XR-CA310, XR-L210 - Sony Car Audio Service Manual (repair manual). Page 2

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• Keep the temperature of the soldering iron around 270 ˚C dur-

ing repairing.

• Do not touch the soldering iron on the same conductor of the

circuit board (within 3 times).

• Be careful not to apply force on the conductor when soldering

or unsoldering.

• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-

aged by heat.

Location of Controls .......................................................

3

Setting the Clock .............................................................

3

Installation .......................................................................

4

Connections .....................................................................

5

2-1. Disassembly Flow ...........................................................

8

2-2. Sub Panel .........................................................................

9

2-3. Mechanism Deck (MG-36SZ11-32) ...............................

9

2-4. MAIN Board ................................................................... 10
2-5. Bracket (MD) .................................................................. 10
2-6. Heat Sink ......................................................................... 11
2-7. Motor (Capstan/Reel) (M901) ........................................ 11
2-8. Head (Play Back) (HP901) ............................................. 12
2-9. Main Belt, Sub Belt (C) .................................................. 13

....................... 14

......................... 14

Tape Deck Section .......................................................... 15
Tuner Section .................................................................. 16

5-1. Note for Printed Wiring Boards and

Schematic Diagrams ....................................................... 19

5-2. Printed Wiring Board  – MAIN Board – ........................ 21
5-3. Schematic Diagram  – MAIN Board (1/2) – .................. 22
5-4. Schematic Diagram  – MAIN Board (2/2) – .................. 23
5-5. Printed Wiring Board  – CONTROL Board – ................ 24
5-6. Schematic Diagram  – CONTROL Board – ................... 25
5-7. IC Pin Function Description ........................................... 26

6-1. General Section ............................................................... 28
6-2. Front Panel Section ......................................................... 29
6-3. Mechanism Deck Section (MG-36SZ11-32) ................. 30

............................... 31