XAV-701HD (serv.man2) - Sony Car Audio Service Manual (repair manual). Page 2

The laser diode in the optical pick-up block may suffer electro-
static break-down because of the potential difference generated by 
the charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also 
use the procedure in the printed matter which is included in the 
repair parts.
The fl exible board is easily damaged and should be handled with 
care.

NOTES  ON  LASER  DIODE  EMISSION  CHECK
The laser beam on this model is concentrated so as to be focused 
on the disc refl ective surface by the objective lens in the optical 
pickup block. Therefore, when checking the laser diode emission, 
observe from more than 30 cm away from the objective lens.

UNLEADED  SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution:  Some printed circuit boards may not come printed with 

the lead free mark due to their particular size)

Unleaded solder has the following characteristics.
•  Unleaded solder melts at a temperature about 40 °C higher 

than ordinary solder.

 

Ordinary soldering irons can be used but the iron tip has to be 
applied to the solder joint for a slightly longer time.

 

Soldering irons using a temperature regulator should be set to 
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if 

the heated tip is applied for too long, so be careful!

• Strong 

viscosity

 

Unleaded solder is more viscous (sticky, less prone to fl ow) 
than ordinary solder so use caution not to let solder bridges 
occur such as on IC pins, etc.

• 

Usable with ordinary solder

 

It is best to use only unleaded solder but unleaded solder may 
also be added to ordinary solder.

NOTE  THE  IC004  AND  IC011  ON  THE  SERVO  BOARD  
REPLACING
IC004 and IC011 on the SERVO board cannot exchange with 
single. When these parts are damaged, exchange the complete 
mounted board.

NOTE  FOR  FLEXIBLE  BOARD  OF  THE  OPTICAL  PICK-UP
When connecting or disconnecting the fl exible board of the opti-
cal pick-up to or from the CN2 of the SERVO board, follow the 
procedure given below.

Note: When soldering the short lands, solder within 5 seconds at the tem-

perature of soldering iron below 300°C.

Disconnection:
1.  Solder two shortland.
2. Disconnect the fl exible board from the CN2 of the SERVO 

board.

Connection:
1. Connect 

the 

fl exible board to the CN2 of the SERVO board.

2.  Unsolder two shortland.

 .............................................  

2

2-1. Disassembly 

Flow 

...........................................................   3

2-2.   SERVO Board-1 ..............................................................   4
2-3.   SERVO Board-2 ..............................................................   5
2-4.   Tension Spring (KF) .......................................................   6
2-5.   Chassis (T, 614) Sub Assy (CHA1) ................................   6
2-6.   Chassis (OP, 614) Complete Assy (OP1) ........................   7

 .........................................  

8

4-1.  Block Diagram - SERVO Section - ................................   9
4-2.  Printed Wiring Boards - SERVO Section - .....................   11
4-3.  Schematic Diagram - SERVO Section (1/2) - .................   12
4-4.  Schematic Diagram - SERVO Section (2/2) - .................   13

 .................................................   18

 ..............................   19