AVD-C700ES - Sony DVD Service Manual (repair manual). Page 3

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AVD-C700ES
Notes on Chip Component Replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270˚C during
repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous ra-
diation exposure.
Unleaded solder
Boards requiring use of unleaded solder are printed with the lead
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher than
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to about
350 °C.
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscou-s (sticky, less prone to flow) than
ordinary solder so use caution not to let solder bridges occur such
as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may also
be added to ordinary solder.
NOTES  ON  HANDLING  THE  OPTICAL  PICK-UP
BLOCK  OR  BASE  UNIT
The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
DISC TRAY LOCK
The disc tray lock function for the antitheft of an demonstration
disc in the store is equipped.
Releasing Procedure:
1. Press two buttons of 
[FUNCTION   ]
 and  
[        PREV]
simultaneously.
2. The message “UNLOCKED” is displayed and the tray is
unlocked.
Note: When “LOCKED” is displayed, the tray lock is not released
by turning power on/off with the 
[POWER]
 button.
.
Ver 1.1
LASER DIODE AND FOCUS SEARCH OPERATION
CHECK
Carry out the “S curve check” in “DVD section adjustment” and
check that the S curve waveforms is output three times.
NOTE OF REPLACING THE MB BOARD
When replacing the MB board, since the adjustment value is not set
up correctly, “Drive Auto Adjustment” can’t be performed.
In this case, initialize Memory in the following procedures.
Procedure:
1. Set the test mode. (See page 20)
2. Press the [2] key of the remote commander, and set the “DRIVE
MANUAL OPERATION”. (See page 23)
3. Press the [6]  key of the remote commander, and set the “2-6,
Memory Check”. (See page 25)
4. Press the [CLEAR] key of the remote commander, and initialize
Memory.
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