Read Sony HDR-TD30 / HDR-TD30E / HDR-TD30V / HDR-TD30VE Service Manual online
SERVICE MANUAL
Check the SERVICE NOTE (LEVEL 2) before the service.
Revision History
Published by Sony Techno Create Corporation
Sony Corporation
LEVEL
3
HDR-TD30/TD30E/TD30V/TD30VE_L3
983472211.pdf
3D Digital HD Video Camera Recorder
The components identified by mark
0 or dotted line with mark 0 are
critical for safety.
Replace only with part number
specified.
0 or dotted line with mark 0 are
critical for safety.
Replace only with part number
specified.
Les composants identifiés par une
marque
marque
0 sont critiques pour la
sécurité.
Ne les remplacer que par une
pièce portant le numéro spécifié.
Ne les remplacer que par une
pièce portant le numéro spécifié.
9-834-722-11
US Model
Canadian Model
AEP Model
North European Model
E Model
Australian Model
Hong Kong Model
Chinese Model
Korea Model
Tourist Model
Ver.
Date
History
Contents
S.M. Rev.
issued
1.0
2013.01
Official Release
—
—
2013A08-1
© 2013.01
N
HDR-TD30/TD30E/TD30V/TD30VE
Ver. 1.0 2013.01
Photo: HDR-TD30V
– 2 –
HDR-TD30/TD30E/TD30V/TD30VE_L3
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH
MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST
ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPO-
NENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS
SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY
SONY.
MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST
ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPO-
NENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS
SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY
SONY.
ATTENTION AU COMPOSANT AYANT RAPPORT
À LA SÉCURITÉ!
LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE 0 SUR LES
DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES SONT
CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE REM-
PLACER CES COMPOSANTS QUE PAR DES PIÈCES SONY DONT
LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU DANS LES
SUPPLÉMENTS PUBLIÉS PAR SONY.
DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES SONT
CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE REM-
PLACER CES COMPOSANTS QUE PAR DES PIÈCES SONY DONT
LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU DANS LES
SUPPLÉMENTS PUBLIÉS PAR SONY.
Caution
Danger of explosion if battery is incorrectly replaced.
Replace only with the same or equivalent type.
Dispose of used batteries according to the instructions.
Replace only with the same or equivalent type.
Dispose of used batteries according to the instructions.
SAFETY CHECK-OUT
After correcting the original service problem, perform the following
safety checks before releasing the set to the customer.
1. Check the area of your repair for unsoldered or poorly-soldered
connections. Check the entire board surface for solder splashes and
bridges.
bridges.
2. Check the interboard wiring to ensure that no wires are “pinched”
or contact high-wattage resistors.
3. Look for unauthorized replacement parts, particularly transistors,
that were installed during a previous repair. Point them out to the
customer and recommend their replacement.
customer and recommend their replacement.
4. Look for parts which, through functioning, show obvious signs of
deterioration. Point them out to the customer and recommend their
replacement.
replacement.
5. Check the B+ voltage to see it is at the values specified.
6. Flexible Circuit Board Repairing
6. Flexible Circuit Board Repairing
• Set the soldering iron tip temperature to 350 °C approximately.
• Do not touch the soldering iron on the same conductor of the circuit
• Do not touch the soldering iron on the same conductor of the circuit
board (within 3 times).
• Be careful not to apply force on the conductor when soldering or
unsoldering.
UNLEADED SOLDER
This unit uses unleaded solder.
Boards requiring use of unleaded solder are printed with the lead free
mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with the
Boards requiring use of unleaded solder are printed with the lead free
mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with the
lead free mark due to their particular size.)
: LEAD FREE MARK
Be careful to the following points to solder or unsolder.
• Set the soldering iron tip temperature to 350 °C approximately.
If cannot control temperature, solder/unsolder at high temperature
for a short time.
for a short time.
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
Unleaded solder is more viscous (sticky, less prone to
flow) than ordinary solder so use caution not to let solder
bridges occur such as on IC pins, etc.
flow) than ordinary solder so use caution not to let solder
bridges occur such as on IC pins, etc.
• Be sure to control soldering iron tips used for unleaded solder and
those for leaded solder so they are managed separately. Mixing un-
leaded solder and leaded solder will cause detachment phenomenon.
leaded solder and leaded solder will cause detachment phenomenon.
2-1
Ref. No.
Part No.
Description
Ref. No.
Part No.
Description
HDR-TD30/TD30E/TD30V/TD30VE_L3
NOTE:
• -XX, -X mean standardized parts, so they may have some differ-
• -XX, -X mean standardized parts, so they may have some differ-
ences from the original one.
• Items marked “*” are not stocked since they are seldom required for
routine service. Some delay should be anticipated when ordering
these items.
these items.
• The mechanical parts with no reference number in the exploded
views are not supplied.
• Due to standardization, replacements in the parts list may be dif-
ferent from the parts specified in the diagrams or the components
used on the set.
used on the set.
• CAPACITORS:
uF:
uF:
μF
• COILS
uH:
uH:
μH
• RESISTORS
All resistors are in ohms.
METAL: metal-film resistor
METAL OXIDE: Metal Oxide-film resistor
F:
All resistors are in ohms.
METAL: metal-film resistor
METAL OXIDE: Metal Oxide-film resistor
F:
nonflammable
• SEMICONDUCTORS
In each case, u: μ, for example:
uA...:
In each case, u: μ, for example:
uA...:
μA... , uPA... , μPA... ,
uPB...
,
μPB... , uPC... , μPC... ,
uPD...,
μPD...
The components identified by mark 0
or dotted line with mark 0 are critical
for safety.
Replace only with part number specified.
Les composants identifiés par une mar-
que 0 sont critiques pour la sécurité.
Replace only with part number specified.
Les composants identifiés par une mar-
que 0 sont critiques pour la sécurité.
Ne les remplacer que par une pièce
portant le numéro spécifié.
portant le numéro spécifié.
When indicating parts by reference num-
ber, please include the board name.
ber, please include the board name.
A-1851-196-A CM-123 BOARD, COMPLETE (MAIN/SUB)
**********************
(All mounted parts are not supplied, but they are included in CM-123 COMPLETE
BOARD.)
BOARD.)
A-1865-655-A FP-1500 FLEXIBLE BOARD, COMPLETE
******************************
< CAPACITOR >
C101 1-112-717-91 CERAMIC
CHIP 1uF
10% 6.3V
< DIODE >
D101
6-502-193-01
DIODE SML-D12V8WT86SN
< IC >
IC102
6-600-629-01
IC RS-470
A-1865-656-A FP-1501 FLEXIBLE BOARD, COMPLETE
******************************
(TH001 is not supplied, but this is included in FP-1501 FLEXIBLE COMPLETE
BOARD.)
BOARD.)
< DIODE >
D0001
6-503-445-01
DIODE CL773SCW02SDWT
D0002
6-503-445-01
DIODE CL773SCW02SDWT
<
THERMISTOR
>
TH001
(Not supplied) THERMISTOR, NTC (SMD)
A-1865-657-A FP-1502 FLEXIBLE BOARD, COMPLETE
******************************
< CONNECTOR >
CN101 1-815-794-13 CONNECTOR
(MULTIPLE)
1-885-027-11
FP-1504 FLEXIBLE BOARD
********************
1-885-028-11
FP-1505 FLEXIBLE BOARD (MAIN/SUB)
********************
1-885-030-11
FP-1507 FLEXIBLE BOARD
********************
1-885-032-11
FP-1509 FLEXIBLE BOARD
********************
1-885-033-11
FP-1510 FLEXIBLE BOARD
********************
1-885-034-12
FP-1511 FLEXIBLE BOARD
********************
1-885-035-11
FP-1512 FLEXIBLE BOARD
********************
A-1865-435-A GP375
ASSY
(TD30V/TD30VE)
(Not supplied) GP-037 BOARD, COMPLETE (TD30V/TD30VE)
**********************
(All mounted parts and GP-037 COMPLETE BOARD are not supplied, but they are
included in GP375 ASSY.)
included in GP375 ASSY.)
A-1933-258-A JK-404 BOARD, COMPLETE (SERVICE)
******************************
(BT7901 is not included in JK-404 COMPLETE BOARD (SERVICE).)
< BATTERY HOLDER >
BH7901 1-251-928-21
SOCKET, BATTERY
< BATTERY >
BT7901 1-756-134-15
BATTERY, LITHIUM (SECONDARY)
< CAPACITOR >
C2601 1-165-989-11 CERAMIC
CHIP 10uF
10% 6.3V
C2602 1-165-989-11 CERAMIC
CHIP 10uF
10% 6.3V
C2603 1-114-582-91 CERAMIC
CHIP 0.1uF
10% 16V
C2604 1-114-582-91 CERAMIC
CHIP 0.1uF
10% 16V
C2607 1-112-717-91 CERAMIC
CHIP 1uF
10% 6.3V
C2608 1-164-937-11 CERAMIC
CHIP 0.001uF 10% 50V
C2609 1-112-717-91 CERAMIC
CHIP 1uF
10% 6.3V
C2610 1-164-937-11 CERAMIC
CHIP 0.001uF 10% 50V
C2611 1-116-403-91 CERAMIC
CHIP 10uF
10% 6.3V
C2612 1-165-908-11 CERAMIC
CHIP 1uF
10% 10V
C2613 1-165-884-91 CERAMIC
CHIP 2.2uF
10% 6.3V
C2614 1-114-582-91 CERAMIC
CHIP 0.1uF
10% 16V
C2615 1-114-582-91 CERAMIC
CHIP 0.1uF
10% 16V
C2616 1-165-908-11 CERAMIC
CHIP 1uF
10% 10V
C2617 1-112-717-91 CERAMIC
CHIP 1uF
10% 6.3V
C2618 1-112-717-91 CERAMIC
CHIP 1uF
10% 6.3V
C2619 1-112-300-91 CERAMIC
CHIP 4.7uF
10% 10V
C2620 1-114-582-91 CERAMIC
CHIP 0.1uF
10% 16V
C2621 1-114-582-91 CERAMIC
CHIP 0.1uF
10% 16V
C7505 1-114-582-91 CERAMIC
CHIP 0.1uF
10% 16V
C7506 1-164-937-11 CERAMIC
CHIP 0.001uF 10% 50V
C7507 1-164-937-11 CERAMIC
CHIP 0.001uF 10% 50V
C7508 1-114-411-21 CERAMIC
CHIP 0.33uF 10% 6.3V
C7509 1-114-411-21 CERAMIC
CHIP 0.33uF 10% 6.3V
C7512 1-165-989-11 CERAMIC
CHIP 10uF
10% 6.3V
C7513 1-165-989-11 CERAMIC
CHIP 10uF
10% 6.3V
C7514 1-114-582-91 CERAMIC
CHIP 0.1uF
10% 16V
* C7515 1-112-746-11 CERAMIC CHIP 4.7uF
10%
6.3V
2-2. ELECTRICAL PARTS LIST
Caution
Danger of explosion if battery is incorrectly replaced.
Replace only with the same or equivalent type.
Dispose of used batteries according to the instructions.
Replace only with the same or equivalent type.
Dispose of used batteries according to the instructions.
Note 2: Replace the battery holder (BH7901) together when replac-
ing the lithium storage battery (BT7901) on the JK-404
board. (The battery holder removed once cannot be used
again.)
When mounting these parts, mount new battery holder first
and attach new lithium battery next.
board. (The battery holder removed once cannot be used
again.)
When mounting these parts, mount new battery holder first
and attach new lithium battery next.
Note1 : Be sure to read “Precautions for Replacement of Imager”
on page 6-1 when changing the imager.
CM-123
FP-1500
FP-1501
FP-1502
FP-1504
FP-1505
FP-1507
FP-1509
FP-1510
FP-1511
FP-1512
GP-037
JK-404
2-2
Ref. No.
Part No.
Description
Ref. No.
Part No.
Description
Ref. No.
Part No.
Description
Ref. No.
Part No.
Description
HDR-TD30/TD30E/TD30V/TD30VE_L3
C7901 1-164-935-11 CERAMIC
CHIP 470PF
10% 50V
C7902 1-164-935-11 CERAMIC
CHIP 470PF
10% 50V
C7903 1-114-582-91 CERAMIC
CHIP 0.1uF
10% 16V
C7904 1-114-582-91 CERAMIC
CHIP 0.1uF
10% 16V
C7908 1-218-990-81 SHORT
CHIP
0
< CONNECTOR >
* CN7901 1-821-501-11
CONNECTOR, FPC (ZIF) 51P
CN7902 1-816-645-61
FFC/FPC CONNECTOR (LIF) 14P
CN7903 1-816-655-61
CONNECTOR, FFC/FPC 8P
< FERRITE BEAD >
FB7901 1-400-927-31
BEAD, FERRITE (1005)
FB7902 1-400-927-31
BEAD, FERRITE (1005)
FB7903 1-400-833-21
SMD EMI FERRITE
FB7904 1-400-927-31
BEAD, FERRITE (1005)
FB7905 1-400-927-31
BEAD, FERRITE (1005)
FB7906 1-400-927-31
BEAD, FERRITE (1005)
FB7907 1-400-927-31
BEAD, FERRITE (1005)
FB7908 1-400-927-31
BEAD, FERRITE (1005)
< IC >
* IC2601 6-714-928-01
IC BD8871GW-E2
< JACK >
J7901 1-569-950-41 JACK
(SMALL
TYPE)
J7902 1-691-737-42 JACK
(SMALL
TYPE)
< COIL >
L2601 1-400-588-11 INDUCTOR
10uH
L2602 1-400-588-11 INDUCTOR
10uH
L2603 1-400-588-11 INDUCTOR
10uH
L7501 1-400-588-11 INDUCTOR
10uH
< RESISTOR >
R2605 1-208-703-11 METAL
CHIP
6.8K
0.5% 1/16W
R2606 1-208-703-11 METAL
CHIP
6.8K
0.5% 1/16W
R2607 1-218-933-11 METAL
CHIP
22
5%
1/16W
R2608 1-218-933-11 METAL
CHIP
22
5%
1/16W
R2609 1-218-978-11 METAL
CHIP
120K
5%
1/16W
R2610 1-218-978-11 METAL
CHIP
120K
5%
1/16W
R7508 1-218-982-11 METAL
CHIP
270K
5%
1/16W
R7509 1-218-982-11 METAL
CHIP
270K
5%
1/16W
R7510 1-208-699-11 METAL
CHIP
4.7K
0.5% 1/16W
R7511 1-208-699-11 METAL
CHIP
4.7K
0.5% 1/16W
R7512 1-208-911-11 METAL
CHIP
10K
0.5% 1/16W
R7513 1-208-911-11 METAL
CHIP
10K
0.5% 1/16W
R7514 1-218-985-11 METAL
CHIP
470K
5%
1/16W
R7515 1-218-985-11 METAL
CHIP
470K
5%
1/16W
R7903 1-208-693-11 METAL
CHIP
2.7K
0.5% 1/16W
R7905 1-218-953-11 METAL
CHIP
1K
5%
1/16W
R7906 1-218-945-11 METAL
CHIP
220
5%
1/16W
R7907 1-218-944-11 METAL
CHIP
180
5%
1/16W
R7917 1-218-963-11 METAL
CHIP
6.8K
5%
1/16W
< COMPOSITION CIRCUIT BLOCK >
RB2601 1-234-378-21
RES, NETWORK 10K (1005X4)
RB7902 1-234-372-11
RES, NETWORK 100 (1005X4)
< SWITCH >
S7901 1-798-119-11 SWITCH,
TACTILE
< SENSOR >
SE7501 1-487-653-11
SENSOR, ANGULAR VELOCITY (PITCH/YAW)
< VARISTOR >
VD7901 1-802-090-21 VARISTOR,
CHIP
VD7904 1-802-090-21 VARISTOR,
CHIP
VD7907 1-802-090-21 VARISTOR,
CHIP
A-1913-127-A MM-103 BOARD, COMPLETE (TD30/TD30E)
A-1913-148-A MM-103 BOARD, COMPLETE (SERVICE)
(TD30V/TD30VE)
*******************************
(IC8101 is not supplied, but this is included in MM-103 COMPLETE BOARD
(SERVICE).)
(SERVICE).)
< CAPACITOR >
C8001 1-114-582-91 CERAMIC
CHIP 0.1uF
10% 16V
C8002 1-114-582-91 CERAMIC
CHIP 0.1uF
10% 16V
C8101 1-100-539-91 TANTAL.
CHIP 47uF
20% 6.3V
(TD30V/TD30VE)
C8102 1-114-582-91 CERAMIC
CHIP 0.1uF
10% 16V
(TD30V/TD30VE)
C8103 1-114-582-91 CERAMIC
CHIP 0.1uF
10% 16V
(TD30V/TD30VE)
C8105 1-114-582-91 CERAMIC
CHIP 0.1uF
10% 16V
(TD30V/TD30VE)
< CONNECTOR >
CN8001 1-843-088-23 CARD
CONNECTOR
* CN8002 1-821-501-11
CONNECTOR, FPC (ZIF) 51P
< DIODE >
D8001
6-501-216-01
DIODE CL-271HR-C-TS
< FERRITE BEAD >
FB8001 1-400-723-11
INDUCTOR, FERRITE BEAD (1005)
< IC >
IC8101 (Not supplied) IC KLM4G1FE3A-M001T03 (TD30V/TD30VE)
< COIL >
L8101 1-469-557-21 INDUCTOR
22uH
(TD30V/TD30VE)
< RESISTOR >
R8041 1-218-961-11 METAL
CHIP
4.7K
5%
1/16W
R8048 1-218-937-11 METAL
CHIP
47
5%
1/16W
R8049 1-218-937-11 METAL
CHIP
47
5%
1/16W
R8050 1-218-937-11 METAL
CHIP
47
5%
1/16W
R8051 1-218-937-11 METAL
CHIP
47
5%
1/16W
R8052 1-218-953-11 METAL
CHIP
1K
5%
1/16W
R8101
1-218-990-81
SHORT CHIP
0 (TD30V/TD30VE)
< COMPOSITION CIRCUIT BLOCK >
* RB8005 1-234-723-21
RES, NETWORK 75 (1005X4)
RB8007 1-234-372-11
RES, NETWORK 100 (1005X4)
RB8008 1-234-372-11
RES, NETWORK 100 (1005X4)
A-1865-650-A PD-460 BOARD, COMPLETE (TD30V/TD30VE)
A-1865-651-A PD-460 BOARD, COMPLETE (TD30/TD30E)
**********************
< CAPACITOR >
C6002 1-165-989-11 CERAMIC
CHIP 10uF
10% 6.3V
C6003 1-165-989-11 CERAMIC
CHIP 10uF
10% 6.3V
C6004 1-114-582-91 CERAMIC
CHIP 0.1uF
10% 16V
C6005 1-114-582-91 CERAMIC
CHIP 0.1uF
10% 16V
C6007 1-112-298-91 CERAMIC
CHIP 1uF
10% 16V
C6008 1-112-298-91 CERAMIC
CHIP 1uF
10% 16V
C6009 1-112-298-91 CERAMIC
CHIP 1uF
10% 16V
C6010 1-112-298-91 CERAMIC
CHIP 1uF
10% 16V
C6011 1-112-298-91 CERAMIC
CHIP 1uF
10% 16V
C6012 1-112-298-91 CERAMIC
CHIP 1uF
10% 16V
C6013 1-112-298-91 CERAMIC
CHIP 1uF
10% 16V
C6014 1-112-300-91 CERAMIC
CHIP 4.7uF
10% 10V
C6015 1-112-300-91 CERAMIC
CHIP 4.7uF
10% 10V
C6016 1-112-300-91 CERAMIC
CHIP 4.7uF
10% 10V
C6017 1-112-300-91 CERAMIC
CHIP 4.7uF
10% 10V
C6018 1-125-889-11 CERAMIC
CHIP 2.2uF
10% 10V
C6019 1-125-889-11 CERAMIC
CHIP 2.2uF
10% 10V
* C6020 1-112-746-11 CERAMIC CHIP 4.7uF
10%
6.3V
C6022 1-114-582-91 CERAMIC
CHIP 0.1uF
10% 16V
C6031 1-112-717-91 CERAMIC
CHIP 1uF
10% 6.3V
(TD30V/TD30VE)
C6032 1-112-717-91 CERAMIC
CHIP 1uF
10% 6.3V
(TD30V/TD30VE)
C6033 1-164-856-81 CERAMIC
CHIP 18PF
5%
50V
(TD30V/TD30VE)
C6034 1-164-856-81 CERAMIC
CHIP 18PF
5%
50V
(TD30V/TD30VE)
C6035 1-164-856-81 CERAMIC
CHIP 18PF
5%
50V
(TD30V/TD30VE)
C6036 1-164-856-81 CERAMIC
CHIP 18PF
5%
50V
(TD30V/TD30VE)
C6102 1-114-582-91 CERAMIC
CHIP 0.1uF
10% 16V
< CONNECTOR >
CN6002 1-778-506-21
PIN, CONNECTOR (PC BOARD) 2P
CN6003 1-778-506-21
PIN, CONNECTOR (PC BOARD) 2P
CN6004 1-816-655-61
CONNECTOR, FFC/FPC 8P (TD30V/TD30VE)
* CN6005 1-822-910-11
CONNECTOR, FPC (LIF (NON-ZIF))
* CN6006 1-842-522-21
CONNECTOR, FPC (ZIF) 61P
CN6007 1-821-500-11
CONNECTOR, FPC (ZIF) 45P
< DIODE >
D6001
6-502-934-01
DIODE DB2S31100K8
D6002
6-502-934-01
DIODE DB2S31100K8
< IC >
IC6001 6-715-211-01
IC MM3404A28URE (TD30V/TD30VE)
* IC6101 6-712-051-01
IC SN65LVDS302ZQER
< RESISTOR >
R6009 1-218-949-11 METAL
CHIP
470
5%
1/16W
R6010 1-218-949-11 METAL
CHIP
470
5%
1/16W
< SENSOR >
* SE6003 1-487-118-11 GMR SENSOR
A-1865-654-A ST-266 BOARD, COMPLETE
**********************
< CAPACITOR >
C7202 1-165-989-11 CERAMIC
CHIP 10uF
10% 6.3V
C7204 1-164-933-11 CERAMIC
CHIP 220PF
10% 50V
C7205 1-165-989-11 CERAMIC
CHIP 10uF
10% 6.3V
C7206 1-100-567-81 CERAMIC
CHIP 0.01uF 10% 25V
C7208 1-100-672-11 CERAMIC
CHIP 10uF
20% 16V
< CONNECTOR >
* CN7201 1-822-378-11
CONNECTOR, FPC (ZIF) 33P
* CN7202 1-816-644-51
FFC/CONNECTOR, FPC (LIF) 12P
* CN7203 1-816-649-51
FFC/FPC CONNECTOR (LIF) 22P
< IC >
IC7201 6-716-796-01
IC TPS61305YFFR
< COIL >
L7201 1-481-074-21 INDUCTOR
2.2uH
< RESISTOR >
R7204 1-218-965-11 METAL
CHIP
10K
5%
1/16W
R7206 1-218-965-11 METAL
CHIP
10K
5%
1/16W
* R7212 1-250-479-11 METAL CHIP
220
1%
1/16W
* R7213 1-250-479-11 METAL CHIP
220
1%
1/16W
A-1913-125-A VC-655 BOARD, COMPLETE (SERVICE)
*******************************
(IC1301 and IC1601 are not supplied, but they are included in VC-655 COMPLETE
BOARD (SERVICE).)
BOARD (SERVICE).)
< CAPACITOR >
* C1001 1-112-746-11 CERAMIC CHIP 4.7uF
10%
6.3V
C1003 1-137-988-91 CERAMIC
CHIP 1uF
10% 35V
C1005 1-164-856-81 CERAMIC
CHIP 18PF
5%
50V
C1006 1-164-856-81 CERAMIC
CHIP 18PF
5%
50V
C1007 1-164-856-81 CERAMIC
CHIP 18PF
5%
50V
C1008 1-164-856-81 CERAMIC
CHIP 18PF
5%
50V
C1013 1-164-937-11 CERAMIC
CHIP 0.001uF 10% 50V
C1014 1-164-937-11 CERAMIC
CHIP 0.001uF 10% 50V
C1015 1-114-582-91 CERAMIC
CHIP 0.1uF
10% 16V
C1301 1-165-989-11 CERAMIC
CHIP 10uF
10% 6.3V
C1302 1-100-743-91 CERAMIC
CHIP 2.2uF
20% 16V
JK-404
MM-103
PD-460
ST-266
VC-655
