CDX-GT56UI - Sony Car Audio Service Manual (repair manual). Page 2

NOTES  ON  CHIP  COMPONENT  REPLACEMENT
• 

Never reuse a disconnected chip component.

• 

Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.

The laser diode in the optical pick-up block may suffer electro-
static break-down because of the potential difference generated by 
the charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also 
use the procedure in the printed matter which is included in the 
repair parts.
The fl exible board is easily damaged and should be handled with 
care.

NOTES  ON  LASER  DIODE  EMISSION  CHECK
The laser beam on this model is concentrated so as to be focused 
on the disc refl ective surface by the objective lens in the optical 
pickup block. Therefore, when checking the laser diode emission, 
observe from more than 30 cm away from the objective lens.

CAUTION
Use of controls or adjustments or performance of procedures 
other than those specifi ed herein may result in hazardous radia-
tion exposure.

If the optical pick-up block is defective, please replace the whole 
optical pick-up block.
Never turn the semi-fi xed resistor located at the side of optical 
pick-up block.

TEST  DISCS
Use following TEST DISC when this set confi rms the operation 
and checks it.

Part No.

   

Description

3-702-101-01 

DISC (YEDS-18), TEST (for CD)

4-225-203-01 

DISC (PATD-012), TEST (for CD)

0  OR  DOTTED  LINE  

0  ON  THE  SCHEMATIC  DIAGRAMS  AND  IN  

0  SUR  

 ......................................................  

2

 Connections 

....................................................................  

7

3-1.   Sub Panel Assy  ...............................................................   9
3-2.   CD Mechanism Block .....................................................   10
3-3.   Main Board .....................................................................   10
3-4. Servo 

Board 

....................................................................  11

3-5.  Chassis (T) Sub Assy ......................................................   12
3-6.  Roller Arm Assy ..............................................................   12
3-7. Chassis 

(OP) 

Assy 

...........................................................  13

3-8.  Chucking Arm Sub Assy .................................................   13
3-9. Sled 

Motor 

Assy 

..............................................................  14

3-10.  Optical Pick-up Section ..................................................   15
3-11. Optical Pick-up ...............................................................   15

4-1.  Block Diagram –Main Section– .....................................   17
4-2.  Block Diagram –Display Section– .................................   18
4-3.  Printed Wiring Board –Main Section (1/2)– ...................   20
4-4.  Printed Wiring Boards –Main Section (2/2)– .................   21
4-5.  Schematic Diagram –Main Section (1/5)– ......................   22
4-6.  Schematic Diagram –Main Section (2/5)– ......................   23
4-7.  Schematic Diagram –Main Section (3/5)– ......................   24
4-8.  Schematic Diagram –Main Section (4/5)– ......................   25
4-9.  Schematic Diagram –Main Section (5/5)– ......................   26
4-10.  Printed Wiring Board –Key Section– .............................   27
4-11.  Schematic Diagram –Key Section– ................................   28

5-1. Main 

Section 

...................................................................  39

5-2.  Front Panel Section .........................................................   40
5-3.  CD Mechanism Section (MG-101CA-188) ....................   41

 ..................................   42