ST-SDB900 - Sony Audio Service Manual (repair manual). Page 2

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ST-SDB900
2
Unleaded solder
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)
 : LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40
°C higher than
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350
°C.
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
TABLE OF CONTENTS
1.
GENERAL
...................................................................
3
2.
TEST MODE
...............................................................
4
3.
DIAGRAMS
3-1.
Block Diagram ................................................................
9
3-2.
Printed Wiring Board – MAIN Board (Side A) – ............ 10
3-3.
Printed Wiring Board – MAIN Board (Side B) – ............ 11
3-4.
Schematic Diagram – MAIN Board (1/3) – .................... 12
3-5.
Schematic Diagram – MAIN Board (2/3) – .................... 13
3-6.
Schematic Diagram – MAIN Board (3/3) – .................... 14
3-7.
Printed Wiring Board
– TRANS, AC SW, JOG, RM Board – ............................ 15
3-8.
Printed Wiring Board – DISPLAY Board – .................... 16
3-9.
Schematic Diagram – DISPLAY Board – ....................... 17
4.
EXPLODED VIEWS
4-1.
Case, Front Panel Section ................................................ 20
4-2.
Chassis Section ................................................................ 21
5.
ELECTRICAL PARTS LIST
.................................. 22
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0  OR DOTTED LINE
WITH MARK 
0 ON THE SCHEMATIC DIAGRAMS AND IN THE
PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE
THESE COMPONENTS WITH SONY PARTS WHOSE PART NUM-
BERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLE-
MENTS PUBLISHED BY SONY.
• Strong viscosity
Unleaded solder is more viscous (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
DAB frequency table
Band-III (174 to 240 MHz)
Frequency
Label
Frequency
Label
174.928MHz
5A
209.936MHz
10A
176.640MHz
5B
211.648MHz
10B
178.352MHz
5C
213.360MHz
10C
180.064MHz
5D
215.072MHz
10D
181.936MHz
6A
216.928MHz
11A
183.648MHz
6B
218.640MHz
11B
185.360MHz
6C
220.352MHz
11C
187.072MHz
6D
222.064MHz
11D
188.928MHz
7A
223.936MHz
12A
190.640MHz
7B
225.648MHz
12B
192.352MHz
7C
227.360MHz
12C
194.064MHz
7D
229.072MHz
12D
195.936MHz
8A
230.784MHz
13A
197.648MHz
8B
232.496MHz
13B
199.360MHz
8C
234.208MHz
13C
201.072MHz
8D
235.776MHz
13D
202.928MHz
9A
237.488MHz
13E
204.640MHz
9B
239.200MHz
13F
206.352MHz
9C
208.064MHz
9D
* This tuner does not support L-Band reception.
Ver 1.1
Note on DAB TUNER MODULE exchange
Since this connector tends to break, be careful of handling.
When exchanging DAB TUNER MODULE and hard to remove 
a cable, please also exchange cables together.
DAB TUNER MODULE
Cable
Main board
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