XAV-60, XAV-E60 - Sony Car Audio Service Manual (repair manual). Page 3

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6

3-1.  Disassembly  Flow ...........................................................   12
3-2.  Front Panel Block ...........................................................   12
3-3.  DVD Mechanism Deck (MG-613C-187) .......................   13
3-4.  Chassis 1F Block, Chassis 2F Block ..............................   13
3-5.  AUDIO  Board .................................................................   14
3-6.  VISUAL  Board ...............................................................   14
3-7.  DVD Mechanism Deck Block ........................................   15
3-8.  SERVO  Board .................................................................   15
3-9.  Chassis (T612Z) Sub Assy, SENSOR Board ..................   16
3-10.  Chassis (OP, ZA) Complete Assy ...................................   16

ELECTRICAL  ADJUSTMENTS 

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5-1.  Block Diagram - SERVO Section - ................................   20
5-2.  Block Diagram - AUDIO Section - .................................   21
5-3.  Block Diagram - VIDEO Section - .................................   22
5-4.  Block Diagram - DISPLAY Section - .............................   23
5-5.  Block Diagram 

- PANEL/POWER SUPPLY Section - ............................   24

5-6.  Printed Wiring Boards - SERVO Section - .....................   26
5-7.  Schematic Diagram - SERVO Section (1/3) - .................   27
5-8.  Schematic Diagram - SERVO Section (2/3) - .................   28
5-9.  Schematic Diagram - SERVO Section (3/3) - .................   29
5-10.  Printed Wiring Board - AUDIO Board (Side A) - ..........   30
5-11.  Printed Wiring Board - AUDIO Board (Side B) - ..........   31
5-12.  Schematic Diagram - AUDIO Board (1/4) - ...................   32
5-13.  Schematic Diagram - AUDIO Board (2/4) - ...................   33
5-14.  Schematic Diagram - AUDIO Board (3/4) - ...................   34
5-15.  Schematic Diagram - AUDIO Board (4/4) - ...................   35
5-16.  Printed Wiring Board 

- VISUAL Board (Component Side) - ............................   36

5-17.  Printed Wiring Board 

- VISUAL Board (Conductor Side) - ..............................   37

5-18.  Schematic Diagram - VISUAL Board (1/5) - .................   38
5-19.  Schematic Diagram - VISUAL Board (2/5) - .................   39
5-20.  Schematic Diagram - VISUAL Board (3/5) - .................   40
5-21.  Schematic Diagram - VISUAL Board (4/5) - .................   41
5-22.  Schematic Diagram - VISUAL Board (5/5) - .................   42
5-23.  Printed Wiring Board - KEY Board -..............................   43
5-24.  Schematic Diagram - KEY Board - ................................   43
5-25.  Printed Wiring Board - LCD Board - ..............................   44
5-26.  Schematic Diagram - LCD Board - ................................   45

6-1.  Overall Section ...............................................................   69
6-2.  Front Panel Section .........................................................   70
6-3.  Chassis 2F Section ..........................................................   71
6-4.  Chassis 1F Section ..........................................................   72
6-5.  DVD Mechanism Deck Section (MG-613C-187) ..........   73

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Accessories are given in the last of the electrical parts list.

The laser diode in the optical pick-up block may suffer electro-
static break-down because of the potential difference generated by 
the charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also 
use the procedure in the printed matter which is included in the 
repair parts.
The fl exible board is easily damaged and should be handled with 
care.

NOTES  ON  LASER  DIODE  EMISSION  CHECK
The laser beam on this model is concentrated so as to be focused 
on the disc refl ective surface by the objective lens in the optical 
pickup block. Therefore, when checking the laser diode emission, 
observe from more than 30 cm away from the objective lens.

UNLEADED  SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution:  Some printed circuit boards may not come printed with 

the lead free mark due to their particular size)

NOTE  THE  IC4,  IC11  AND  IC13  ON  THE  SERVO  
BOARD  REPLACING
IC4, IC11 and IC13 on the SERVO board cannot exchange with 
single. When these parts are damaged, exchange the entire mount-
ed board.

NOTE  FOR  REPLACING  THE  COMPLETE  AUDIO  
BOARD
If the complete AUDIO board was replaced, be sure to refer to 
Technical News published separately.

Unleaded solder has the following characteristics.
•  Unleaded solder melts at a temperature about 40 °C higher 

than ordinary solder.

 

Ordinary soldering irons can be used but the iron tip has to be 
applied to the solder joint for a slightly longer time.

 

Soldering irons using a temperature regulator should be set to 
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if 

the heated tip is applied for too long, so be careful!

• 

Strong viscosity

 

Unleaded solder is more viscous (sticky, less prone to fl ow) 
than ordinary solder so use caution not to let solder bridges 
occur such as on IC pins, etc.

• 

Usable with ordinary solder

 

It is best to use only unleaded solder but unleaded solder may 
also be added to ordinary solder.