CX-LEMV300, XR-EMV300 - Sony Car Audio Service Manual (repair manual)

E Model

2003H1678-1

© 2003.08

CX-LEMV300 is the Amplifier, CD player, Tape
Deck and Tuner section in XR-EMV300.

CD

Model Name Using Similar Mechanism

NEW

Section

Base Unit Name

BU-30DBD61S

Optical Pick-up Name

A-MAX. D

TAPE

Model Name Using Similar Mechanism

NEW

Section

Tape Transport Mechanism Type

CMAL5Z220A

FM tuning range

87.5 MHz to 108 MHz

FM usable sensitivity (IHF)

16.8 dBf

FM antenna terminal

75 

Ω (unbalanced)

AM tuning range

531 kHz to 1602 kHz (9 kHz step)
530 kHz to 1710 kHz (10 kHz)

AM usable sensitivity

350 

µV/m

AM antenna

Loop antenna

Power output

Rated: 12 W + 12 W(1 kHz, T.H.D.
1 %, 6 

Ω)

Reference: 15 W + 15 W(1 kHz,
T.H.D. 10 %, 6 

Ω)

Inputs

AUX IN: 800 mV
MIC: 1.0 mV (10 k

Ω)

Outputs

SPEAKER: 6 

Ω or more

PHONES: 32 

Ω or more

Track format

4 tracks, 2 channels stereo

Frequency response

100 Hz – 10000 Hz

Recording system

AC bias

Heads

Recording/playback 

× 1, erase × 1

Power requirements

110 V-120 V/220 V-240 V
AC (Switchable), 50/60 Hz

Power consumption

50 W

Power consumption in standby mode

with ECO mode on: 0.3 W
with ECO mode off: 10 W

Dimensions (w/h/d)

Approx. 163 

× 230.5 × 243 mm

Mass

Approx. 3.6 kg

Supplied accessories:

FM antenna (1)
AM antenna (1)
Remote commander (1)
Video connecting cord (1)
Batteries (2)

Specifications and external appearance are subject to change
without notice.

Laser

Semiconductor laser (

λ = 780 nm)

Emission duration: continuous

D/A converter

1 bit dual

Signal-to-noise ratio

95 dB (1 kHz, 0 dB)

Wow and flutter

Unmeasurable

Video data

MPEG 1

Audio data

MPEG 1, Layer 2 (VCD)
MPEG 1, Layer 3 (MP3-CD)

2

·········································································· 5

2-1. REAR CABINET ·························································· 7
2-2. CD CABINET SECTION,

FRONT PANEL SECTION ··········································· 8

2-3. CD MECHANISM DECK (BU-30DBD61S) ··············· 8
2-4. MIC/ECHO BOARD, VCD BOARD ··························· 9
2-5. TAPE MECHANISM DECK (CMAL5Z220A) ··········· 9
2-6. FRONT BOARD ························································· 10
2-7. HOLDER CASSETTE ASSY, MIC JACK BOARD ·· 10
2-8. POWER BOARD, MAIN BOARD ····························· 11
2-9. BD BOARD, OPTICAL PICK-UP (A-MAX.D) ········ 11

···································································· 12

····························· 13

······························· 14

······································································ 17

6-1. BLOCK DIAGRAM  – BD SECTION – ···················· 19
6-2. BLOCK DIAGRAM  – VCD SECTION – ················· 20
6-3. BLOCK DIAGRAM  – MAIN SECTION – ··············· 21
6-4. PRINTED WIRING BOARD  – BD BOARD – ········· 22
6-5. SCHEMATIC DIAGRAM  – BD BOARD – ·············· 23
6-6. PRINTED WIRING BOARD  – VCD BOARD – ······ 24
6-7. SCHEMATIC DIAGRAM  – VCD BOARD (1/2) – ·· 25
6-8. SCHEMATIC DIAGRAM  – VCD BOARD (2/2) – ·· 26
6-9. PRINTED WIRING BOARD  – MAIN BOARD – ···· 27
6-10. SCHEMATIC DIAGRAM  – MAIN BOARD (1/2) – 28
6-11. SCHEMATIC DIAGRAM  – MAIN BOARD (2/2) – 29
6-12. PRINTED WIRING BOARD  – FRONT BOARD – ·· 30
6-13. SCHEMATIC DIAGRAM  – FRONT BOARD – ······· 31
6-14. PRINTED WIRING BOARD  – POWER BOARD – · 32
6-15. SCHEMATIC DIAGRAM  – POWER BOARD – ······ 33
6-16. IC BLOCK DIAGRAMS ············································ 34
6-17. IC PIN FUNCTION DESCRIPTION ························· 37

7-1. CABINET SECTION ·················································· 39
7-2. FRONT PANEL SECTION ········································· 40
7-3. CD CABINET SECTION ··········································· 41
7-4. BASE UNIT SECTION (BU-30BDB61S) ················· 42

······································· 43

3

CAUTION

Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous
radiation exposure.

The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.

The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.

Carry out the “S curve check” in “CD section adjustment” and check
that the S curve waveforms is output three times.

• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-

aged by heat.

• Keep the temperature of the soldering iron around 270 ˚C during

repairing.

• Do not touch the soldering iron on the same conductor of the

circuit board (within 3 times).

• Be careful not to apply force on the conductor when soldering or

unsoldering.

Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)

Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40

°C higher than

ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350

°C.

Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!

• Strong viscosity

Unleaded solder is more viscous (sticky, less prone to flow) than
ordinary solder so use caution not to let solder bridges occur such
as on IC pins, etc.

• Usable with ordinary solder

It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.

0

0

ADVERSEL: 

USYNLIG LASERSTRÅLING NÅR DEKSEL ÅPNES OG 

SIKKERHEDSLÅS BRYTES. UNNGÅ EKSPONERING FOR STRÅLEN.

CAUTION:

INVISIBLE LASER RADIATION WHEN OPEN AND INTERLOCKS 

DEFEATED. AVOID EXPOSURE TO BEAN.

ADVARSEL:

USYNLIG LASERSTRÅLING VED ÅBNING NÅR 

SIKKERHEDSAFBRYDERE ER UDE AF FUNKTION. UNDGÅ UDSAETTELSE FOR 
STRÅLING.

VORSICHT:

UNSICHTBARE LASERSTRAHLUNG. WENN ABDECKUNG GEÖFFNET 

UND SICHEREITSVERRIEGELUNG ÜBERBRÜCKT. NICHT DEM STRAHL 
AUSSETZENSTRÅLING.    

VARO!: 

AVATTAESSA JA SUOJALUKITUS OHITETTAESSA OLET ALT-TIINA 

NÄKYMÄTTÖMÄLLE LASERSÄTEILYLLE. ÄLÄ KÄTSO SÄTEESEEN.

VARNING: 

OSYNLIG LASERSTRÅLING NÄR DENNA DEL ÄR ÖPPNAD OCH 

SPÄRREN ÄR URKOPPLAD. BETRAKTA EJ STRÅLEN.

VIGYÁZAT!: 

A BURKOLAT NYITÁSAKOR LÁTHATATLAN LÉZERSU-GÁRVESZÉLY! 

KERÜLJE A BESUGÁRZÁST!

To prevent fire or shock hazard, do not expose the
unit to rain or moisture.
To avoid electrical shock, do not open the cabinet.
Refer servicing to qualified personnel only.

Do not install the appliance in a confined space, such as
a bookcase or built-in cabinet.

CLASS 1 LASER PRODUCT

LUOKAN 1 LASER LAITE

KLASS 1 LASER APPARAT

This appliance is classified
as a CLASS 1 LASER
product.

This label is located on the
exterior.

To prevent fire, do not cover the ventilation of the apparatus
with newspapers, table-cloths, curtains, etc. And do not
place lighted candles on the apparatus.

To prevent fire or shock hazard, do not place objects filled
with liquids, such as vases, on the apparatus.

4

BD board

MAIN board

MAIN board

POWER board

FRONT board