Read Sony CDX-L490EE Service Manual online
1
Ver 1.0 2003. 07
Model Name Using Similar Mechanism
CDX-L480X
CD Drive Mechanism Type
MG-393XC-121//Q
Optical Pick-up Name
KSS-721A
SERVICE MANUAL
East European Model
CDX-L490EE
FM/AM COMPACT DISC PLAYER
CD player section
Signal-to-noise ratio
90 dB
Frequency response
10 – 20,000 Hz
Wow and flutter
Below measurable limit
Tuner section
FM
Tuning range
FM1/FM2:
87.5 – 108 MHz (at 50 kHz step)
FM3:
65 – 74 MHz (at 30 kHz step)
87.5 – 108 MHz (at 50 kHz step)
FM3:
65 – 74 MHz (at 30 kHz step)
Aerial terminal
External aerial connector
Intermediate frequency 10.7 MHz/450 kHz
Usable sensitivity
Usable sensitivity
9 dBf
Selectivity
75 dB at 400 kHz
Signal-to-noise ratio
67 dB (stereo),
69 dB (mono)
69 dB (mono)
Harmonic distortion at 1 kHz
0.5% (stereo),
0.3% (mono)
0.3% (mono)
Separation
35 dB at 1 kHz
Frequency response
30 – 15,000 Hz
AM
Tuning range
531 – 1,602 kHz
Aerial terminal
External aerial connector
Intermediate frequency 10.7 MHz/450 kHz
Sensitivity
Sensitivity
30 µV
Power amplifier section
Outputs
Speaker outputs
(sure seal connectors)
(sure seal connectors)
Speaker impedance
4 – 8 ohms
Maximum power output 45 W
×
4 (at 4 ohms)
SPECIFICATIONS
General
Outputs
Audio outputs (rear)
Power aerial relay control
terminal
Power aerial relay control
terminal
Inputs
Telephone ATT control
terminal
terminal
Tone controls
Low:
±10 dB at 60 Hz (XPLOD)
Mid:
±10 dB at 1 kHz (XPLOD)
High:
±10 dB at 10 kHz (XPLOD)
±10 dB at 60 Hz (XPLOD)
Mid:
±10 dB at 1 kHz (XPLOD)
High:
±10 dB at 10 kHz (XPLOD)
Power requirements
12 V DC car battery
(negative earth)
(negative earth)
Dimensions
Approx. 178
×
50
×
176 mm
(w/h/d)
Mounting dimension
Approx. 182
×
53
×
161 mm
(w/h/d)
Mass
Approx. 1.2 kg
Supplied accessories
Parts for installation and
connections
Front panel case (1)
connections
Front panel case (1)
Design and specifications are subject to change without
notice.
notice.
• The tuner and CD sections have no adjustments.
Sony Corporation
e Vehicle Company
Published by Sony Engineering Corporation
9-961-056-01
2003G04-1
© 2003. 07
2
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK
0
OR DOTTED LINE
WITH MARK
0
ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.
NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK
OR BASE UNIT
OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostatic
breakdown because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic breakdown and also use
the procedure in the printed matter which is included in the repair
parts.
The flexible board is easily damaged and should be handled with
care.
breakdown because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic breakdown and also use
the procedure in the printed matter which is included in the repair
parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission, ob-
serve from more than 30 cm away from the objective lens.
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission, ob-
serve from more than 30 cm away from the objective lens.
Notes on Chip Component Replacement
•
Never reuse a disconnected chip component.
•
Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
aged by heat.
SERVICE NOTES
This label is located on the bottom of the chassis.
This label is located on the drive unit’s internal chassis.
When replacing the chassis (T.U) of mechanism deck which have
the “CAUTION LABEL” attached, please be sure to put a new
LABEL (OP CAUTION) (3-223-913-01) to the chassis (T.U).
the “CAUTION LABEL” attached, please be sure to put a new
LABEL (OP CAUTION) (3-223-913-01) to the chassis (T.U).
CDX-L490EE
TEST DISCS
This set can playback CD-R and CD-ROM discs. The following
test discs should be used to check the capability:
test discs should be used to check the capability:
CD-R test disc TCD-R082LMT (Part No. J-2502-063-1)
CD-RW test disc TCD-W082L (Part No. J-2502-063-2)
CD-RW test disc TCD-W082L (Part No. J-2502-063-2)
Notes on CD-R/CD-RW discs
• You can play CD-Rs (recordable CDs)/CD-RWs (rewritable CDs)
designed for audio use on this unit.
Look for these marks to distinguish CD-Rs/CD-RWs for audio
use.
Look for these marks to distinguish CD-Rs/CD-RWs for audio
use.
These marks denote that a disc is not for audio use.
• Some CD-Rs/CD-RWs (depending on the equipment used for
its recording or the condition of the disc) may not play on this
unit.
unit.
• You cannot play a CD-R/a CD-RW that is not finalized*.
* A process necessary for a recorded CD-R/CD-RW disc to be
played on the audio CD player.
CAUTION – INVISIBLE LASER RADIATION WHEN OPEN
VIEW DIRECTLY WITH OPTICAL INSTRUMENTS
DO NOT STARE INTO BEAM OR
3
z
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40°C higher than
• Unleaded solder melts at a temperature about 40°C higher than
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350°C.
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350°C.
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscous (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
also be added to ordinary solder.
EXTENSION CABLE AND SERVICE POSITION
When repairing or servicing this set, connect the jig (extension cable)
as shown below.
as shown below.
• Connect the MAIN board (CNP301) and the SERVO board (CN1)
with the extension cable (Part No. J-2502-011-1).
CDX-L490EE
MAIN BOARD
CNP301
CNP301
J-2502-011-1
SERVO BOARD
CN1
CN1
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TABLE OF CONTENTS
1. GENERAL
Location of controls ................................................................. 5
Connections ............................................................................. 6
Connections ............................................................................. 6
2. DISASSEMBLY
2-1. Sub Panel Assy .................................................................... 7
2-2. CD Mechanism Block ......................................................... 8
2-3. Main Board ......................................................................... 8
2-4. Heat Sink ............................................................................. 9
2-5. Chassis (T.U) Assy .............................................................. 9
2-6. Disc in Board .................................................................... 10
2-7. Servo Board ....................................................................... 10
2-8. Shaft Roller Assy .............................................................. 11
2-9. Floating Block Assy .......................................................... 11
2-10. Optical Pick-up Block ....................................................... 12
2-2. CD Mechanism Block ......................................................... 8
2-3. Main Board ......................................................................... 8
2-4. Heat Sink ............................................................................. 9
2-5. Chassis (T.U) Assy .............................................................. 9
2-6. Disc in Board .................................................................... 10
2-7. Servo Board ....................................................................... 10
2-8. Shaft Roller Assy .............................................................. 11
2-9. Floating Block Assy .......................................................... 11
2-10. Optical Pick-up Block ....................................................... 12
3. DIAGRAMS
3-1. IC Pin Description ............................................................. 13
3-2. Block Diagram –CD Section– ........................................... 14
3-3. Block Diagram –Tuner Section– ....................................... 15
3-4. Block Diagram –Display Section– .................................... 16
3-5. Circuit Boards Location .................................................... 17
3-6. Printed Wiring Boards –CD Mechanism Section– ............ 18
3-7. Schematic Diagram –CD Mechanism Section– ................ 20
3-8. Printed Wiring Board –Main Section– .............................. 21
3-9. Schematic Diagram –Main Section (1/2)– ........................ 22
3-10. Schematic Diagram –Main Section (2/2)– ........................ 23
3-11. Printed Wiring Board –Key Section– ................................ 24
3-12. Schematic Diagram –Key Section– ................................... 25
3-13. IC Block Diagrams ............................................................ 26
3-2. Block Diagram –CD Section– ........................................... 14
3-3. Block Diagram –Tuner Section– ....................................... 15
3-4. Block Diagram –Display Section– .................................... 16
3-5. Circuit Boards Location .................................................... 17
3-6. Printed Wiring Boards –CD Mechanism Section– ............ 18
3-7. Schematic Diagram –CD Mechanism Section– ................ 20
3-8. Printed Wiring Board –Main Section– .............................. 21
3-9. Schematic Diagram –Main Section (1/2)– ........................ 22
3-10. Schematic Diagram –Main Section (2/2)– ........................ 23
3-11. Printed Wiring Board –Key Section– ................................ 24
3-12. Schematic Diagram –Key Section– ................................... 25
3-13. IC Block Diagrams ............................................................ 26
4. EXPLODED VIEWS
4-1. Chassis Section ................................................................. 29
4-2. Front Panel Section ........................................................... 30
4-3. CD Mechanism Section (1) ............................................... 31
4-4. CD Mechanism Section (2) ............................................... 32
4-5. CD Mechanism Section (3) ............................................... 33
4-2. Front Panel Section ........................................................... 30
4-3. CD Mechanism Section (1) ............................................... 31
4-4. CD Mechanism Section (2) ............................................... 32
4-5. CD Mechanism Section (3) ............................................... 33
5. ELECTRICAL PARTS LIST
........................................ 34
CDX-L490EE