XDR-S10DAB - Sony Audio Service Manual (repair manual). Page 2

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XDR-S10DAB
2
Notes on chip component replacement
  •  Never reuse a disconnected chip component.
  •  Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
SAFETY-RELATED COMPONET WARNING!
COMPONENTS  IDENTIFIED  BY  MARK 0 OR  DOTTED  LINE  
WITH  MARK 
0 ON  THE  SCHEMATIC  DIAGRAMS  AND  IN  
THE  PARTS  LIST  ARE  CRITICAL  TO  SAFE  OPERATION.
REPLACE  THESE  COMPONENTS  WITH  SONY  PARTS 
 
WHOSE  PART  NUMBERS  APPEAR  AS  SHOWN  IN  THIS  
MANUAL  OR  IN  SUPPLEMENTS  PUBLISHED  BY  SONY.
SECTION  1
SERVICING  NOTES
UNLEADED  SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with 
the lead free mark due to their particular size)
 : LEAD  FREE  MARK
Unleaded solder has the following characteristics.
•   Unleaded solder melts at a temperature about 40 °C higher 
than ordinary solder.
    Ordinary soldering irons can be used but the iron tip has to be 
applied to the solder joint for a slightly longer time.
    Soldering irons using a temperature regulator should be set to 
about 350 °C.
Caution:  The printed pattern (copper foil) may peel away if the 
heated tip is applied for too long, so be careful!
•    Strong viscosity
    Unleaded solder is more viscou-s (sticky, less prone to fl ow) 
than ordinary solder so use caution not to let solder bridges 
occur such as on IC pins, etc.
•    Usable with ordinary solder
    It is best to use only unleaded solder but unleaded solder may 
also be added to ordinary solder.
NOTE  THE  CN1  ON  THE  MAIN  BOARD  REPLACING
CN1 cannot exchanged with single. When CN1 is damaged, ex-
change the entire mounted board.
Note on the AC power adaptor
Use the supplied Sony AC power adaptor only. The polarity of the plugs of other manufacturers may be different.
Failure to use the supplied AC power adaptor may cause the unit to malfunction.
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