SCD-XB780 - Sony Audio Service Manual (repair manual). Page 25

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SCD-XB780
25
25
5-6.
NOTE  FOR  PRINTED  WIRING  BOARDS  AND  SCHEMATIC  DIAGRAMS
Note on Printed Wiring Board:
X
: parts extracted from the component side.
Y
: parts extracted from the conductor side.
: Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
Caution:
Pattern face side:
Parts on the pattern face side seen from
(Conductor Side)
the pattern face are indicated.
Parts face side:
Parts on the parts face side seen from
(Component Side)
the parts face are indicated.
• Main board is multi-layer printed board.
However, the patterns of intermediate-layer have not been
included in diagram.
• Indication of transistor
C
B
These are omitted.
E
Q
Note on Schematic Diagram:
• All capacitors are in 
µ
F unless otherwise noted.  pF: 
µµ
F
50 WV or less are not indicated except for electrolytics
and tantalums.
• All resistors are in 
 and 
1
/
4
 
W or less unless otherwise
specified.
f
: internal component.
5
: fusible resistor.
C
: panel designation.
A
: B+ Line.
B
: B– Line.
• Voltages and waveforms are dc with respect to ground
under no-signal conditions.
no mark : SACD PLAY
(
) : CD PLAY
: Impossible to measure
• Voltages are taken with a VOM (Input impedance 10 M
).
Voltage variations may be noted due to normal produc-
tion tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal produc-
tion tolerances.
• Circled numbers refer to waveforms.
• Signal path.
J
: SACD PLAY
c
: CD PLAY (ANALOG)
I
: CD PLAY (DIGITAL OUT)
Note: The components identified by mark 
0
 or dotted line
with mark 
0
 are critical for safety.
Replace only with part number specified.
• Circuit Boards Location
PT board
POWER board
RF board
AUDIO board
MAIN board
DISPLAY board
LOADING board
HP board
POWER SW board
KEY board
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