Read Sony HDR-AX2000 / HDR-AX2000E Service Manual online
HDR-AX2000/AX2000E_L3
2-1
Ref. No.
Part No.
Description
Ref. No.
Part No.
Description
A-1566-526-A DEVICE (SERVICE), PRISM
(Not supplied) CM-097 BOARD, COMPLETE
**********************
(CM-097 complete board and all mounted parts (including IC3001 (CMOS
IMAGER)) are not supplied, but they are included in PRISM DEVICE (SERVICE).)
IMAGER)) are not supplied, but they are included in PRISM DEVICE (SERVICE).)
^
A-1566-526-A DEVICE (SERVICE), PRISM
(Not supplied) CM-104 BOARD, COMPLETE
**********************
(CM-104 complete board and all mounted parts (including IC5001 (CMOS
IMAGER)) are not supplied, but they are included in PRISM DEVICE (SERVICE).)
IMAGER)) are not supplied, but they are included in PRISM DEVICE (SERVICE).)
^
A-1752-128-A PD-395 BOARD, COMPLETE
**********************
<
CAPACITOR
>
C2001 1-100-581-81 CERAMIC
CHIP
0.0047uF 10% 50V
C2002 1-100-581-81 CERAMIC
CHIP
0.0047uF 10% 50V
C2003 1-119-750-11 TANTAL.
CHIP
22uF
20% 6.3V
C2004 1-125-777-11 CERAMIC
CHIP
0.1uF 10% 10V
C2005 1-165-875-11 CERAMIC
CHIP
10uF
10% 10V
C2006 1-112-300-91 CERAMIC
CHIP
4.7uF 10% 10V
* C2008
1-112-746-11 CERAMIC CHIP
4.7uF
10%
6.3V
C2009 1-125-777-11 CERAMIC
CHIP
0.1uF 10% 10V
C2010 1-112-300-91 CERAMIC
CHIP
4.7uF 10% 10V
C2011 1-165-884-11 CERAMIC
CHIP
2.2uF 10% 6.3V
C2012 1-127-861-11 CERAMIC
CHIP
2.2uF 10% 16V
C2013 1-165-884-11 CERAMIC
CHIP
2.2uF 10% 6.3V
C2014 1-112-300-91 CERAMIC
CHIP
4.7uF 10% 10V
C2015 1-112-300-91 CERAMIC
CHIP
4.7uF 10% 10V
C2016 1-165-908-11 CERAMIC
CHIP
1uF
10% 10V
C2017 1-165-908-11 CERAMIC
CHIP
1uF
10% 10V
C2018 1-125-889-11 CERAMIC
CHIP
2.2uF 10% 10V
C2019 1-165-884-11 CERAMIC
CHIP
2.2uF 10% 6.3V
C2020 1-165-884-11 CERAMIC
CHIP
2.2uF 10% 6.3V
C2021 1-165-884-11 CERAMIC
CHIP
2.2uF 10% 6.3V
C2022 1-165-884-11 CERAMIC
CHIP
2.2uF 10% 6.3V
C2023 1-165-884-11 CERAMIC
CHIP
2.2uF 10% 6.3V
C2024 1-127-861-11 CERAMIC
CHIP
2.2uF 10% 16V
<
CONNECTOR
>
* CN2001 1-821-760-21
CONNECTOR, COAXIAL (RECEPTACLE)
* CN2002 1-794-322-51
FFC/CONNECTOR, FPC (ZIF) 6P
* CN2003 1-794-322-51
FFC/CONNECTOR, FPC (ZIF) 6P
* CN2004 1-818-818-81
CONNECTOR, FPC (ZIF) 29P
* CN2005 1-817-942-81
CONNECTOR, FPC (ZIF) 39P
<
DIODE
>
D2002
8-719-069-29
DIODE RB520S-30FJTE61
D2003
8-719-069-29
DIODE RB520S-30FJTE61
< FERRITE BEAD >
FB2001 1-469-581-21
INDUCTOR, FERRITE BEAD (1005)
<
IC
>
* IC2001
6-712-051-01
IC SN65LVDS302ZQER
< COIL >
* L2001
1-481-425-21 INDUCTOR
10uH
* L2002
1-481-425-21 INDUCTOR
10uH
* L2003
1-481-425-21 INDUCTOR
10uH
<
TRANSISTOR
>
Q2001 8-729-427-37 TRANSISTOR
XP411F-TXE
Q2002 8-729-427-67 TRANSISTOR
XP421F-TXE
< RESISTOR >
R2004 1-218-973-11 METAL
CHIP
47K
5%
1/16W
R2006 1-218-940-11 METAL
CHIP
82
5%
1/16W
R2007 1-218-973-11 METAL
CHIP
47K
5%
1/16W
R2008 1-218-973-11 METAL
CHIP
47K
5%
1/16W
R2009 1-218-973-11 METAL
CHIP
47K
5%
1/16W
R2012 1-218-973-11 METAL
CHIP
47K
5%
1/16W
R2014 1-218-973-11 METAL
CHIP
47K
5%
1/16W
R2015 1-216-833-11 METAL
CHIP
10K
5%
1/10W
R2018 1-216-833-11 METAL
CHIP
10K
5%
1/10W
R2022 1-218-990-81 SHORT
CHIP
0
^
A-1759-075-A VC-582 BOARD, COMPLETE (SERVICE) (AX2000)
A-1759-076-A VC-582 BOARD, COMPLETE (SERVICE) (AX2000E)
**********************
(IC2001 and IC2601 are not supplied, but they are included in VC-582 complete
board (service).)
board (service).)
< CAPACITOR >
C1007 1-112-717-91 CERAMIC
CHIP
1uF
10% 6.3V
C1009 1-127-715-11 CERAMIC
CHIP
0.22uF 10% 16V
C1010 1-165-908-11 CERAMIC
CHIP
1uF
10% 10V
C1011 1-100-567-81 CERAMIC
CHIP
0.01uF 10% 25V
C1012 1-100-567-81 CERAMIC
CHIP
0.01uF 10% 25V
C1013 1-125-777-11 CERAMIC
CHIP
0.1uF 10% 10V
C1214 1-112-717-91 CERAMIC
CHIP
1uF
10% 6.3V
C1215 1-112-717-91 CERAMIC
CHIP
1uF
10% 6.3V
C1216 1-112-717-91 CERAMIC
CHIP
1uF
10% 6.3V
C1217 1-112-717-91 CERAMIC
CHIP
1uF
10% 6.3V
C1218 1-125-777-11 CERAMIC
CHIP
0.1uF 10% 10V
C1219 1-125-777-11 CERAMIC
CHIP
0.1uF 10% 10V
C1220 1-125-777-11 CERAMIC
CHIP
0.1uF 10% 10V
C1221 1-125-777-11 CERAMIC
CHIP
0.1uF 10% 10V
C1222 1-112-717-91 CERAMIC
CHIP
1uF
10% 6.3V
C1223 1-112-717-91 CERAMIC
CHIP
1uF
10% 6.3V
C1224 1-125-777-11 CERAMIC
CHIP
0.1uF 10% 10V
C1225 1-125-777-11 CERAMIC
CHIP
0.1uF 10% 10V
C1401 1-125-777-11 CERAMIC
CHIP
0.1uF 10% 10V
C1402 1-125-777-11 CERAMIC
CHIP
0.1uF 10% 10V
C1403 1-125-777-11 CERAMIC
CHIP
0.1uF 10% 10V
C1404 1-125-777-11 CERAMIC
CHIP
0.1uF 10% 10V
C1405 1-125-777-11 CERAMIC
CHIP
0.1uF 10% 10V
C1406 1-125-777-11 CERAMIC
CHIP
0.1uF 10% 10V
C1407 1-125-777-11 CERAMIC
CHIP
0.1uF 10% 10V
C1408 1-125-777-11 CERAMIC
CHIP
0.1uF 10% 10V
C1409 1-125-777-11 CERAMIC
CHIP
0.1uF 10% 10V
C1410 1-125-777-11 CERAMIC
CHIP
0.1uF 10% 10V
PD-395
VC-582
(ENGLISH)
NOTE:
• -XX, -X mean standardized parts, so they may have some
• -XX, -X mean standardized parts, so they may have some
differences from the original one.
• Items marked “*” are not stocked since they are seldom re-
quired for routine service. Some delay should be anticipated
when ordering these items.
when ordering these items.
• The mechanical parts with no reference number in the exploded
views are not supplied.
• Due to standardization, replacements in the parts list may
be different from the parts specified in the diagrams or the
components used on the set.
components used on the set.
• CAPACITORS:
uF:
uF:
μF
• COILS
uH:
uH:
μH
• RESISTORS
All resistors are in ohms.
METAL: metal-film resistor
METAL OXIDE: Metal Oxide-film resistor
F:
All resistors are in ohms.
METAL: metal-film resistor
METAL OXIDE: Metal Oxide-film resistor
F:
nonflammable
• SEMICONDUCTORS
In each case, u:
In each case, u:
μ, for example:
uA...:
μA... , uPA... , μPA... ,
uPB...
,
μPB... , uPC... , μPC... ,
uPD...,
μPD...
(JAPANESE)
【使用上の注意】
• ここに記載されている部品は, 補修用部品であるため, 回路
図及びセットに付いている部品と異なる場合があります。
• -XX, -Xは標準化部品のため, セットに付いている部品と異な
る場合があります。
• *印の部品は常備在庫しておりません。
• コンデンサの単位でuFはμFを示します。
• 抵抗の単位Ωは省略してあります。
金 被：金属被膜抵抗。
サンキン：酸化金属被膜抵抗。
• インダクタの単位でuHはμHを示します。
• 半導体の名称でuA..., uPA..., uPB..., uPC..., uPD...等はそれぞれ
• コンデンサの単位でuFはμFを示します。
• 抵抗の単位Ωは省略してあります。
金 被：金属被膜抵抗。
サンキン：酸化金属被膜抵抗。
• インダクタの単位でuHはμHを示します。
• 半導体の名称でuA..., uPA..., uPB..., uPC..., uPD...等はそれぞれ
μA..., μPA..., μPB..., μPC..., μPD...を示します。
The components identified by mark
or dotted line with mark are critical for
safety.
Replace only with part number speci-
fied.
or dotted line with mark are critical for
safety.
Replace only with part number speci-
fied.
Les composants identifiés par une mar-
que sont critiques pour la sécurité.
Ne les remplacer que par une pièce
portant le numéro spécifié.
que sont critiques pour la sécurité.
Ne les remplacer que par une pièce
portant le numéro spécifié.
印の部品，または印付の点線で囲まれた部品は，安
全性を維持するために，重要な部品です。
従って交換時は，必ず指定の部品を使用してください。
全性を維持するために，重要な部品です。
従って交換時は，必ず指定の部品を使用してください。
When indicating parts by reference num-
ber, please include the board name.
ber, please include the board name.
図面番号で部品を指定するときは基板名又はブロック
を併せて指定してください。
を併せて指定してください。
お願い
CM-097
CM-104
2. REPAIR PARTS LIST
Precautions for Replacement of Imager
• If the imager has been replaced, carry out all the adjustments
• If the imager has been replaced, carry out all the adjustments
for the camera section.
• As the imager may be damaged by static electricity from its
structure, handle it carefully like for the MOS IC.
In addition, ensure that the receiver is not covered with dusts
nor exposed to strong light.
イメージャ交換時の注意
・ イメージャを交換した場合は，カメラ部の全調整を行って
ください。
・ イメージャは構造上，静電気により破壊される恐れがある
ため，MOS ICと同様に注意して取り扱ってください。
また，受光部にはゴミの付着，および強い光がはいること
のないように注意してください。
2-2. ELECTRICAL PARTS LIST
Click on the first or last page to see other HDR-AX2000 / HDR-AX2000E service manuals if exist.