XM-PK100D - Sony Car Audio Service Manual (repair manual). Page 2

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XM-PK100D
2
TABLE  OF  CONTENTS
UNLEADED  SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution:  Some printed circuit boards may not come printed with 
the lead free mark due to their particular size)
 : LEAD  FREE  MARK
Unleaded solder has the following characteristics.
•  Unleaded solder melts at a temperature about 40 °C higher 
than ordinary solder.
 
Ordinary soldering irons can be used but the iron tip has to be 
applied to the solder joint for a slightly longer time.
 
Soldering irons using a temperature regulator should be set to 
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if 
the heated tip is applied for too long, so be careful!
• Strong 
viscosity
 
Unleaded solder is more viscous (sticky, less prone to fl ow) 
than ordinary solder so use caution not to let solder bridges 
occur such as on IC pins, etc.
• 
Usable with ordinary solder
 
It is best to use only unleaded solder but unleaded solder may 
also be added to ordinary solder.
CONFIRMING  THE  OPERATION
Please confi rm the car audio unit works even if REM output is not 
connected when you connect this unit with the car audio unit by 
the HIGH LEVEL input.
NOTES  ON  CHIP  COMPONENT  REPLACEMENT
• 
Never reuse a disconnected chip component.
• 
Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
1. 
SERVICING  NOTES
  .............................................   2
2. GENERAL
  ..................................................................   3
3. DISASSEMBLY
3-1. Disassembly 
Flow 
...........................................................   4
3-2. Bottom 
Plate 
...................................................................   4
3-3.  MAIN Board Block ........................................................   5
3-4. ILLUMI 
Board 
................................................................   5
3-5. MAIN 
Board 
...................................................................   5
4. DIAGRAMS
4-1.  Block Diagram  ...............................................................   6
4-2.  Schematic Diagram - MAIN Section (1/2) - ...................   8
4-3.  Schematic Diagram - MAIN Section (2/2) - ...................   9
4-4. Printed 
Wiring 
Board 
- MAIN Board (Component Side) - ................................   10
4-5. Printed 
Wiring 
Board 
- MAIN Board (Conductor Side) - ..................................   11
4-6.  Printed Wiring Board - ILLUMI Board - ........................   12
5. 
EXPLODED  VIEWS
5-1.  Heat Sink (Main) Section ...............................................   13
5-2.  MAIN Board Section ......................................................   14
6. 
ELECTRICAL  PARTS  LIST ............................   15
SECTION  1
SERVICING  NOTES
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