XM-GS100 - Sony Car Audio Service Manual (repair manual). Page 2

NOTES  ON  CHIP  COMPONENT  REPLACEMENT
• 

Never reuse a disconnected chip component.

• 

Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.

  .............................................   2

  ..................................................................   3

3-1. Disassembly 

Flow 

...........................................................   5

3-2.  Bottom Plate Block .........................................................   5
3-3.  MAIN Board Block ........................................................   6
3-4. MAIN 

Board 

...................................................................   6

3-5.  CONTROL Board Block ................................................   7

4-1. Printed 

Wiring 

Board 

- MAIN Board (Component Side) (Suffi x-11) - .............   9

4-2. Printed 

Wiring 

Board 

- MAIN Board (Conductor Side) (Suffi x-11) - ...............   10

4-3. Printed 

Wiring 

Board 

- MAIN Board (Component Side) (Suffi x-12) - .............   11

4-4. Printed 

Wiring 

Board 

- MAIN Board (Conductor Side) (Suffi x-12) - ...............   12

4-5.  Schematic Diagram - MAIN Board (1/2) - .....................   13
4-6.  Schematic Diagram - MAIN Board (2/2) - .....................   14
4-7.  Printed Wiring Boards - CONTROL/LED Boards - .......   15
4-8.  Schematic Diagram - CONTROL/LED Boards - ...........   16

5-1.  Heat Sink (Main) Section ...............................................   17
5-2.  MAIN Board Section ......................................................   18
5-3.  CONTROL Board Section ..............................................   19

ELECTRICAL  PARTS  LIST ............................   20

Accessories are given in the last of the electrical parts list.

UNLEADED  SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution:  Some printed circuit boards may not come printed with 

the lead free mark due to their particular size)

Unleaded solder has the following characteristics.
•  Unleaded solder melts at a temperature about 40 °C higher 

than ordinary solder.

 

Ordinary soldering irons can be used but the iron tip has to be 
applied to the solder joint for a slightly longer time.

 

Soldering irons using a temperature regulator should be set to 
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if 

the heated tip is applied for too long, so be careful!

• Strong 

viscosity

 

Unleaded solder is more viscous (sticky, less prone to fl ow) 
than ordinary solder so use caution not to let solder bridges 
occur such as on IC pins, etc.

• 

Usable with ordinary solder

 

It is best to use only unleaded solder but unleaded solder may 
also be added to ordinary solder.

CONFIRMING  THE  OPERATION
Please confi rm the car audio unit works even if REM output is not 
connected when you connect this unit with the car audio unit by 
the HIGH LEVEL input.

MAIN  BOARD  DISCRIMINATION
In this unit, the MAIN board has been changed in the midway of 
production.
Repair after distinguishing each type unit to doing the repair refer-
ring to the following.