TA-A1ES - Sony Audio Service Manual (repair manual)

2013J33-1

© 

2013.10

POWER OUTPUT AND TOTAL HARMONIC DISTORTION:
With 8 ohm loads, both channels driven, from 20 - 20,000 Hz; rated 
80 watts per channel minimum RMS power, with no more than 0.09 % 
total harmonic distortion from 250 milliwatts to rated output.

80 W + 80 W
20 Hz to 20 kHz  0.15 % 8 ohms

* Measured under the following conditions:

Power requirements: 120 V AC, 60 Hz

4 ohms or higher

0.008 %
1 kHz  10 W  8 ohms

10 Hz to 100 kHz ±3 dB (8 ohms)

Sensitivity: 150 mV
Impedance: 47 kohms
S/N ratio: 96 dB (Input short, A, 20 kHz LPF)

Impedance: 20 kohms / 20 kohms
S/N ratio: 96 dB (Input short, A, 20 kHz LPF)

LOW: from 8 ohms to less than 50 ohms
MID: from 50 ohms to less than 300 ohms (+10 dB against LOW)
HI: 300 ohms or higher (+16 dB against LOW)

0.1 % or less
20 Hz to 20 kHz
LOW (8 ohms load impedance) 500 mW + 500 mW
MID (150 ohms load impedance) 500 mW + 500 mW
HI (300 ohms load impedance) 250 mW + 250 mW

10 Hz to 100 kHz +0.5/–3 dB (at LOW mode 8 ohms load impedance)

Power requirements

120 V AC, 60 Hz (US and Canadian models)
230 V AC, 50 Hz/60 Hz (AEP and UK models)

Power consumption

300 W

Power consumption (during standby mode)

0.4 W

Dimensions (Approx.)

430 mm × 130 mm × 420 mm (17 in × 5 1/8 in × 16 5/8 in) (w/h/d), 
including projecting parts and controls

Mass (Approx.)

18.0 kg (39 lb  11 oz)

Supplied accessories

AC power cord (mains lead) (1)
Remote control RM-AAU181 (1)
R03 (size AAA) batteries (2)
Operating Instructions (1)

Design and specifications are subject to change without notice.

80 W + 80 W
20 Hz to 20 kHz  0.09 % 8 ohms

* Measured under the following conditions:

Power requirements: 230 V AC, 50 Hz/60 Hz

SAFETY  CHECK-OUT
After correcting the original service problem, perform the follow-
ing safety check before releasing the set to the customer:
Check the antenna terminals, metal trim, “metallized” knobs, 
screws, and all other exposed metal parts for AC leakage.
Check leakage as described below.

LEAKAGE  TEST
The AC leakage from any exposed metal part to earth ground and 
from all exposed metal parts to any exposed metal part having a 
return to chassis, must not exceed 0.5 mA (500 microamperes.). 
Leakage current can be measured by any one of three methods.
1.  A commercial leakage tester, such as the Simpson 229 or RCA 

WT-540A. Follow the manufacturers’ instructions to use these 
instruments.

2.  A battery-operated AC milliammeter. The Data Precision 245 

digital multimeter is suitable for this job.

3.  Measuring the voltage drop across a resistor by means of a 

VOM or battery-operated AC voltmeter. The “limit” indication 
is 0.75 V, so analog meters must have an accurate low-voltage 
scale. The Simpson 250 and Sanwa SH-63Trd are examples 
of a passive VOM that is suitable. Nearly all battery operated 
digital multimeters that have a 2 V AC range are suitable. (See 
Fig. A)

NOTES  ON  CHIP  COMPONENT  REPLACEMENT
•  Never reuse a disconnected chip component.
•  Notice that the minus side of a tantalum capacitor may be dam-

aged by heat.

COMPONENTS  IDENTIFIED  BY  MARK  0  OR  DOTTED  LINE  
WITH  MARK  0  ON  THE  SCHEMATIC  DIAGRAMS  AND  IN  
THE  PARTS  LIST  ARE  CRITICAL  TO  SAFE  OPERATION.
REPLACE  THESE  COMPONENTS  WITH  SONY  PARTS 

LES  COMPOSANTS  IDENTIFIÉS  PAR  UNE  MARQUE  0  SUR  
LES  DIAGRAMMES  SCHÉMATIQUES  ET  LA  LISTE  DES  
PIÈCES  SONT  CRITIQUES  POUR  LA  SÉCURITÉ  DE  FONC-
TIONNEMENT.  NE  REMPLACER  CES  COMPOSANTS  QUE  
PAR  DES  PIÈCES  SONY  DONT  LES  NUMÉROS  SONT  DON-
NÉS  DANS  CE  MANUEL  OU  DANS  LES  SUPPLÉMENTS  
PUBLIÉS  PAR  SONY.

 .............................................   4

2-1. Disassembly 

Flow 

...........................................................   6

2-2. Case 

Top, 

Fuse 

(F160, F161, F162, F163, F164, F165) ..........................   7

2-3.  Case L Block, Case R Block ...........................................   7
2-4.  Front Panel Block ...........................................................   8
2-5.  HP-POW Board Block ....................................................   9
2-6.  HP-AMP Board Block ....................................................   10
2-7. Power 

Transformer 

(T2) 

.................................................  11

2-8. Lug 

Wires 

........................................................................  12

2-9.  4-8 Board Block, Fuse (F101) ........................................   13
2-10.  AC Board Block, Fuse (F1) ............................................   14
2-11. P-REG Board-1 ...............................................................  15
2-12. P-REG Board-2 ...............................................................   16
2-13. Bracket Bridge_INPUT ..................................................   17
2-14. REAR-SW Board ............................................................   18
2-15.  Heat Sink L Assy.............................................................   19
2-16. A-CLASS-L Board .........................................................   20
2-17. POWER-SUPPLY Board ................................................   20
2-18.  Heat Sink R Assy ............................................................   21
2-19. A-CLASS-R Board .........................................................   22
2-20. POWER-SUPPLY-R Board ............................................   22
2-21. INPUT Board ..................................................................   23
2-22.  AC Inlet 2P (AC1) ..........................................................   24

........................  25

4-1.  Block Diagram - INPUT Section - ..................................   26
4-2.  Block Diagram - ELECTRICAL VOLUME Section - ...   27
4-3.  Block Diagram - SPEAKER AMP Section - ..................   28
4-4. Block 

Diagram 

- HEADPHONE AMP/PANEL Section - .......................   29

4-5.  Block Diagram - POWER SUPPLY Section - ................   30
4-6.  Printed Wiring Board - INPUT Board - ..........................   32
4-7.  Schematic Diagram - INPUT Board (1/3) - ....................   33
4-8.  Schematic Diagram - INPUT Board (2/3) - ....................   34
4-9.  Schematic Diagram - INPUT Board (3/3) - ....................   35
4-10.  Schematic Diagram - A-CLASS-L Board - ....................   36
4-11.  Schematic Diagram - A-CLASS-R Board - ....................   37
4-12.  Printed Wiring Boards - A-CLASS Section - .................   38
4-13.  Printed Wiring Boards - BOOT-STRAP Section - ..........   39
4-14. Schematic Diagram 

- BOOT-STRAP-L/TO220 Boards - ...............................   40

4-15. Schematic Diagram 

- BOOT-STRAP-R/TO220 Boards - ...............................   41

4-16.  Printed Wiring Boards - HP Section - .............................   42
4-17.  Schematic Diagram - HP Section - .................................   43
4-18.  Printed Wiring Boards - CONNECTION Section - ........   44
4-19.  Schematic Diagram - CONNECTION Section - ............   44
4-20.  Printed Wiring Board - DISPLAY Board - .....................   45
4-21.  Schematic Diagram - DISPLAY Board (1/2) - ...............   46
4-22.  Schematic Diagram - DISPLAY Board (2/2) - ...............   47
4-23.  Printed Wiring Boards - SWITCH Section - ..................   48
4-24.  Schematic Diagram - SWITCH Section - .......................   49
4-25.  Schematic Diagram - INPUT_LED Board - ...................   50
4-26.  Schematic Diagram - NUMBER_LED Board - .............   51
4-27.  Printed Wiring Boards - LED Section - ..........................   52
4-28.  Printed Wiring Board - HP-POW Board - ......................   52
4-29.  Schematic Diagram - HP-POW Board - .........................   53
4-30.  Printed Wiring Board - P-REG Board - ..........................   54
4-31.  Schematic Diagram - P-REG Board - .............................   55
4-32.  Printed Wiring Boards - POWER SUPPLY Section - ....   56
4-33.  Schematic Diagram - POWER SUPPLY Section - .........   57

5-1. Case 

Top 

Section 

.............................................................  61

5-2.  Case L/R Section ............................................................   62
5-3.  DISPLAY Board Section ................................................   63
5-4.  Front Panel Section .........................................................   64
5-5.  HP-POW Board, HP-AMP Board Section ......................   65
5-6. Power 

Transformer 

Section 

............................................  66

5-7.  4-8 Board Section ...........................................................   67
5-8.  AC Board Section ...........................................................   68
5-9.  P-REG Board Section .....................................................   69
5-10.  REAR-SW Board Section ...............................................   70
5-11.  Heat Sink L Section ........................................................   71
5-12.  POWER-SUPPLY Board Section ...................................   72
5-13.  Heat Sink R Section ........................................................   73
5-14.  INPUT Board Section .....................................................   74
5-15.  Plate Bottom Section ......................................................   75
5-16. Bracket Section ...............................................................   76
5-17. Chassis Section ...............................................................   77

 ..............................   78

Accessories are given in the last of the electrical parts list.

UNLEADED  SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution:  Some printed circuit boards may not come printed with 

the lead free mark due to their particular size)

Unleaded solder has the following characteristics.
•  Unleaded solder melts at a temperature about 40 °C higher 

than ordinary solder.

 

Ordinary soldering irons can be used but the iron tip has to be 
applied to the solder joint for a slightly longer time.

 

Soldering irons using a temperature regulator should be set to 
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if 

the heated tip is applied for too long, so be careful!

• Strong 

viscosity

 

Unleaded solder is more viscous (sticky, less prone to fl ow) 
than ordinary solder so use caution not to let solder bridges 
occur such as on IC pins, etc.

•  Usable with ordinary solder
 

It is best to use only unleaded solder but unleaded solder may 
also be added to ordinary solder.

DESTINATION  IDENTIFICATION
Distinguish by Part No. on the rear side of a main unit.

US and Canadian models

4-467-226-1[]

AEP and UK models

4-467-226-2[]

There is something wrong with the amplifier. It might be because of 
a short circuit of the speaker output, a short circuit of the 
headphones output, or because the ventilation holes on the top of 
the amplifier are blocked. Resolve the problem, then turn on the 
amplifier again.

NOTE  OF  OPERATION  CHECK
When performing the operation, be sure not to remove the wire connected to the Ref No. ET160 (GND) on the P-REG board.