrams (2) ............................................
31
Block Diagrams (3) ............................................
32
Block Diagrams (4) ............................................
33
Block Diagrams (5) ............................................
34
Block Diagrams (6) ............................................
35
Block Diagrams (7) ............................................
36
5-2.
Circuit Boards Location ......................................
36
5-3.
Schematic Diagrams and Printed Wiring
Boards .................................................................
36
AG Board Schematic Diagram ...........................
37
AG Printed Wiring Board .................................
39
C Board Schematic Diagram ...............................
41
C Printed Wiring Board ....................................
45
J Board Schematic Diagram ................................
46
J Printed Wiring Board .....................................
48
H1 Schematic Diagram .......................................
49
H1 Printed Wiring Board ..................................
50
H2 Board Schematic Diagram ............................
49
H2 Printed Wiring Board ..................................
50
H3 Board Schematic Diagram ............................
49
H3 Printed Wiring Board ..................................
50
T1 Board Schematic Diagram ...........................
49
T1 Printed Wiring Board ..................................
50
T2 Board Schematic Diagram ...........................
49
T2 Printed Wiring Board ..................................
50
X Board Schematic Diagram ..............................
51
X Printed Wiring Board ....................................
52
S2 Board Schematic Diagram .............................
51
S2 Printed Wiring Board ..................................
52
TBD Board Schematic Diagram .........................
53
TBD Printed Wiring Board ...............................
64
5-4.
Semiconductors ..................................................
66
6. EXPLODED VIEWS
6-1.
Screen, Covers ..................................................
69
6-2.
Chassis Assembly ...............................................
70
6-3.
Optics Unit Block Assembly and
Lamp Assembly ..................................................
71
7. ELECTRICAL PARTS LIST ..................................
72
SAFETY-RELATED COMPONENT WARNING !!
COMPONENTS IDENTIFIED BY SHADING AND MARKED
ON
THE SCHEMATIC DIAGRAMS, EXPLODED VIEWS AND IN THE
PARTS LIST ARE CRITICAL FOR SAFE OPERATION. REPLACE
THESE COMPONENTS WITH SONY PARTS WHOSE PART
NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN
SUPPLEMENTS PUBLISHED BY SONY.
PARTS LIST ARE CRITICAL FOR SAFE OPERATION. REPLACE
THESE COMPONENTS WITH SONY PARTS WHOSE PART
NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN
SUPPLEMENTS PUBLISHED BY SONY.
WARNING !!
AN ISOLATION TRANSFORMER SHOULD BE USED DURING
ANY SERVICE WORK TO AVOID POSSIBLE SHOCK HAZARD
DUE TO LIVE CHASSIS, THE CHASSIS OF THIS RECEIVER IS
DIRECTLY CONNECTED TO THE POWER LINE.
ANY SERVICE WORK TO AVOID POSSIBLE SHOCK HAZARD
DUE TO LIVE CHASSIS, THE CHASSIS OF THIS RECEIVER IS
DIRECTLY CONNECTED TO THE POWER LINE.
- 3 -
KDF-E50A2000/2010
RM-ED007
The circuit boards used in these models have been processed using
Lead Free Solder. The boards are identified by the LF logo located
close to the board designation e.g. F1, H1 etc [ see examples ]. The
servicing of these boards requires special precautions to be taken as
outlined below.
Lead Free Solder. The boards are identified by the LF logo located
close to the board designation e.g. F1, H1 etc [ see examples ]. The
servicing of these boards requires special precautions to be taken as
outlined below.
CAUTION
Lead Free Soldered Boards
example 1
example 2
It is strongly recommended to use Lead Free Solder material in order to guarantee optimal quality of new solder joints. Lead Free Solder is
available under the following part numbers :
available under the following part numbers :
Due to the higher melting point of Lead Free Solder the soldering iron tip temperature needs to be set to 370 degrees centigrade. This requires
soldering equipment capable of accurate temperature control coupled with a good heat recovery characteristics.
soldering equipment capable of accurate temperature control coupled with a good heat recovery characteristics.
For more information on the use of Lead Free Solder, please refer to http://www.sony-training.com
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