Read Sony XM-SD46X Service Manual online
1
Ver. 1.0 2004. 12
SERVICE MANUAL
US Model
Canadian Model
AEP Model
UK Model
E Model
XM-SD46X
AUDIO POWER SPECIFICATIONS (US MODEL)
POWER OUTPUT AND TOTAL HARMONIC DISTORTION
60 watts per channel minimum continuous average power into
4 ohms, both channels driven from 20 Hz to 20 kHz with no more
than 0.08% total harmonic distortion per Car Audio Ad Hoc
Committee standards.
60 watts per channel minimum continuous average power into
4 ohms, both channels driven from 20 Hz to 20 kHz with no more
than 0.08% total harmonic distortion per Car Audio Ad Hoc
Committee standards.
Other Specifications
Circuit system
OTL (output transformerless) circuit
Pulse power supply
Pulse power supply
Inputs
RCA pin jacks
High level input connector
High level input connector
Outputs
Speaker terminals
Suitable speaker impedance
2 – 8
Ω (stereo)
4 – 8
Ω (when used as a bridging amplifier)
Maximum outputs
Four speakers:
120 W
120 W
× 4 (at 4 Ω)
150 W
× 4 (at 2 Ω)
Three speakers:
120 W
120 W
× 2 + 300 W × 1 (at 4 Ω)
Rated outputs (supply voltage at 14.4 V)
Four speakers:
60 W RMS
60 W RMS
× 4 (20 Hz – 20 kHz,
0.08% THD + N, at 4
Ω)
75 W RMS
× 4 (20 Hz – 20 kHz,
0.1% THD + N, at 2
Ω)
Three speakers:
60 W RMS
60 W RMS
× 2 + 150 W RMS × 1 (20
Hz – 20 kHz, 0.1% THD + N, at 4
Ω)
SN Ratio
97 dBA (Reference 1W into 4
Ω)
Frequency response
5 Hz – 50 kHz ( dB)
Harmonic distortion
0.005% or less (at 1 kHz)
SPECIFICATIONS
Input level adjustment range
0.3 – 6.0 V (RCA pin jacks)
1.2 – 12 V (High level input)
1.2 – 12 V (High level input)
High-pass filter
50 – 300 Hz, –12 dB/oct
Low-pass filter
50 – 300 Hz, –12 dB/oct
Low boost
0 – 10 dB (40 Hz)
Power requirements
12 V DC car battery
(negative ground)
(negative ground)
Power supply voltage
10.5 – 16 V
Current drain
at rated output: 31 A (4
Ω)
Remote input: 1 mA
Dimensions
Approx. 403
× 55 × 277 mm
(w/h/d) (15
7/8
× 2
1/4
× 11 in) not
incl. projecting parts and controls
Mass
Approx. 4.7 kg (10 lb. 6 oz.) not incl.
accessories
accessories
Supplied accessories
Mounting screws (4)
High level input cord (1)
Protection cap (1)
High level input cord (1)
Protection cap (1)
Design and specifications are subject to change without
notice.
notice.
Sony Corporation
e Vehicle Company
Published by Sony Engineering Corporation
9-879-366-01
2004L04-1
© 2004. 12
STEREO POWER AMPLIFIER
+0
–3
2
XM-SD46X
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK
0
OR DOTTED LINE
WITH MARK
0
ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.
ATTENTION AU COMPOSANT AYANT RAPPORT
À LA SÉCURITÉ!!
LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE
0
SUR LES
DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES
SONT CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT.
NE REMPLACER CES COMPOSANTS QUE PAR DES PIÈCES
SONY DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL
OU DANS LES SUPPLÉMENTS PUBLIÉS PAR SONY.
SONT CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT.
NE REMPLACER CES COMPOSANTS QUE PAR DES PIÈCES
SONY DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL
OU DANS LES SUPPLÉMENTS PUBLIÉS PAR SONY.
Notes on Chip Component Replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
• Notice that the minus side of a tantalum capacitor may be
damaged by heat.
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher than
• Unleaded solder melts at a temperature about 40 °C higher than
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if the
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscou-s (sticky, less prone to flow) than
ordinary solder so use caution not to let solder bridges occur
such as on IC pins, etc.
ordinary solder so use caution not to let solder bridges occur
such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
also be added to ordinary solder.
TABLE OF CONTENTS
1. GENERAL
Location and Function of Controls .......................................... 3
Connections ............................................................................. 4
Connections ............................................................................. 4
2. DISASSEMBLY
2-1. Bottom Plate ........................................................................ 6
2-2. Main Board Section ............................................................ 7
2-3. Main Board, Input Level Board .......................................... 7
2-4. LED Board .......................................................................... 8
2-2. Main Board Section ............................................................ 7
2-3. Main Board, Input Level Board .......................................... 7
2-4. LED Board .......................................................................... 8
3. ELECTRICAL ADJUSTMENT
...................................... 9
4. DIAGRAMS
4-1. Block Diagram .................................................................. 11
4-2. Printed Wiring Board –Main Section– .............................. 12
4-3. Schematic Diagram –Main Section (1/2)– ........................ 13
4-4. Schematic Diagram –Main Section (2/2)– ........................ 14
4-5. Printed Wiring Boards –Input Level, LED Section– ......... 15
4-2. Printed Wiring Board –Main Section– .............................. 12
4-3. Schematic Diagram –Main Section (1/2)– ........................ 13
4-4. Schematic Diagram –Main Section (2/2)– ........................ 14
4-5. Printed Wiring Boards –Input Level, LED Section– ......... 15
5. EXPLODED VIEWS
5-1. Heat Sink (Main) Section .................................................. 16
5-2. Main Board Section .......................................................... 17
5-2. Main Board Section .......................................................... 17
6. ELECTRICAL PARTS LIST
........................................ 18
3
XM-SD46X
SECTION 1
GENERAL
This section is extracted
from instruction manual.
from instruction manual.
4
XM-SD46X